Abstract: The present invention discloses an interior mobile mapping system and method thereof. The interior mobile mapping method comprises the following steps: establishing a plurality of interior reference points; obtaining coordinates of the plurality of interior reference points corresponded to an interior coordinate system; moving from one interior reference point which is closest to an interior object; taking a picture for the interior object at more than two different places individually; and calculating the coordinate of the interior object corresponded to an exterior coordinate system according to the respective position of the interior object in the pictures and the coordinates of the different shooting locations.

Abstract: A mobile positioning apparatus and a positioning method thereof are provided. The mobile positioning apparatus retrieves sensing information and an environment image with environment image featured points. The mobile positioning apparatus determines first location information according to the sensing information, and selects a data image corresponding to the first location information from an image database. The data image has data image featured points which correspond to the environment image featured points. The mobile positioning apparatus determines second location information according to the environment image, the data image, the environment image featured points and the data image featured points, and determines second location information of the mobile positioning apparatus.

Abstract: The invention provides a touch display device, including: a plurality of driving electrodes disposed in parallel in a first direction; and a plurality of sensing electrodes disposed in parallel in a second direction, wherein each of the sensing electrodes are split into a plurality of electrode strips, and the electrode strips converge at a minimum, of two ends of the sensing electrode.

Abstract: A chip package structure including a first substrate, a chip, a second substrate, a plurality of conductive wires, a plurality of solder balls and a molding compound is provided. The chip is disposed on the first substrate. The second substrate disposed on the chip has an upper surface and a lower surface, in which a distance of the lower surface relative to the chip is smaller than that of the upper surface relative to the chip. The upper surface has a ball mounting surface and a wire bonding surface. A distance between the wire bonding surface and the first substrate is smaller than that between the ball mounting surface and the first substrate. The conductive wires connect the wire bonding surface to the first substrate. The solder balls are disposed on the ball mounting surface. The molding compound is disposed on the first substrate.