Patents by Inventor Chen-Lin Huang

Chen-Lin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CIRCUIT BOARD ADAPTED TO FAN AND FAN STRUCTURE
    Publication number: 20100150757
    Abstract: A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component. A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.
    Type: Application
    Filed: February 24, 2010
    Publication date: June 17, 2010
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Yu-liang Lin, Yu-lung Dung, Yueh-lung Huang, Chen-Lin Huang
  • CIRCUIT BOARD ADAPTED TO FAN AND FAN STRUCTURE
    Publication number: 20080112136
    Abstract: A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component. A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.
    Type: Application
    Filed: January 11, 2008
    Publication date: May 15, 2008
    Applicant: DELTA ELECTRONICS, INC.
    Inventors: Yu-Liang Lin, Yu-Lung Dung, Yueh-Lung Huang, Chen-Lin Huang
  • Circuit board adapted to fan and fan structure
    Publication number: 20040202560
    Abstract: A circuit board adapted to a fan comprises a circuit region and a heat-dissipative film. The circuit region is provided on a first surface of the circuit board and comprises at least one heat-generating component thereon. The heat-dissipative film is coated on an edge portion of the first surface and is in contact with the heat-generating component. A plurality of openings through the heat-dissipative film, a protrusion of the circuit board, a cutout in the protrusion to expose the heat-generating component to airflow, etc., have been disclosed and claimed for enhancing the efficiency in heat dissipation. A heat sink may also be provided on a second surface opposite to the first surface of the circuit board. The heat sink is connected to the heat-dissipative film to help dissipate the heat generated by the operation of the fan.
    Type: Application
    Filed: March 10, 2004
    Publication date: October 14, 2004
    Inventors: Yu-Liang Lin, Yu-Lung Dung, Yueh-Lung Huang, Chen-Lin Huang