Abstract: This application provides a package substrate and a communication device. The package substrate includes a package body, a first circuit layer, a second circuit layer, an electronic component, and a moisture-proof structure. The package body includes a top surface and a bottom surface that are oppositely disposed, the first circuit layer is disposed on the top surface of the package body, and the second circuit layer is disposed on the bottom surface of the package body. The electronic component is packaged inside the package body. The moisture-proof structure is disposed on the package body and is connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. According to technical solutions of this application, external water vapor can be prevented from entering the package substrate from a peripheral side of the package substrate, to effectively prevent moisture absorption.

Abstract: According to one embodiment, an imprint template manufacturing apparatus includes a support unit, a vaporization unit, and an adhesion preventing plate. The support unit supports a template that includes a base having a main surface, and a convex portion provided on the main surface and having an end surface. A concavo-convex pattern to be pressed against a liquid material to be transferred is formed on the end surface. The support unit supports the template with the convex portion facing downward. The vaporization unit is located below the template on the support unit and configured to vaporize a liquid-repellent material. The adhesion preventing plate is located below the template on the support unit and configured to allow the liquid-repellent material vaporized to adhere to the side surface of the convex portion of the template and to prevent it from adhering to the concavo-convex pattern.