Abstract: A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.

Abstract: A heat dissipation device includes a housing and a fan. The housing includes a base and a plurality of fins. The fins are connected to the base and are arranged sequentially along a direction. The plurality of fins each have an opening, and the openings are communicated to form a space. The fan is disposed inside the space and is configured to rotate about an axis parallel to the direction.

Abstract: A heat dissipation device is provided. The heat dissipation device is applied to an electronic device with a first heat source and a second heat source. The heat dissipation device includes a housing, an impeller, a first heat conductive assembly, a second heat conductive assembly and an switch. The housing includes an accommodating space, a first outlet and a second outlet. The first outlet and the second outlet are connected to and through the accommodating space. The impeller is disposed in the accommodating space. The first heat conductive assembly is connected to the first outlet and the first heat source. The second heat conductive assembly is connected to the second outlet and the second heat source. The switch is disposed at the first outlet to open or dose the first outlet.

Abstract: A heat dissipating structure is provided and it covers a printed circuit board (PCB) including at least one interface card slot. The heat dissipating structure includes a board, at least one heat sink and at least one interface card opening. The board has a first surface and a second surface which are opposite to each other. The second surface of the board faces the PCB. The heat sink is formed at the first surface of the board. The interface card opening penetrates through the first surface and the second surface of the board, so as to make the interface card slot exposed in the interface card opening.