Abstract: A method of forming a semiconductor package is provided. The method includes forming a micro lens recessed from the top surface of a substrate. A concave area is formed between the surface of the micro lens and the top surface of the substrate. The method includes depositing a first dielectric material that fills a portion of the concave area using a spin coating process. The method includes depositing a second dielectric material that fills the remainder of the concave area and covers the top surface of the substrate using a chemical vapor deposition process. The method includes planarizing the second dielectric material. The method includes forming a bonding layer on the planarized second dielectric material and over the top surface of the substrate. The method includes bonding a semiconductor wafer to the substrate via the bonding layer.

Abstract: An integrated circuit package and a method of forming the same are provided. The integrated circuit package includes a photonic integrated circuit die. The photonic integrated circuit die includes an optical coupler. The integrated circuit package further includes an encapsulant encapsulating the photonic integrated circuit die, a first redistribution structure over the photonic integrated circuit die and the encapsulant, and an opening extending through the first redistribution structure and exposing the optical coupler.

Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: A camera image calibrating system applicable to a transportation vehicle including at least one image capturing unit, direction sensing units and a processing unit is provided. The image capturing unit is disposed on the transportation vehicle according to a height to preview an image. The direction sensing units are disposed on the transportation vehicle and the image capturing unit to obtain a vehicle directional angle and an image capturing directional angle. The processing unit calculates an image transformation relationship and causes the image to comply with an image preset condition. The processing unit determines an offset angle of the image capturing unit according to the image, the vehicle directional angle and the image capturing directional angle, and further calculates the image transformation relationship according to the height, the offset angle and the image, in a static calibration procedure. A method of calibrating camera images is also provided.

Abstract: A method for adjusting head mounted display adaptively and a head mounted display are provided. The method includes the following steps. Eye state parameters of a user wearing the head-mounted display are sensed by using a first sensing unit, and whether the user's eyes are discomfort or not is determined according to the eye state parameters. If yes, environmental parameters of the user's location are sensed by using a second sensing unit. The eyes state parameters and the environmental parameters are analyzed synthetically, such that the projection display setting of the head-mounted display could be adjusted adaptively.