Abstract: A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.

Abstract: A protective film comprises a substrate and a semi-cured protective layer over the substrate. The semi-cured protective layer is formed by curing a liquid mixture consisting of a thermosetting resin and a radiation curing resin.

Abstract: A color pattern film for metal shell is provided. The color pattern film for metal shell includes a transparent polymer substrate, a releasing coating layer, a protective layer, an ink layer, and an adhesive layer. The releasing coating layer is on the transparent polymer substrate, the protective layer is on the releasing coating layer, the ink layer is on the protective layer, and the adhesive layer is on the ink layer. The adhesive layer at least includes a base resin which is one of resin systems selected from ethylene-vinyl acetate (EVA), polyester (PET) resin, and polyolefin resin. The color pattern film for metal shell can be directly pressed and attached onto a metal sheet or coil, and subsequently punched, thus the problems of the prior art that the yield of adhesive wet film coating process is not easily controlled and complex post-processes are still required after molding are addressed.

Abstract: A protective film comprises a substrate and a semi-cured protective layer over the substrate. The semi-cured protective layer is formed by curing a liquid mixture consisting of a thermosetting resin and a radiation curing resin.

Abstract: A thermal transfer film at least including a substrate, a semi-cured protection layer, and an ink layer is provided. The semi-cured protection layer is coated on the substrate, and a material of the semi-cured protection layer includes thermal curing resin and radiation curing resin. Moreover, the resin of the semi-cured protection layer is at least partially cured. The ink layer is coated on the semi-cured protection layer.

Abstract: A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Abstract: A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Abstract: A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.

Abstract: A flat panel display or a backlight module for homogenizing temperature distribution. The backlight module utilizes a heat pipe to carry out the heat from the light source quickly and homogenizes the distribution of temperature of the light source.

Abstract: A lightguide having either a built-in prism sheet or a built-in diffuser sheet is disclosed. The lightguide includes: a prism sheet having a plane surface and a surface with a plurality of patterned microlens; a transparent wedge having a cross-section of trapezoid; and a binder layer sandwiched between said plane surface of said prism sheet and said transparent wedge. A method for manufacturing the lightguide is also disclosed here.

Abstract: A method for manufacturing a lens-implanted optical sheet is disclosed, which includes following steps: (A) laying a patterned screen mask on an inner surface of a mold (B) coating or transferring-printing a layer of an adhesive or a binder on said inner surface (C) removing said patterned mask (D) locating said lens or said prisms on said adhesive or said binder (E) closing said mold and injecting a polymer into said mold to form a molded optical sheet; and (F) opening said mold. The lens-implanted optical sheet with a smooth surface and with a simple structure is also revealed here.

Abstract: A lightguide having either a built-in prism sheet or a built-in diffuser sheet is disclosed. The lightguide includes: a prism sheet having a plane surface and a surface with a plurality of patterned microlens; a transparent wedge having a cross-section of trapezoid; and a binder layer sandwiched between said plane surface of said prism sheet and said transparent wedge. A method for manufacturing the lightguide is also disclosed here.

Abstract: A method for attaching an IC package to a circuit board, the IC package having a plurality of electrical contacts in an arrangement having a perimeter, first positions the IC package adjacent to the circuit board. Then, electrically connects the IC package to the circuit board through the plurality of electrical contacts. The method finally, disposes at least one anchor mechanically attaching the IC package to the circuit board, the anchor disposed at a location outside of the perimeter of the plurality of electrical contacts. The type, quantity, and exact geometry of the anchors depend on the specific design parameters of the IC package and circuit board.

Abstract: A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally. REMARKS In this divisional application, the specification and drawings are carried forward from the application Ser. No. 10/064,464 filed Jul. 17, 2002 without any amendment. No new matter is introduced.

Abstract: A lightguide having either a built-in prism sheet or a built-in diffuser sheet is disclosed. The lightguide includes: a prism sheet having a plane surface and a surface with a plurality of patterned microlens; a transparent wedge having a cross-section of trapezoid; and a binder layer sandwiched between said plane surface of said prism sheet and said transparent wedge. A method for manufacturing the lightguide is also disclosed here.

Abstract: A thermal module with temporary heat storage. The thermal module includes a heat storage, a heat absorber, a heat dissipater, and a heat pipe for rapidly transferring heat from the heat absorber to the heat dissipater. The heat storage includes a phase change material and is in contact with the heat pipe. When heat quantities generated by the system are greater than a predefined reasonable thermal target, heat in excess of the thermal target is temporarily absorbed into the heat storage through the melting of the PCM. When the heat quantities generated by the system are again less than the thermal target, the PCM re-freezes, releasing the stored heat to be dissipated normally.

Abstract: A heat pipe for transferring heat from a heat source to a heat dissipater. The heat pipe includes a tube encasing a low viscosity working fluid and at least one radially segmented disk to restrict the flow of the working fluid to a single direction around the interior of closed loop of the tube. The tube additionally has a first surface adapted to contact at least a portion of a heat source, and a second surface adapted to contact at least a portion of a heat dissipater. The heat source vaporizes the working fluid, pressure forcing the fluid to circulate throughout the enclosed loop of the tube, the vapor being cooled and re-condensed while near the heat dissipater. Each radially segmented disk includes a plurality of segments designed to introduce turbulence into the fluid flow to increase heat transfer rates.

Abstract: A method for manufacturing a lens-implanted optical sheet is disclosed, which includes following steps: (A) laying a patterned screen mask on an inner surface of a mold (B) coating or transferring-printing a layer of an adhesive or a binder on said inner surface (C) removing said patterned mask (D) locating said lens or said prisms on said adhesive or said binder (E) closing said mold and injecting a polymer into said mold to form a molded optical sheet; and (F) opening said mold. The lens-implanted optical sheet with a smooth surface and with a simple structure is also revealed here.

Abstract: A light guide plate with embedded diffuser sheet is disclosed. The light guide plate for a flat panel display device, includes: a bottom substrate having a cross-section of trapezoid for transferring and reflecting said light; and a diffuser sheet locating on the substrate to distribute the light; wherein said diffuser sheet is integrated with said substrate. The light guide can reduce the thickness and the weight of a backlight module used for a flat panel display device.

Abstract: A flat panel display or a backlight module for homogenizing the temperature distribution is disclosed. The backlight module utilizes a heat pipe to carry out the heat from the light source quickly and homogenize the distribution of temperature of the light source. A flat panel display includes such kind of backlight module is also discloed here.