Abstract: An optical system is provided. The optical system is used for disposing on an electronic device. The optical system includes a movable portion, a fixed portion, a first driving assembly, and a support module. The movable portion is used for connecting to an optical module. The fixed portion is affixed on the electronic device, and the movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion through the support module.

Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

Abstract: The present invention discloses a method for simultaneously manufacturing a poly gate and a polycide gate which requires only one gate oxide layer deposition and one polysilicon layer deposition steps by incorporating a protective layer, primarily an oxide layer, which acts as a mask of a silicide. The present invention not only simplifies the process but also avoids a residual spacer in the gate. The advantages also includes widening the process window, controlling the gate channel and avoiding the gate top loss.