Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A probe card including a substrate, a plurality of probe heads and a wave absorber is provided. The substrate has a through hole. The plurality of probe heads are disposed on the substrate and arranged around the through hole. Each of the probe heads includes a housing, a subminiature connector and a probe structure. The subminiature connector is disposed on the housing. The probe structure is connected to the subminiature connector, inserted through the housing and extended to the through hole. The wave absorber is disposed between two of the probe structures.

Abstract: A probe module including a housing, a PCB, three probes, a resonating member, and a signal connector. The housing has a room therein, a first opening, and a second opening at opposite ends thereof. The PCB is received in the room of the housing, and has a substrate, on which a circuit and two groundings are provided. The probes are electrical connected to the circuit and the groundings of the PCB respectively, and then extend out of the housing via the first opening. The resonating member has a chamber, and is attached to the PCB. The signal connector is connected to the PCB, and extends out of the housing via the second opening. The signal connector has a signal transmission portion electrically connected to the circuit of the PCB, and a grounding portion electrically connected to the at least one grounding of the PCB.

Abstract: A probe module including a housing, a PCB, three probes, a resonating member, and a signal connector. The housing has a room therein, a first opening, and a second opening at opposite ends thereof. The PCB is received in the room of the housing, and has a substrate, on which a circuit and two groundings are provided. The probes are electrical connected to the circuit and the groundings of the PCB respectively, and then extend out of the housing via the first opening. The resonating member has a chamber, and is attached to the PCB. The signal connector is connected to the PCB, and extends out of the housing via the second opening. The signal connector has a signal transmission portion electrically connected to the circuit of the PCB, and a grounding portion electrically connected to the at least one grounding of the PCB.

Abstract: A substrate has a first side and a second side opposite to the first side. The substrate further has a first calibrating region and a second calibrating region on the first side, on each of which two pads are provided, and the pads on the first calibrating region are or are not electrically connected to each other. A resistance device is provided on the second side of the substrate, wherein the resistance device has a predetermined resistance, and has opposite ends electrically connected to the pads on the second calibrating region.