Patents by Inventor Chen-Hsuan Tsai
Chen-Hsuan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105629Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, a semiconductor bridge, an integrated passive device, a first redistribution layer, and connective terminals. The second semiconductor die is disposed beside the first semiconductor die. The semiconductor bridge electrically connects the first semiconductor die with the second semiconductor die. The integrated passive device is electrically connected to the first semiconductor die. The first redistribution layer is disposed over the semiconductor bridge. The connective terminals are disposed on the first redistribution layer, on an opposite side with respect to the semiconductor bridge. The first redistribution layer is interposed between the integrated passive device and the connective terminals.Type: ApplicationFiled: November 30, 2023Publication date: March 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai
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Publication number: 20240055410Abstract: A package structure is provided. The package structure includes a substrate and a semiconductor chip over the substrate. The package structure also includes a protective frame laterally surrounding the semiconductor chip. The package structure further includes an underfill element between the semiconductor chip and the protective frame. A portion of the underfill element is directly below the protective frame.Type: ApplicationFiled: October 11, 2023Publication date: February 15, 2024Inventors: Chen-Hsuan TSAI, Tsung-Fu TSAI, Shih-Ting LIN, Szu-Wei LU
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Publication number: 20240021442Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.Type: ApplicationFiled: August 1, 2023Publication date: January 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
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Publication number: 20240021491Abstract: A semiconductor device includes a first integrated circuit die and a second integrated circuit die. The first integrated circuit die includes a conductive paste on a first surface of the first integrated circuit die, wherein the conductive paste is in direct contact with the first surface of the first integrated circuit die. The second integrated circuit die is disposed aside the first integrated circuit die, wherein a surface of the conductive paste is substantially coplanar with a surface of the second integrated circuit die.Type: ApplicationFiled: July 17, 2022Publication date: January 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hsuan Tsai, Tsung-Fu Tsai, Hung-Chih Chen, Chin-Chuan Chang
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Patent number: 11854984Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, a semiconductor bridge, an integrated passive device, a first redistribution layer, and connective terminals. The second semiconductor die is disposed beside the first semiconductor die. The semiconductor bridge electrically connects the first semiconductor die with the second semiconductor die. The integrated passive device is electrically connected to the first semiconductor die. The first redistribution layer is disposed over the semiconductor bridge. The connective terminals are disposed on the first redistribution layer, on an opposite side with respect to the semiconductor bridge. The first redistribution layer is interposed between the integrated passive device and the connective terminals.Type: GrantFiled: March 2, 2020Date of Patent: December 26, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai
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Patent number: 11817425Abstract: A package structure is provided. The package structure includes a substrate and a stack of semiconductor dies over the substrate. The package structure also includes an underfill element covering sidewalls of the semiconductor dies. The package structure further includes a protective film attached to the substrate and laterally surrounding the underfill element and the semiconductor dies. The underfill element separates the protective film from the semiconductor dies.Type: GrantFiled: April 19, 2021Date of Patent: November 14, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chen-Hsuan Tsai, Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu
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Publication number: 20230361052Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has dielectric layers. The wiring substrate is disposed on the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure includes reinforcement pattern layers and reinforcement vias. The reinforcement pattern layers and the dielectric layers are stacked alternately. The reinforcement vias penetrate through the dielectric layers to connect the reinforcement pattern layers. At least one of the reinforcement pattern layers is embedded in the insulating encapsulation. The reinforcement structure is electrically floating.Type: ApplicationFiled: July 18, 2023Publication date: November 9, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang
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Patent number: 11769739Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, a semiconductor device, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has dielectric layers. The wiring substrate is disposed on the redistribution circuit structure. The semiconductor device is disposed on the redistribution circuit structure opposite to the wiring substrate. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure is partially embedded in the redistribution circuit structure and is partially embedded in the insulating encapsulation. The reinforcement structure includes reinforcement pattern layers and reinforcement vias. The reinforcement pattern layers and the dielectric layers are stacked alternately. The reinforcement vias penetrate through the dielectric layers to connect the reinforcement pattern layers. The reinforcement structure is electrically floating.Type: GrantFiled: May 9, 2022Date of Patent: September 26, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang
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Publication number: 20220310411Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.Type: ApplicationFiled: March 26, 2021Publication date: September 29, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
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Publication number: 20220262745Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, a semiconductor device, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has dielectric layers. The wiring substrate is disposed on the redistribution circuit structure. The semiconductor device is disposed on the redistribution circuit structure opposite to the wiring substrate. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure is partially embedded in the redistribution circuit structure and is partially embedded in the insulating encapsulation. The reinforcement structure includes reinforcement pattern layers and reinforcement vias. The reinforcement pattern layers and the dielectric layers are stacked alternately. The reinforcement vias penetrate through the dielectric layers to connect the reinforcement pattern layers. The reinforcement structure is electrically floating.Type: ApplicationFiled: May 9, 2022Publication date: August 18, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang
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Patent number: 11355454Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, a semiconductor device, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has a first surface and a second surface opposite to the first surface. The wiring substrate is disposed on the first surface of the redistribution circuit structure. The semiconductor device is disposed on the second surface of the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure is directly in contact with the insulating encapsulation.Type: GrantFiled: July 30, 2020Date of Patent: June 7, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang
