Abstract: A method for performing airtime fairness control of mesh network and associated apparatus (e.g., wireless communications devices) are provided. The method may include: utilizing a first wireless communications device to receive at least one first packet carrying at least one indication related to at least one second station (STA) device from a second wireless communications device; determining a first expected airtime of at least one first STA device connected to the first wireless communications device and a second expected airtime of the at least one second STA device at least according to the at least one indication; and controlling first medium-access operations of the at least one first STA device and second medium-access operations of the at least one second STA device according to the first expected airtime and the second expected airtime in time-division manner, for balancing respective airtime of all currently connected STA devices of the mesh network.

Abstract: A method for bonding detection includes: disposing a liquid crystal component on one side of a growth substrate away from a light-emitting element; disposing a first electrode layer on one side of the liquid crystal component away from the growth substrate, and disposing a first polarizer on one side of the first electrode layer away from the liquid crystal component; disposing a second electrode layer on one side of a transient substrate away from an adhesive layer, and disposing a second polarizer on one side of the second electrode layer away from the transient substrate, polarization directions of the second polarizer and the first polarizer are orthogonal; irradiating the first polarizer with a uniform light; electrifying the first electrode layer and the second electrode layer; and detecting a uniformity and a thickness of the adhesive layer according to the light exited from one side of the second polarizer.

Abstract: Provided is a micro-element recycling method and system. The method includes: collecting at least one micro-element failing in transfer; applying a first acting force to the micro-element in a first direction, and applying a second acting force to the micro-element in a second direction; moving the micro-element from an initial position to a target position by means of the combined action of the first acting force and the second acting force; and recycling the micro-element located at the target position.

Abstract: The present invention involves a LED flip chip, its fabrication method and a display panel containing the LED flip chip. The LED flip chip comprises a first semiconductor layer, a second semiconductor layer, an active layer configured between the first and second semiconductor layers, a first electrode and a second electrode. At least one of the first and second electrodes includes at least two sub-electrodes.

Abstract: A micro-LED and a method for manufacturing the same, and a micro-LED module are provided. The method includes the following. Multiple micro-LED units that are spaced on a substrate are provided. A jig is covered on the substrate in such a manner that a light-emitting part of each micro-LED unit is covered between the jig and the substrate. A molten light blocking material is injected into the jig in such a manner that the light blocking material is filled between side surfaces of each micro-LED unit and the jig. The light blocking material is cured to form a light blocking layer on the side surfaces of each micro-LED unit. The jig is removed after the light blocking material is cured.

Abstract: A mass transfer device and a transfer method therefor are provided. The mass transfer device includes a transfer container. The transfer container is filled with insulating liquid and provided with two electrode plates. The two electrode plates are arranged opposite to each other and have opposite electrical polarities. One of the two electrode plates is provided with a second substrate on a surface of the electrode plate opposite to the other one of the two electrode plates. The second substrate is configured to hold transferred light-emitting diode (LED) chips. The transfer container is externally provided with a laser emitter. The laser emitter is aligned with LED chips on a first substrate. The first substrate is arranged between the two electrode plates and mounted on a first displacement device. The first displacement device is configured to control the first substrate to move vertically downward.

Abstract: The disclosure provides a method for transferring massive light emitting diodes and a display back plate assembly, the method includes: a plurality of temporary substrates are provided, light emitting diodes with one color are arranged on one of the plurality of temporary substrates, and the light emitting diodes with different colors are different in height; an adhesive layer on each of the plurality of temporary substrates is coating respectively, so that the adhesive layer covers the light emitting diodes and the adhesive layer on each of the plurality of temporary substrates is the same in height; the adhesive layer between adjacent light emitting diodes to form a flattening layer on one side, far away from the temporary substrate, of the light emitting diodes with the different colors is removed; and the light emitting diodes on each of the plurality of temporary substrates are transferred to a same display back plate.