Patents by Inventor Chen-Hua Pan

Chen-Hua Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED CIRCUIT STRUCTURE AND METHOD
    Publication number: 20250096163
    Abstract: A semiconductor device includes a first plurality of dies encapsulated by an encapsulant, an interposer over the first plurality of dies, an interconnect structure over and electrically connected to the interposer, and a plurality of conductive pads on a surface of the interconnect structure opposite the interposer. The interposer includes a plurality of embedded passive components. Each die of the first plurality of dies is electrically connected to the interposer. The interconnect structure includes a solenoid inductor in a metallization layer of the interconnect structure.
    Type: Application
    Filed: December 2, 2024
    Publication date: March 20, 2025
    Inventors: Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai
  • Bonding passive devices on active dies to form 3D packages
    Patent number: 12255174
    Abstract: A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.
    Type: Grant
    Filed: June 30, 2022
    Date of Patent: March 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu
  • Method for setting function options and multi function peripheral using the same
    Patent number: 8456656
    Abstract: A method for setting function options and a multi function peripheral (MFP) using the same are provided. The MFP at least includes an image sensor and an option switch, wherein the option switch includes a sliding groove and a shift lever, and the shift lever is disposed in sliding way in the sliding groove. The method includes using the image sensor to obtain an option image of the option switch; judging a corresponding position relating to the shift lever in the option image; and setting a peripheral function according to a function option corresponding to the corresponding position.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: June 4, 2013
    Assignees: Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc.
    Inventors: Chen-Hua Pan, Yu-Chun Yang, Hsueh-Kuan Shih
  • METHOD FOR SETTING FUNCTION OPTIONS AND MULTI FUNCTION PERIPHERAL USING THE SAME
    Publication number: 20120138440
    Abstract: A method for setting function options and a multi function peripheral (MFP) using the same are provided. The MFP at least includes an image sensor and an option switch, wherein the option switch includes a sliding groove and a shift lever, and the shift lever is disposed in sliding way in the sliding groove. The method includes using the image sensor to obtain an option image of the option switch; judging a corresponding position relating to the shift lever in the option image; and setting a peripheral function according to a function option corresponding to the corresponding position.
    Type: Application
    Filed: January 7, 2011
    Publication date: June 7, 2012
    Applicants: Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Chen-Hua Pan, Yu-Chun Yang, Hsueh-Kuan Shih