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Publication number: 20220037266Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, a semiconductor device, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has a first surface and a second surface opposite to the first surface. The wiring substrate is disposed on the first surface of the redistribution circuit structure. The semiconductor device is disposed on the second surface of the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure is directly in contact with the insulating encapsulation.Type: ApplicationFiled: July 30, 2020Publication date: February 3, 2022Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang
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Publication number: 20210384044Abstract: A method of fabricating a semiconductor device is provided, including providing a base substrate and a die stacking unit mounted on the base substrate. Conductive joints are connected between two adjacent dies of the die stacking unit. The method further includes providing dummy micro bumps and dummy pads between the two adjacent dies and between the conductive joints. The dummy micro bumps and the dummy pads are connected to one of the two adjacent dies but not to the other, and the dummy micro bumps are formed on some of the dummy pads but not on all of the dummy pads. In addition, the method includes filling the gaps between the base substrate, all dies of the die stacking unit, the conductive joints, the dummy micro bumps, and the dummy pads with an underfill material by capillary attraction.Type: ApplicationFiled: August 20, 2021Publication date: December 9, 2021Inventors: Tsung-Fu TSAI, Chen-Hsuan TSAI, Chung-Chieh TING, Shih-Ting LIN, Szu-Wei LU
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Patent number: 11101145Abstract: A semiconductor device is provided. The semiconductor device includes a base substrate, a die stacking unit, a number of dummy micro bumps, and an underfill material. The die stacking unit, which is mounted on the base substrate, includes a first die, a second die, and a number of first conductive joints. The first die and the second die are stacked on each other, and the first conductive joints are disposed between and connected to the first die and the second die. The dummy micro bumps, which are disposed between the first conductive joints, are connected to the first die but not to the second die. The underfill material is filled into a number of gaps between the base substrate, the first die, the second die, the first conductive joints, and the dummy micro bumps.Type: GrantFiled: November 1, 2018Date of Patent: August 24, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tsung-Fu Tsai, Chen-Hsuan Tsai, Chung-Chieh Ting, Shih-Ting Lin, Szu-Wei Lu
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Publication number: 20210242177Abstract: A package structure is provided. The package structure includes a substrate and a stack of semiconductor dies over the substrate. The package structure also includes an underfill element covering sidewalls of the semiconductor dies. The package structure further includes a protective film attached to the substrate and laterally surrounding the underfill element and the semiconductor dies. The underfill element separates the protective film from the semiconductor dies.Type: ApplicationFiled: April 19, 2021Publication date: August 5, 2021Inventors: Chen-Hsuan TSAI, Tsung-Fu TSAI, Shih-Ting LIN, Szu-Wei LU
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Patent number: 10985140Abstract: A structure and a formation method of a package structure are provided. The method includes disposing a semiconductor die structure over a substrate. The method also includes disposing a protective film over the substrate. The protective film has an opening exposing the semiconductor die structure, and sidewalls of the opening surround the semiconductor die structure. The method further includes dispensing an underfill material into the opening to surround the semiconductor die structure.Type: GrantFiled: April 15, 2019Date of Patent: April 20, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chen-Hsuan Tsai, Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu
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Publication number: 20210091005Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, a semiconductor bridge, an integrated passive device, a first redistribution layer, and connective terminals. The second semiconductor die is disposed beside the first semiconductor die. The semiconductor bridge electrically connects the first semiconductor die with the second semiconductor die. The integrated passive device is electrically connected to the first semiconductor die. The first redistribution layer is disposed over the semiconductor bridge. The connective terminals are disposed on the first redistribution layer, on an opposite side with respect to the semiconductor bridge. The first redistribution layer is interposed between the integrated passive device and the connective terminals.Type: ApplicationFiled: March 2, 2020Publication date: March 25, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chen-Hsuan Tsai, Chin-Chuan Chang, Szu-Wei Lu, Tsung-Fu Tsai
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Publication number: 20200328185Abstract: A structure and a formation method of a package structure are provided. The method includes disposing a semiconductor die structure over a substrate. The method also includes disposing a protective film over the substrate. The protective film has an opening exposing the semiconductor die structure, and sidewalls of the opening surround the semiconductor die structure. The method further includes dispensing an underfill material into the opening to surround the semiconductor die structure.Type: ApplicationFiled: April 15, 2019Publication date: October 15, 2020Inventors: Chen-Hsuan TSAI, Tsung-Fu TSAI, Shih-Ting LIN, Szu-Wei LU
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Publication number: 20200058519Abstract: A semiconductor device is provided. The semiconductor device includes a base substrate, a die stacking unit, a number of dummy micro bumps, and an underfill material. The die stacking unit, which is mounted on the base substrate, includes a first die, a second die, and a number of first conductive joints. The first die and the second die are stacked on each other, and the first conductive joints are disposed between and connected to the first die and the second die. The dummy micro bumps, which are disposed between the first conductive joints, are connected to the first die but not to the second die. The underfill material is filled into a number of gaps between the base substrate, the first die, the second die, the first conductive joints, and the dummy micro bumps.Type: ApplicationFiled: November 1, 2018Publication date: February 20, 2020Inventors: Tsung-Fu TSAI, Chen-Hsuan TSAI, Chung-Chieh TING, Shih-Ting LIN, Szu-Wei LU
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Publication number: 20180366439Abstract: Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes a first chip, a redistribution layer structure, a plurality of connection pads, a plurality of dummy patterns, a plurality of micro-bumps, a second chip and an underfill layer. The redistribution layer structure is electrically connected to the first chip. The connection pads are electrically connected to the redistribution layer structure. The dummy patterns are at one side of the connection pads. The micro-bumps are electrically connected to the connection pads. The second chip is electrically connected to the micro-bumps. The underfill layer covers the plurality of dummy patterns and surrounds the micro-bumps.Type: ApplicationFiled: June 20, 2017Publication date: December 20, 2018Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Jing-Cheng Lin, Tsung-Fu Tsai, Chen-Hua Yu, Po-Hao Tsai, Shih-Ting Lin, Szu-Wei Lu, Hung-Wei Tsai, Chen-Hsuan Tsai