Patents by Inventor Chen Lee

Chen Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12230578
    Abstract: A semiconductor chiplet device includes a package substrate, an interposer layer, a first die and a second die. The first die includes a first interface, and the second die includes a second interface. A first side of the interposer layer is configured to arrange the first die and the second die. The first die and the second die perform a data transmission through the first interface, the interposer layer and the second interface. The package substrate is arranged on a second side of the interposer layer, and includes a decoupling capacitor. The decoupling capacitor is arranged between the first interface and the second interface, or arranged in a vertical projection area of the first interface and the second interface on the package substrate.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: February 18, 2025
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sheng-Fan Yang, Chih-Chiang Hung, Chen Lee, Yuan-Hung Lin
  • Publication number: 20230144129
    Abstract: A semiconductor chiplet device includes a package substrate, an interposer layer, a first die and a second die. The first die includes a first interface, and the second die includes a second interface. A first side of the interposer layer is configured to arrange the first die and the second die. The first die and the second die perform a data transmission through the first interface, the interposer layer and the second interface. The package substrate is arranged on a second side of the interposer layer, and includes a decoupling capacitor. The decoupling capacitor is arranged between the first interface and the second interface, or arranged in a vertical projection area of the first interface and the second interface on the package substrate.
    Type: Application
    Filed: March 10, 2022
    Publication date: May 11, 2023
    Inventors: Sheng-Fan YANG, Chih-Chiang HUNG, Chen LEE, Yuan-Hung LIN
  • Publication number: 20070169112
    Abstract: An operating system installation method appended with driver programs and related structure is disclosed. The structure, and the method as well, is applied to a computer equipment for appending driver programs needed by hardware units of the computer equipment in an original operating system installation program. The structure includes a loading module, an acquiring module and a mapping module. The method loads an operating system installation into a memory of the computer equipment, maps the driver programs onto system kernel parameters of the operating system installation program to update the operating system installation program, and burns the updated operating system installation program onto a disk, so as to generate an operating system installation disk suit for the hardware units of the computer equipment.
    Type: Application
    Filed: October 31, 2005
    Publication date: July 19, 2007
    Applicant: Inventec Corporation
    Inventors: Ming Wu, Chen Lee
  • Publication number: 20070143540
    Abstract: A RAID setting system and related method are used in a computer having at least a RAID controller for controlling the RAID controller to execute a corresponding operation of the RAID configuration according to a setting result. The system includes a database, a detecting module, a setting module and a processing module. The method includes storing operating flow data of a RAID configuration corresponding to the RAID controller in a database, scanning the RAID controller connected in the computer to select a specified RAID controller, providing a setting interface which can set parameters for the RAID configuration corresponding to the RAID controller, and invoking an operating flow data of the RAID controller according to a setting result so as to control the RAID controller to execute a corresponding operation of the RAID configuration. A setting operation of the RAID can be simplified and working efficiency can be enhanced as well.
    Type: Application
    Filed: December 16, 2005
    Publication date: June 21, 2007
    Applicant: Inventec Corporation
    Inventors: Chen Lee, Margaret Chen, Fei Chen
  • Publication number: 20050063763
    Abstract: A printing module mounted inside the top cover of a barcode printer and adapted to print a barcode on a sheet member is constructed to include an output unit having a relatively higher first mounting face and a relatively lower second mounting face and a USB connector, a bottom panel affixed to the second mounting face of the output unit and hooked on the bottom side of the output unit, a locating plate affixed to the first mounting face of the output unit, a holder frame coupled to the locating plate and adapted to detachably secure the printing module to the inside of the top cover of the barcode printer by a hook joint.
    Type: Application
    Filed: September 22, 2003
    Publication date: March 24, 2005
    Inventor: Chen Lee
  • Publication number: 20050056993
    Abstract: A sheet member output mechanism includes two brackets adapted detachably mounted in the output side of the bottom shell of a labeling machine to support a sheet-transfer cylinder, and a driven member mounted on the shaft of the sheet-transfer cylinder and meshed with the transmission mechanism of the labeling machine for rotating the sheet-transfer cylinder. Paper sensors are provided to detect the presence of a sheet member at the output side of the bottom shell or removal of the printed sheet member from the output port of the front cover of the labeling machine.
    Type: Application
    Filed: September 17, 2003
    Publication date: March 17, 2005
    Inventor: Chen Lee
  • Patent number: 5784228
    Abstract: A magnetic head is fabricated with a thin film transducer including first and second magnetic layers, having an insulation layer defining a transducing gap between the pole tips of the magnetic layers, and a top insulating layer over the transducer for protecting the transducer from humidity and mechanical shock. The insulation gap layer is configured with a compound angled section of a baked resist insulation layer having a steep angular portion and a second angled portion of substantially the same slope preceding a substantially flat area. In this way, maximum contact is provided between the protective top insulation and the lower insulation gap layer in order to minimize cracking, without displacing the coil assembly from its preferred location close to zero throat so that optimum coil efficiency is obtained.
    Type: Grant
    Filed: July 9, 1997
    Date of Patent: July 21, 1998
    Assignee: Read-Rite Corporation
    Inventors: Mark D. Thomas, Son Tran, Chen Lee