Abstract: An evaluating system of paper manufacturing includes an evaluation apparatus of paper manufacturing and a fiber analysis device. The evaluation apparatus of paper manufacturing includes a database, an input unit, a processing unit, and a communication interface. The database stores a plurality of paper manufacturing parameters, a paper manufacturing corresponding function, and a paper forming corresponding function. The input unit is configured to receive an input related to the paper manufacturing parameters. The processing unit is electrically connected to the database and is configured to generate a suggested manufacturing recipe by using the paper forming corresponding function and the paper manufacturing corresponding function according to the input. The fiber analysis device is electrically or communicatively connected to the evaluation apparatus of paper manufacturing. The fiber analysis device is configured to analyze one or more fiber materials, a single-layer paper, and a paper product.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: An optical system is provided and includes a first optical element driving mechanism, which includes a first fixed assembly, a first movable assembly, and a first driving assembly. The first movable assembly is configured to be connected to a first optical element, and the first movable assembly is movable relative to the first fixed assembly. The first movable assembly includes a first movable element and a second movable element. The first driving assembly is configured to drive the first movable assembly to move relative to the first fixed assembly. The first fixed assembly and the first movable assembly are arranged along a main axis, and the first driving assembly is configured to drive the second movable element to move along a first axis, thereby driving the first movable element to move around the main axis.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable part, a fixed part, and a driving assembly. The movable part connects a plurality of optical elements. The movable part may move relative to the fixed part. The driving assembly drives the movable part to move relative to the fixed part.

Abstract: A locking block is adapted to be mounted in a gun. The gun has a bias spring having a bias spring arm. The locking block includes two side bodies and a connecting body. The connecting body is connected between the two side bodies and has a bottom surface. The connecting body is formed with at least one positioning groove recessed upward from the bottom surface for catching the bias spring arm of the bias spring.

Abstract: A semiconductor structure a method of fabricating thereof including a substrate having a device region and a dummy region. A first active region is disposed over the substrate in the device region and a second active region is over the substrate in the dummy region. A first operational gate structure over the first active region and a first non-operational gate structure over the second active region. A first epitaxial region of an n-type dopant is adjacent the first operation gate structure; and a second epitaxial region of an n-type dopant is adjacent the first non-operational gate structure.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, a driving assembly, a circuit assembly, and a connecting element. The movable part is for connecting an optical element. The fixed part includes an outer frame and a base, wherein the movable part is movable relative to the fixed part. The driving assembly is for generating a driving force to drive the movable part to move relative to the fixed part. The circuit assembly is for connecting to an external circuit. The circuit assembly includes a first terminal. The outer frame is fixedly connected to the base via the connecting element.

Abstract: Embodiments are directed to a method of optimizing thickness of a target material film deposited on a semiconductor substrate in a semiconductor processing chamber, wherein the semiconductor processing chamber includes a magnetic assembly positioned on the semiconductor processing chamber, the magnetic assembly including a plurality of magnetic columns within the magnetic assembly. The method includes operating the semiconductor processing chamber to deposit a film of target material on a semiconductor substrate positioned within the semiconductor processing chamber, measuring an uniformity of the deposited film, adjusting a position of one or more magnetic columns in the magnetic assembly, and operating the semiconductor processing chamber to deposit the film of the target material after adjusting position of the one or more magnetic columns.

Abstract: An optical element driving mechanism is provided, including a movable part, a fixed part, and a driving assembly. The movable part is for connecting the optical element. The movable part is movable relative to the fixed part. The driving assembly is used for generating a driving force to drive the movable part to move relative to the fixed part. The driving assembly further includes a first reinforcement element, for strengthening the driving force.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: A driving mechanism for moving an optical element is provided. The driving mechanism includes a fixed part, a movable part, and a driving assembly. The movable part is movably connected to the fixed part for holding the optical element. The driving assembly is configured for moving the movable part relative to the fixed part.

Abstract: An optical element driving mechanism is provided, including a movable part, a first frame, a driving assembly, and a first sensing assembly. The movable part is for connecting an optical element. The movable part may move relative to the first frame. The driving assembly drives the movable part to move relative to the first frame. The first sensing assembly is for sensing the movement of the movable part.

Abstract: A UE and a method for handling a cell reselection procedure are provided. The method receives, from a camped cell, information related to the cell reselection procedure. The method determines whether the camped cell operates on a first frequency range for a Non-Terrestrial Network (NTN) operation. The method performs a measurement, for the cell reselection procedure for selecting a suitable cell, based on the information related to the cell reselection procedure after determining that the camped cell operates on the first frequency range for the NTN operation.

Abstract: Embodiments are directed to a method of optimizing thickness of a target material film deposited on a semiconductor substrate in a semiconductor processing chamber, wherein the semiconductor processing chamber includes a magnetic assembly positioned on the semiconductor processing chamber, the magnetic assembly including a plurality of magnetic columns within the magnetic assembly. The method includes operating the semiconductor processing chamber to deposit a film of target material on a semiconductor substrate positioned within the semiconductor processing chamber, measuring an uniformity of the deposited film, adjusting a position of one or more magnetic columns in the magnetic assembly, and operating the semiconductor processing chamber to deposit the film of the target material after adjusting position of the one or more magnetic columns.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a fixed portion, a movable portion, and a driving component. The movable portion is configured to connect an optical element. The optical element has an optical axis. The movable portion is movable relative to the fixed portion. The driving component is configured to drive the movable portion to move relative to the fixed portion.

Abstract: The present disclosure provides a method for semiconductor fabrication. The method includes receiving a workpiece having gate structures over channel regions on a substrate and source/drain (S/D) features adjacent to the channel regions. The method then forms tungsten S/D contacts over the S/D features in a first ILD layer by a first selective bottom-up metal growth process. The method forms tungsten S/D vias over the tungsten S/D contacts in a second ILD layer by a second selective bottom-up metal growth process. And after forming the tungsten S/D vias, the method forms tungsten gate vias over the gate structures in the first and the second ILD layer. The forming of the tungsten gate vias includes forming a tungsten seed layer by physical vapor deposition (PVD), and depositing tungsten directly on horizontal and sidewall surfaces of the tungsten seed layer by chemical vapor deposition (CVD).