Abstract: A package includes a laser diode includes a bonding layer; a first dielectric layer over the laser diode, wherein the first dielectric layer is directly bonded to the bonding layer of the laser diode; a first silicon nitride waveguide in the first dielectric layer, wherein the first silicon nitride waveguide extends over the laser diode; a second dielectric layer over the first silicon nitride waveguide; a silicon waveguide in the second dielectric layer; an interconnect structure over the silicon waveguide; and conductive features extending through the first dielectric layer and the second dielectric layer to electrically contact the interconnect structure.

Abstract: A package structure is provided, and includes an interposer, a control unit, a plurality of computing units, a signal transmission layer, and an electric-optical material. The control unit is bonded to the interposer. The computing units are disposed around and connected to the control unit. The signal transmission layer is formed in the control unit and the computing units. The electric-optical material is formed in the control unit and the computing units, and the electric-optical material overlaps the signal transmission layer.

Abstract: An optical system is provided and includes a fixed assembly, a movable element and a driving module. The fixed assembly has a main axis. The movable element is movable relative to the fixed assembly and coupled to a first optical element. The driving module is configured to drive the movable element to move relative to the fixed assembly. The driving module includes a first driving assembly and a second driving assembly, and the first driving assembly and the second driving assembly are individually operable.

Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.

Abstract: An infrared absorption film includes a polymer resin substrate, a polymer dispersant and an infrared absorption material. The infrared absorption material has a plurality of tungsten oxide and/or composite tungsten oxide nanoparticles dispersed in the polymer resin substrate by the polymer dispersant, wherein a weight ratio of the polymer dispersant to the infrared absorption material is between 0.3 and 0.6.

Abstract: A cover layer of a printed circuit board has a polymer film, a reflective composite layer and an adhesive layer. The polymer film has a melting point greater than 260° C. The reflective composite layer is mounted on one side surface of the polymer film and has a first reflective pigment. The adhesive layer is mounted on another side surface of the polymer film. Also, at a range of wavelength where a reflectivity of the cover layer is greater than 89%, absorption of the polymer film to the same range of wavelength is less than 35%. The cover layer is laminated on a printed circuit board and after surface mount technology process at a temperature ranging from 160° C. to 320° C., the cover layer has a reflectivity over 89% without yellowing and delamination.

Abstract: Provided is a light-absorbing composition, which is prepared by melt-extruding a mixture containing light-absorbing particle agglomerates and a polymer. The light-absorbing particle agglomerates comprises a dispersant and light-absorbing particles capped with the dispersant, and the light-absorbing particle agglomerates dispersed in the light-absorbing composition and have an average particle size ranging from 10 nanometers to 800 nanometers. Accordingly, the light-absorbing composition can effectively absorb near-infrared light and store infrared heat, and thereby providing infrared-absorbing, heat-insulating and heat-storing abilities. Furthermore, a light-absorbing structure made from the light-absorbing composition has good transparency, higher infrared absorbance, light-absorbing and heat-releasing efficiencies, and is thereby beneficial to keep the temperature equilibrium of buildings or vehicles.

Abstract: A plasticizable heat-insulating composition compatible with polyvinyl acetal resins and mixed with polyvinyl acetal resin for forming a mixture for a plasticizing process for making a transparent intermediate heat-insulating sheet, as well as a transparent heat-insulating sandwich-structured panel that demonstrates high transparency, high wide-range near infrared absorbance and high heat-insulation index, so as to improve their heat-insulating and energy-saving functions.