Patents by Inventor Chen Liu

Chen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11990843
    Abstract: A control circuit for an isolated power converter includes a first sensing circuit that senses a secondary side output voltage and produces a pulse width modulation (PWM) signal having a duty cycle that is proportional to a value of the secondary side output voltage. The PWM is transferred a cross the converter isolation barrier to the primary side, and a primary side circuit receives the PWM signal and outputs a control signal. A controller determines the value of the secondary side output voltage from the control signal and uses the value to control primary side power switching devices of the isolated power converter to regulate the secondary side output voltage at a selected value.
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: May 21, 2024
    Assignee: Queen's University at Kingston
    Inventors: Yan-Fei Liu, Yang Chen, Binghui He, Wenbo Liu, Bo Sheng
  • Publication number: 20240160399
    Abstract: This document describes systems and techniques for facilitating spatial rediscovery using on-device hardware. For example, an audio input mechanism associated with a compact device can be activated and an audio signal can be generated by an audio output mechanism associated with an external device. The audio signal can be received at the audio input mechanism associated with the compact device. The receipt of the audio signal may cause the audio input mechanism to produce electrical signals having encoded information associated with the audio signal. The electrical signals can then be transmitted to the external device as wireless signals. Based on an analysis of the transmitted wireless signals, a spatial positioning of the compact device relative to the external device can be determined. Based on the determination of the spatial positioning, a location indicator can be provided via the external device.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 16, 2024
    Applicant: Google LLC
    Inventors: Wei Liang Liu, Pei-Chen Chuang
  • Patent number: 11984516
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: May 14, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: 11984419
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
  • Publication number: 20240153168
    Abstract: Provided are an interaction method and apparatus in a live streaming room, a device, and a storage medium. The method comprises: in response to a trigger operation for a preset drawing entry on a live streaming room page, jumping to a graphic drawing page from the live streaming room page, a drawing trajectory set for a preset object being displayed on the graphical drawing page; when a drawing stroke on the graphic drawing page is received, matching the drawing stroke with the drawing trajectory; and if it is determined that the drawing stroke is successfully matched with the drawing trajectory, displaying prompt information about successful participation in a preset activity, the preset activity and the preset drawing entry having a correspondence.
    Type: Application
    Filed: March 14, 2022
    Publication date: May 9, 2024
    Inventors: Ling YANG, Manting WANG, Sijing WANG, Ji LIU, Feifei TANG, Xiaoben WANG, Man ZHANG, Zaiyou RUAN, Yuna HU, Zihao CHEN, Siqin LIU, Chen ZHONG, Suyao ZHANG, Yichao WU, Changhua HE, Zenan LI, Yibin CHEN, Jialuo ZHANG, Ping LI, Xinyue GONG, Jialong ZHAO, Fanglu ZHONG, Lin ZHOU, Fukang HONG, Xiangzeng MENG, Qian LI
  • Publication number: 20240152330
    Abstract: A k-cluster residue number system has a processor and a memory. The processor is used to generate an addition and subtraction look-up table and a multiplication look-up table based on periodic behaviors of the modulo to compress the sizes of the addition and subtraction look-up table and the multiplication look-up table. The addition and subtraction look-up table has 2mi cells for recording values from zero to (mi?1) in an ascending order twice, wherein mi is a coprime integer of a modular set of the k-cluster residue number system. The multiplication look-up table has S cells, where S = ( m i 2 - 1 4 ) .
    Type: Application
    Filed: November 2, 2022
    Publication date: May 9, 2024
    Applicant: Kneron Inc.
    Inventors: Oscar Ming Kin Law, Chun Chen Liu
  • Publication number: 20240150346
    Abstract: A compound, as represented by formula I, as a TLR7 agonist, a method for preparing the compound, and the use of the compound in treating diseases mediated by the TLR7 agonist are provided. Studies on the activity of a human-derived receptor, a TLR7 agonist, show that compounds have a strong agonistic effect on the human-derived receptor, TLR7, and can be used as a foreground compound for treating diseases mediated by the TLR7 agonist.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 9, 2024
    Inventors: Yunlong SONG, Chen ZHANG, Fang GAO, Weimin LIU, Qun DANG, Pan LI, Zhou YIN, Xin CAI, Xiaodan FU, Jianbin MA
  • Publication number: 20240153769
    Abstract: A first mask and a second mask are sequentially provided to perform a multi-step exposure and development processes. Through proper overlay design of the first mask and the second mask, conductive wirings having acceptable overlay offset are formed.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jie Chen, Hsien-Wei Chen, Tzuan-Horng Liu, Ying-Ju Chen
  • Publication number: 20240151428
    Abstract: An air purifier includes a body and a control module. The body is provided with a case, a case door arranged on the case and a door lock; the case is provided with at least one filter, at least one ultraviolet lamp and at least one controller capable of being operated; the door lock includes a magnetic reed switch and a lock matched with the magnetic reed switch; the lock is provided with a lock tongue and a magnet forming a magnetic attraction relationship with the magnetic reed switch; and the lock is provided with a first state, in which the magnet is released from the magnetic attraction relationship when the lock tongue is rotated to a specific angle, and a second state when the magnetic attraction relationship of the magnet is not destroyed.
