Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: A method for detecting defects in products from images thereof and an electronic device applying the method inputs a defect image repair data set into an autoencoder to train the autoencoder, and generates a reconstructed image, calculates a reference error value between the sample image and the reconstructed image by a preset error function, and set a threshold value based on the reference error value. The electronic device inputs an image possibly revealing a defect into the autoencoder and generates the reconstructed image corresponding to the image to be detected, and uses the preset error function to calculate the reconstruction error between the image and the reconstructed image, thereby determining whether the image being analyzed does reveal defects. When the reconstruction error is greater than the threshold value, a determination is made that a defect is revealed.

Abstract: An electronic device is provided. The electronic device includes at least one electronic circuit, a scan line, and a scan signal conversion circuit. The scan line transmits a first scan signal. The scan signal conversion circuit is electrically connected to the at least one electronic circuit and the scan line. The scan signal conversion circuit receives the first scan signal, converts the first scan signal into a second scan signal, and provides the second scan signal to the at least one electronic circuit.

Abstract: Methods for video decoding and encoding, apparatuses and non-transitory computer-readable storage media thereof are provided. In one method for video decoding, a decoder may obtain a motion compensated chroma sample and a plurality of motion compensated luma samples for a current inter coding block. Furthermore, the decoder may obtain an adaptive cross-component filter and obtain a filtered motion compensated chroma sample based on the adaptive cross-component filter, the motion compensated chroma sample, and the plurality of motion compensated luma samples.

Abstract: An electronic apparatus performs a method of video coding. The method comprises: obtaining a video picture that includes a first component and a second component; determining a plurality of offsets associated with the second component; utilizing a sample value of the first component to obtain a class index associated with the second component; selecting an offset from the plurality of offsets for the second component according to the class index; and obtaining a sample value of the second component based on the selected offset, wherein the sample value of the first component is derived from one or more of collocated or neighboring samples of the first component relative to a sample of the second component, and wherein the sample value of the first component is derived differently for different chroma formats.

Abstract: Optical devices and methods of manufacture are presented in which glass interposers are incorporated with optical devices. In some embodiments a method includes forming a first optical package and then bonding the first optical package to a first glass interposer. The first glass interposer may then be connected to a second interposer.

Abstract: A method for video decoding is provided. The method includes obtaining, from a bitstream, a coding unit in a current picture, the coding unit including a luma block and a chroma block; obtaining a reconstructed luma sample in the luma block; determining one or more cross-component prediction models based upon a block size, the block size being a size of the luma block or a size of a reconstructed neighbouring block located on a top of or a left of the luma block; and applying at least one of the one or more cross-component prediction models to at least the reconstructed luma sample to predict a chroma sample in the chroma block.

Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for video decoding and encoding. In one decoding method, a decoder obtains at least one motion vector of a first motion vector or a second motion vector, where a coding unit is geometrically partitioned into a first part of a geometric partition and a second part of the geometric partition for prediction in a geometric partitioning mode, and the first motion vector is from the first part and the second motion vector is from the second part. Additionally, the decoder may determine a value of a stored motion vector type based on a blending width, a motion index, and a part index. Furthermore, the decoder may store a motion vector in a corresponding motion field based on the value of the stored motion vector type and the first or second motion vector.

Abstract: A pump health analysis method and a pump health analysis device using the same are provided. A standard vibration curve of a standard pump is obtained. The standard vibration curve is converted from a time domain to a frequency domain to obtain a first frequency distribution curve. A sample vibration curve of a sample pump is obtained. The sample vibration curve is converted from the time domain to the frequency domain to obtain a second frequency distribution curve. The first frequency distribution curve is compared with the second frequency distribution curve by using a cosine similarity algorithm to obtain a health index of the sample pump.

Abstract: A method of manufacturing semiconductor device includes forming a multilayer photoresist structure including a metal-containing photoresist over a substrate. The multilayer photoresist structure includes two or more metal-containing photoresist layers having different physical parameters. The metal-containing photoresist is a reaction product of a first precursor and a second precursor, and each layer of the multilayer photoresist structure is formed using different photoresist layer formation parameters. The different photoresist layer formation parameters are one or more selected from the group consisting of the first precursor, an amount of the first precursor, the second precursor, an amount of the second precursor, a length of time each photoresist layer formation operation, and heating conditions of the photoresist layers.

