Patents by Inventor Chen Lien Chiang

Chen Lien Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and socket assembly for testing ball grid array package in real system
    Patent number: 7221147
    Abstract: A method for testing a ball grid array package includes the following steps. Firstly, a printed circuit board having a plurality of contact pads thereon is provided. Then, a ball grid array test socket assembly having a connecting interface, a plurality of resilient contact members and a plurality of conducting members penetrating through the connecting interface is provided. The first terminal of each conducting member is in contact with the second terminal of corresponding resilient contact member. The second terminal of each conducting member is in contact with corresponding contact pad on the printed circuit board. Afterwards, the ball contacts of the ball grid array package are in contact with corresponding first terminals of the resilient contact members so as to test the ball grid array package.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: May 22, 2007
    Assignee: RamTek Technology Inc.
    Inventors: Cheng Hsun Tsai, Chen Lien Chiang