    Type: Application
    Filed: November 7, 2022
    Publication date: May 9, 2024
    Inventor: Shen-Chen LIU
  • Publication number: 20240152329
    Abstract: A k-cluster residue number system has a processor and memory coupled to the processor. The processor is used to generate a modular set composed of P coprime integers, generate a dynamic range by taking a product of the P coprime integers, generate quotient indices for all integers in the dynamic range, generate row indices for all integers in the dynamic range, generate column indices for all integers in the dynamic range, and generate a look-up table according to the quotient indices, row indices, the column indices, and all integers in the dynamic range. P is an integer greater than 2, and the P coprime integers include 2. The memory is used to store the look-up table.
    Type: Application
    Filed: November 1, 2022
    Publication date: May 9, 2024
    Applicant: Kneron Inc.
    Inventors: Oscar Ming Kin Law, Chun Chen Liu
  • Patent number: 11977687
    Abstract: The present invention provides a virtual keyboard for inputting Chinese characters and a configuring method thereof, an input method, and a Chinese character input system. The configuring method includes the following steps: setting a geometric layout of the virtual keyboard; and setting initials and finals on available keys of the virtual keyboard respectively using a cost function-based search algorithm so as to obtain an optimal layout of initial keys and final keys, wherein the initial keys and the final keys in the optimal layout are set based on a minimum cost function value for spelling all Chinese syllables, and the minimum cost function value is a minimum sum of weighted distances of the initial keys and the final keys for all the Chinese syllables.
    Type: Grant
    Filed: February 12, 2019
    Date of Patent: May 7, 2024
    Assignee: Tsinghua University
    Inventors: Xiaorong Gao, Bingchuan Liu, Xinyi Yan, Chen Yang, Shuming Xu
  • Patent number: 11976267
    Abstract: The invention provides a recombinant Escherichia coli strain for producing succinic acid and a construction method thereof. The by-product encoding genes in the E. coli strain FMME-N-2 are knocked out to obtain the E. coli strain FMME-N-5 (?focA-pflB-?ldhA-?pta-ackA); and the phosphoenolpyruvate carboxykinase pck derived from Actinobacillus succinogenes and the phosphite dehydrogenase ptxD derived from Pseudomonas stutzeri were overexpressed. The constructed plasmid pTrcHisA-pck-ptxD was introduced into the expression host E. coli FMME-N-5 (?focA-pflB-?ldhA-?pta-ackA), and the cells were screened in a plate containing ampicillin, to obtain an engineered strain E. coli FMME-N-5 (?focA-pflB-?ldhA-?pta-ackA)-pck-ptxD that can efficiently produce succinic acid. After fermentation by a two-stage fermentation strategy, the production of succinic acid reaches 137 g/L, the yield of succinic acid is up to 1 g/g glucose, and the space time yield is 1.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: May 7, 2024
    Assignee: JIANGNAN UNIVERSITY
    Inventors: Liming Liu, Wenxiu Tang, Chen Shen, Qiuling Luo, Xiulai Chen, Jia Liu, Cong Gao, Wei Song
  • Patent number: 11978694
    Abstract: The present invention provides a dual-substrate antenna package structure and a method for manufacturing the same. The package structure includes a main substrate and at least one antenna substrate. The antenna substrate is provided on a pad of the main substrate by an array of solder balls placed on the antenna substrate, at least one chip is electrically connected to the main substrate, and metal wiring provided on the main substrate electrically connects the pad to the chip. The array of solder balls includes support solder balls and conventional solder balls, and the support solder balls have a melting point high than 250° C. A spacing distance between the antenna substrate and the main substrate can be kept stable during the reflow soldering process and subsequent processes because the support solder balls having the high melting point can always maintain the stability of the structure during the reflow soldering process.