Abstract: Method of manufacturing semiconductor device includes forming photoresist layer over substrate. Forming photoresist layer includes combining first precursor and second precursor in vapor state to form photoresist material, wherein first precursor is organometallic having formula: MaRbXc, where M at least one of Sn, Bi, Sb, In, Te, Ti, Zr, Hf, V, Co, Mo, W, Al, Ga, Si, Ge, P, As, Y, La, Ce, Lu; R is substituted or unsubstituted alkyl, alkenyl, carboxylate group; X is halide or sulfonate group; and 1?a?2, b?1, c?1, and b+c?5. Second precursor is at least one of an amine, a borane, a phosphine. Forming photoresist layer includes depositing photoresist material over the substrate. The photoresist layer is selectively exposed to actinic radiation to form latent pattern, and the latent pattern is developed by applying developer to selectively exposed photoresist layer to form pattern.

Abstract: An embodiment photonic device may include a first terminal including silicon and a second terminal including polysilicon. The first terminal may be configured as a first three-dimensional structure extending along a first direction and having a first U-shaped portion in a first cross-sectional plane perpendicular to the first direction. Similarly, the second terminal may be configured as a second three-dimensional structure extending along the first direction and having a second U-shaped portion in the first cross-sectional plane. The photonic device may further include a capacitor dielectric layer disposed between the first terminal and the second terminal and a cladding dielectric layer surrounding the first terminal and the second terminal. The first U-shaped portion and the second U-shaped portion may be arranged in an interlocking configuration having an overlapping region that is configured as an optical transmission line in which the first direction is an optical propagation direction.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: Optical devices and methods of manufacture are presented herein. In an embodiment, an apparatus is provided that includes a notch filter, an optical signal detector positioned adjacent to the notch filter, and a mirror positioned to adjacent to the notch filter.

Abstract: The present application relates to devices and components, including apparatus, systems, and methods for non-terrestrial networks with store and forward operation.

Abstract: A method for detecting defects in images, is employed in a computer device, and stored in a storage medium. The method trains an autoencoder model using unblemished images, inputting an image to be detected into the autoencoder model, and obtaining a reconstructed image. An image error is calculated between the image to be detected and the reconstructed image, and the image error is inputted into a student's t-distribution and a calculation result is obtained. In response that the calculation result falls within a preset defect determination criterion range, the image to be detected is determined to be an unblemished image. In response that the calculation result does not fall within the preset defect determination criterion range, the image to be detected is determined to be a defective image. The method improves the efficiency and accuracy of defect detection.

Abstract: A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.

Abstract: A product defect detection method which includes acquiring a detection image of a product to be detected is provided. The method further includes dividing the detection image into a first preset number of detection blocks. Once a detection result of each detection block is obtained by inputting each detection block into a preset defect recognition model, according to a position of each detection block in the detection image, a detection result of the product is determined according to the detection result of each detection block.

Abstract: A method for video decoding is provided. The method includes obtaining, from a video bitstream, a coding unit in a current picture; selecting a plurality of sets of neighboring samples of the coding unit; determining one or more cross-component prediction models based on the plurality of sets of neighboring samples; obtaining at least one reconstructed luma sample in the luma block that corresponds to a chroma sample in the at least one chroma block; and applying at least one of the one or more cross-component prediction models to the at least one reconstructed luma sample to predict the chroma sample.

Abstract: A method for manufacturing an electronic device is provided. The method includes providing a first substrate. The method further includes forming a bank layer on the first substrate. The bank layer includes a bank wall and a first opening, and the first opening adjacent to the bank wall. The method further includes forming a light conversion layer in the first opening. The method further includes forming a spacer on the bank wall. The method further includes providing a second substrate. The method further includes transferring a plurality of electronic units to the second substrate. The method further includes overlapping the first substrate and second substrate, so that the spacer is located between the first substrate and the second substrate.