Abstract: A caulking gun includes is provided, including: a gun body, a cartridge sleeve, two push rods, a driving member, a lever and a switch mechanism. The cartridge sleeve is rotatably connected to the gun body and configured to receive two sealants. The two push rods are movably disposed on the gun body. The driving member is movably disposed on the gun body and drives the two push rods to move. The lever is swingably disposed on the gun body about a pivot center and includes an abutting portion which is abuttable against the driving member. The switch mechanism is disposed between the gun body and the lever and includes a switch member being movable between a first position and a second position.

Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Abstract: A caulking gun is provided, including: a gun body, including a main body, a push mechanism, a driving member movably disposed within the main body and a lever rotatably mounted to the main body to drive the driving member, the push mechanism including a restriction member swingably disposed on the main body and a push rod movably disposed on the main body and disposed through the restriction member; and an adjustment mechanism, mounted to the gun body, being movable to be located in a first position or at least two different other positions; wherein when the adjustment mechanism is located in the first position, the adjustment mechanism contacts the restriction member or the driving member; the adjustment mechanism is distanced by different distances from the restriction member or from the driving member when the adjustment mechanism is located in the at least two different other positions.