    Type: Grant
    Filed: November 20, 2021
    Date of Patent: May 7, 2024
    Assignee: JCET GROUP CO., LTD.
    Inventors: Shuo Liu, Chen Xu, Yaojian Lin, Haitao Shi
  • Publication number: 20240141422
    Abstract: Techniques are described for identifying a genetic variant in a test sample by comparing sequences reads obtained from the test sample to unique k-mers that are representative of a target genomic region. In one particular aspect, a method is described that includes generating a dictionary of a target genomic region having a set of unique k-mers by: accessing a sequence of the target genomic region, determining a set of k-mers for the target genomic region, comparing the set of k-mers for the target genomic region with one or more sets of k-mers for non-target genomic regions, and selecting the unique k-mers that do not appear in the one or more sets of k-mers for non-target genomic regions. The dictionary can then be used to identify a genetic variant in a test sample by comparing sequences reads obtained from the test sample to the unique k-mers in the dictionary.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 2, 2024
    Applicant: Sequenom, Inc.
    Inventors: Chen Zhao, Cosmin Deciu, Eyad Almasri, Tong Liu
  • Publication number: 20240141462
    Abstract: A method for smelting low-phosphorus high-manganese steel based on reduction dephosphorization of ferromanganese is provided in the present application, relating to the technical field of high-manganese steel smelting, where the dephosphorization of ferromanganese is carried out under reducing atmosphere conditions through mediate-frequency induction furnace to obtain molten ferromanganese with lower phosphorus content, which is subsequently mixed with low phosphorus molten steel obtained by smelting in oxidative period of electric arc furnace in LF ladle refining furnace to make the Mn content of steel reach the requirement of high-manganese steel, and smelting is carried out under the condition of reducing atmosphere by adjusting the composition and temperature of the molten steel to meet the requirements of the target composition of the steel grade before tapping the steel.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Tao LI, Wei LIU, Chen CHEN, Fucheng ZHANG, Min TAN, Shaopeng GU, Lin ZHANG, Qian MENG, Degang WEI, Yuhan SUN, Guangbei ZHU, Aihua ZHAO
  • Publication number: 20240145697
    Abstract: A multi-layer cathode coating for positive electrode of a rechargeable electrochemical cell (or secondary cell) (such as a lithium-ion secondary battery) and a secondary battery including a cathode having a multi-layer cathode coating. Multi-layer cathode coatings containing blends of one or more cathode active materials in certain weight ratios thereof.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Applicant: SAFT AMERICA
    Inventors: Xilin Chen, Frank Cao, Carine Margez Steinway, Kamen Nechev, Shih-Chieh Liao, Chia-Ming Chang, Dar-Jen Liu
  • Patent number: 11972566
    Abstract: Disclosed are systems, devices, and methods for detecting characteristics of an unhatched egg. A set of images of an unhatched egg are obtained, where each of the spectral images is obtained in a particular wavelength range. The set of images is processed to extract image features, where the image features includes an image texture feature. The extracted image features are processed to classify the unhatched egg according to at least one characteristic. The at least one characteristic may include fertility and/or gender.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: April 30, 2024
    Assignee: MATRIXSPEC SOLUTIONS INC.
    Inventors: Michael Ngadi, Li Liu, Chen Zheng
  • Patent number: 11971451
    Abstract: A method includes: constructing an on-wafer calibration piece model set that includes one or more on-wafer calibration piece models, where each of the one or more on-wafer calibration piece models has a corresponding on-wafer calibration piece; selecting an on-wafer calibration piece model from the on-wafer calibration piece model set; measuring the on-wafer calibration piece utilizing an on-wafer S parameter measurement system that is calibrated using a multi-thread TRL calibration method in a Terahertz frequency band, to obtain an S parameter of the on-wafer calibration piece; and calculating a plurality of different parameters that represent crosstalk of calibration pieces in the on-wafer calibration piece model, according to an admittance calculated according to the S parameter and an admittance formula corresponding to the on-wafer calibration piece model.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: April 30, 2024
    Assignee: The 13th Research Institute of China Electronics Technology Group Corporation
    Inventors: Aihua Wu, Yibang Wang, Faguo Liang, Chen Liu, Ye Huo, Peng Luan, Jing Sun, Yanli Li
  • Patent number: 11967652
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: D1026178
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: May 7, 2024
    Assignee: COSDA MANUFACTURING COMPANY
    Inventor: Lai-Chen Liu