Patents by Inventor Chen-Kuo LU

Chen-Kuo LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9321224
    Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: April 26, 2016
    Assignee: TAIFLEX Scientific Co., Ltd.
    Inventors: Chia-Che Chuang, Yu-Chih Kao, Chen-Kuo Lu, Kuan-Yu Li, Tzu-Ching Hung, Chiu-Feng Chen
  • Publication number: 20160067932
    Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.
    Type: Application
    Filed: October 15, 2014
    Publication date: March 10, 2016
    Inventors: Chia-Che Chuang, Yu-Chih Kao, Chen-Kuo Lu, Kuan-Yu Li, Tzu-Ching Hung, Chiu-Feng Chen
  • Publication number: 20150257296
    Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 10, 2015
    Applicant: TAIFLEX SCIENTIFIC CO., LTD.
    Inventors: Tzu-Ching Hung, Yu-Chen Shih, Feng-Jung Tien, Chen-Kuo Lu, Yu-Hsien Lee, Su-Ping Wu
  • Publication number: 20150108388
    Abstract: Provided is a light-absorbing composition, which is prepared by melt-extruding a mixture containing light-absorbing particle agglomerates and a polymer. The light-absorbing particle agglomerates comprises a dispersant and light-absorbing particles capped with the dispersant, and the light-absorbing particle agglomerates dispersed in the light-absorbing composition and have an average particle size ranging from 10 nanometers to 800 nanometers. Accordingly, the light-absorbing composition can effectively absorb near-infrared light and store infrared heat, and thereby providing infrared-absorbing, heat-insulating and heat-storing abilities. Furthermore, a light-absorbing structure made from the light-absorbing composition has good transparency, higher infrared absorbance, light-absorbing and heat-releasing efficiencies, and is thereby beneficial to keep the temperature equilibrium of buildings or vehicles.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 23, 2015
    Applicant: Taiflex Scientific Co., Ltd.
    Inventors: Yu-Chih Kao, Chen-Kuo Lu, Tzu-Ching Hung
  • Publication number: 20140370263
    Abstract: A plasticizable heat-insulating composition compatible with polyvinyl acetal resins and mixed with polyvinyl acetal resin for forming a mixture for a plasticizing process for making a transparent intermediate heat-insulating sheet, as well as a transparent heat-insulating sandwich-structured panel that demonstrates high transparency, high wide-range near infrared absorbance and high heat-insulation index, so as to improve their heat-insulating and energy-saving functions.
    Type: Application
    Filed: September 5, 2013
    Publication date: December 18, 2014
    Applicant: Taiflex Scientific Co., Ltd.
    Inventors: Chen-Kuo LU, Yu-Chih KAO, Chia-Che CHUANG, Tzu-Ching HUNG