Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: An optical element driving mechanism is provided. The optical element driving mechanism includes a movable portion used for connecting an optical element, a fixed portion, and a driving assembly used for driving the movable portion to move relative to the fixed portion. The movable portion is movable relative to the fixed portion.

Abstract: Embodiments are directed to a method of optimizing thickness of a target material film deposited on a semiconductor substrate in a semiconductor processing chamber, wherein the semiconductor processing chamber includes a magnetic assembly positioned on the semiconductor processing chamber, the magnetic assembly including a plurality of magnetic columns within the magnetic assembly. The method includes operating the semiconductor processing chamber to deposit a film of target material on a semiconductor substrate positioned within the semiconductor processing chamber, measuring an uniformity of the deposited film, adjusting a position of one or more magnetic columns in the magnetic assembly, and operating the semiconductor processing chamber to deposit the film of the target material after adjusting position of the one or more magnetic columns.

Abstract: A display apparatus including a circuit board, a plurality of light-emitting devices and a display panel is provided. The light-emitting devices are disposed on the circuit board and electrically connected to the circuit board. The display panel is disposed on the light-emitting devices. The display panel includes a peripheral light-shielding pattern. An opening portion of the peripheral light-shielding pattern defines an active area of the display panel. A physical portion of the peripheral light-shielding pattern defines a non-active area of the display panel. An optical axis of a light-emitting surface of at least one of the light-emitting devices is located at a junction of the active area and the non-active area, at the non-active area, or at the active area and a side wall of the at least one of the light-emitting devices is located at the junction of the active area and the non-active area.

Abstract: A display apparatus including a circuit board, a plurality of light-emitting devices and a display panel is provided. The light-emitting devices are disposed on the circuit board and electrically connected to the circuit board. The display panel is disposed on the light-emitting devices. The display panel includes a peripheral light-shielding pattern. An opening portion of the peripheral light-shielding pattern defines an active area of the display panel. A physical portion of the peripheral light-shielding pattern defines a non-active area of the display panel. An optical axis of a light-emitting surface of at least one of the light-emitting devices is located at a junction of the active area and the non-active area, at the non-active area, or at the active area and a side wall of the at least one of the light-emitting devices is located at the junction of the active area and the non-active area.

Abstract: A backlight module including a substrate, light-emitting elements, an optical element, first microstructures, and second microstructures is provided. The light-emitting elements are disposed on the substrate. The light-emitting elements are located between the optical element and the substrate. The first microstructures are located between the optical element and the light-emitting elements and respectively shield the light-emitting elements. The optical element is located between the second microstructures and the first microstructures. An area of each of the first microstructures is greater than an area of each of the second microstructures. Moreover, a display apparatus including the backlight module is also provided.

Abstract: A backlight module includes a back plate, an optical element set, a wavelength conversion film, a light source, and an ink layer. The optical element set is disposed on the back plate and has a first surface, a second surface and at least one end surface. The first surface faces the back plate and is opposite to the second surface. The at least one end surface is connected to the first surface and the second surface. The wavelength conversion film is disposed on the back plate. The light source is adapted to provide light, and the light is transmitted to the wavelength conversion film and the optical element set. The ink layer is disposed on the at least one end surface of the optical element set. A display device is further provided. The backlight module and the display device may reduce the phenomenon of blue edge caused by light leakage.

Abstract: A mold, punch and workpiece are provided. In a preferred embodiment, a tapering outer edge is provided, along with a plurality of rib sets arranged circumferentially about the outer edge, and a ramp. A ramp may be located to facilitate the removal of burrs. Various slot patterns may be provided or formed, including star-shapes/Torx® slots. Using the present invention, a driver bit may be more securely fit to the slot of a screw, for example, allowing the screw to be threaded into a machined part more securely and smoothly, reducing rocking, shaking or tilt.

Abstract: A backlight module includes a back plate, an optical element set, a wavelength conversion film, a light source, and an ink layer. The optical element set is disposed on the back plate and has a first surface, a second surface and at least one end surface. The first surface faces the back plate and is opposite to the second surface. The at least one end surface is connected to the first surface and the second surface. The wavelength conversion film is disposed on the back plate. The light source is adapted to provide light, and the light is transmitted to the wavelength conversion film and the optical element set. The ink layer is disposed on the at least one end surface of the optical element set. A display device is further provided. The backlight module and the display device may reduce the phenomenon of blue edge caused by light leakage.

Abstract: A mold, punch and workpiece are provided. In a preferred embodiment, a tapering outer edge is provided, along with a plurality of rib sets arranged circumferentially about the outer edge, and a ramp. A ramp may be located to facilitate the removal of burrs. Various slot patterns may be provided or formed, including star-shapes/Torx® slots. Using the present invention, a driver bit may be more securely fit to the slot of a screw, for example, allowing the screw to be threaded into a machined part more securely and smoothly, reducing rocking, shaking or tilt.

Abstract: A photomask purging method includes opening a pod having a photomask therein, gripping the photomask by an end effector, moving the end effector from the opened pod to a destination where a gas exit is toward, exhausting a gas from the gas exit toward the gripped photomask, and rotating the end effector with respect to a horizontal plane when the end effector is at the destination where the gas exit is toward.

Abstract: A mold, punch and workpiece are provided. In a preferred embodiment, a tapering outer edge is provided, along with a plurality of rib sets arranged circumferentially about the outer edge, and a ramp. A ramp may be located to facilitate the removal of burrs. Various slot patterns may be provided or formed, including star-shapes/Torx® slots. Using the present invention, a driver bit may be more securely fit to the slot of a screw, for example, allowing the screw to be threaded into a machined part more securely and smoothly, reducing rocking, shaking or tilt.

Abstract: A photomask purging method includes opening a pod having a photomask therein, gripping the photomask by an end effector, moving the end effector from the opened pod to a destination where a gas exit is toward, exhausting a gas from the gas exit toward the gripped photomask, and rotating the end effector with respect to a horizontal plane when the end effector is at the destination where the gas exit is toward.

Abstract: A mold, punch and workpiece are provided. In a preferred embodiment, a tapering outer edge is provided, along with a plurality of rib sets arranged circumferentially about the outer edge, and a ramp. A ramp may be located to facilitate the removal of burrs. Various slot patterns may be provided or formed, including star-shapes/Torx® slots. Using the present invention, a driver bit may be more securely fit to the slot of a screw, for example, allowing the screw to be threaded into a machined part more securely and smoothly, reducing rocking, shaking or tilt.

Abstract: A mold, punch and workpiece are provided. In a preferred embodiment, a tapering outer edge is provided, along with a plurality of rib sets arranged circumferentially about the outer edge, and a ramp. A ramp may be located to facilitate the removal of burrs. Various slot patterns may be provided or formed, including star-shapes/Torx® slots. Using the present invention, a driver bit may be more securely fit to the slot of a screw, for example, allowing the screw to be threaded into a machined part more securely and smoothly, reducing rocking, shaking or tilt.