Patents by Inventor Chen Liu

Chen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141422
    Abstract: Techniques are described for identifying a genetic variant in a test sample by comparing sequences reads obtained from the test sample to unique k-mers that are representative of a target genomic region. In one particular aspect, a method is described that includes generating a dictionary of a target genomic region having a set of unique k-mers by: accessing a sequence of the target genomic region, determining a set of k-mers for the target genomic region, comparing the set of k-mers for the target genomic region with one or more sets of k-mers for non-target genomic regions, and selecting the unique k-mers that do not appear in the one or more sets of k-mers for non-target genomic regions. The dictionary can then be used to identify a genetic variant in a test sample by comparing sequences reads obtained from the test sample to the unique k-mers in the dictionary.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 2, 2024
    Applicant: Sequenom, Inc.
    Inventors: Chen Zhao, Cosmin Deciu, Eyad Almasri, Tong Liu
  • Publication number: 20240141462
    Abstract: A method for smelting low-phosphorus high-manganese steel based on reduction dephosphorization of ferromanganese is provided in the present application, relating to the technical field of high-manganese steel smelting, where the dephosphorization of ferromanganese is carried out under reducing atmosphere conditions through mediate-frequency induction furnace to obtain molten ferromanganese with lower phosphorus content, which is subsequently mixed with low phosphorus molten steel obtained by smelting in oxidative period of electric arc furnace in LF ladle refining furnace to make the Mn content of steel reach the requirement of high-manganese steel, and smelting is carried out under the condition of reducing atmosphere by adjusting the composition and temperature of the molten steel to meet the requirements of the target composition of the steel grade before tapping the steel.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Tao LI, Wei LIU, Chen CHEN, Fucheng ZHANG, Min TAN, Shaopeng GU, Lin ZHANG, Qian MENG, Degang WEI, Yuhan SUN, Guangbei ZHU, Aihua ZHAO
  • Publication number: 20240145697
    Abstract: A multi-layer cathode coating for positive electrode of a rechargeable electrochemical cell (or secondary cell) (such as a lithium-ion secondary battery) and a secondary battery including a cathode having a multi-layer cathode coating. Multi-layer cathode coatings containing blends of one or more cathode active materials in certain weight ratios thereof.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Applicant: SAFT AMERICA
    Inventors: Xilin Chen, Frank Cao, Carine Margez Steinway, Kamen Nechev, Shih-Chieh Liao, Chia-Ming Chang, Dar-Jen Liu
  • Patent number: 11972566
    Abstract: Disclosed are systems, devices, and methods for detecting characteristics of an unhatched egg. A set of images of an unhatched egg are obtained, where each of the spectral images is obtained in a particular wavelength range. The set of images is processed to extract image features, where the image features includes an image texture feature. The extracted image features are processed to classify the unhatched egg according to at least one characteristic. The at least one characteristic may include fertility and/or gender.
    Type: Grant
    Filed: May 11, 2023
    Date of Patent: April 30, 2024
    Assignee: MATRIXSPEC SOLUTIONS INC.
    Inventors: Michael Ngadi, Li Liu, Chen Zheng
  • Patent number: 11971451
    Abstract: A method includes: constructing an on-wafer calibration piece model set that includes one or more on-wafer calibration piece models, where each of the one or more on-wafer calibration piece models has a corresponding on-wafer calibration piece; selecting an on-wafer calibration piece model from the on-wafer calibration piece model set; measuring the on-wafer calibration piece utilizing an on-wafer S parameter measurement system that is calibrated using a multi-thread TRL calibration method in a Terahertz frequency band, to obtain an S parameter of the on-wafer calibration piece; and calculating a plurality of different parameters that represent crosstalk of calibration pieces in the on-wafer calibration piece model, according to an admittance calculated according to the S parameter and an admittance formula corresponding to the on-wafer calibration piece model.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: April 30, 2024
    Assignee: The 13th Research Institute of China Electronics Technology Group Corporation
    Inventors: Aihua Wu, Yibang Wang, Faguo Liang, Chen Liu, Ye Huo, Peng Luan, Jing Sun, Yanli Li
  • Patent number: 11967272
    Abstract: A sweep voltage generator and a display panel are provided. The sweep voltage generator includes an output node, a current generating block and a voltage regulating block. The output node is used to provide a sweep signal. The current generating block is coupled to the output node, includes a detection path for detecting an output load variation on the output node, and adjusts the sweep signal provided by the output node based on the output load variation. The voltage regulating block is coupled to the output node for regulating a voltage of the output node.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: April 23, 2024
    Assignees: AUO Corporation, National Cheng-Kung University
    Inventors: Chih-Lung Lin, Yi-Chen Huang, Chih-I Liu, Po-Cheng Lai, Ming-Yang Deng, Chia-En Wu, Ming-Hung Chuang, Chia-Tien Peng
  • Patent number: 11967652
    Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: April 23, 2024
    Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.
    Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
  • Patent number: 11966170
    Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ai-Jen Hung, Yung-Yao Lee, Heng-Hsin Liu, Chin-Chen Wang, Ying Ying Wang
  • Patent number: 11967086
    Abstract: A method for trajectory generation based on player tracking is described herein. The method includes determining a temporal association for a first player in a captured field of view and determining a spatial association for the first player. The method also includes deriving a global player identification based on the temporal association and the spatial association and generating a trajectory based on the global player identification.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: April 23, 2024
    Assignee: INTEL CORPORATION
    Inventors: Yikai Fang, Qiang Li, Wenlong Li, Chenning Liu, Chen Ling, Hongzhi Tao, Yumeng Wang, Hang Zheng
  • Patent number: 11963845
    Abstract: A registration method and an electronic device for visual navigation in dental implant surgery, comprising obtaining a three-dimensional model of a target tooth to be registered, an entity model of the target tooth and a second model of the target tooth, obtaining a position and attitude matrix of the three-dimensional model in a virtual coordinate system according to the coordinates of at least three points on a three-dimensional model of a substrate after the registration of the three-dimensional model in the virtual coordinate system, mounting the entity model of the target tooth onto a registration standard board, obtaining a position and attitude matrix of the entity model in the visual coordinate system according to three optical marks and the points on the entity model corresponding to the three points, and obtaining a correspondence between the virtual coordinate system and the visual coordinate system according to two position and attitude matrices.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: April 23, 2024
    Assignee: BEIJING YAKEBOT TECHNOLOGY CO. LTD.
    Inventors: Lifeng Wang, Hongpeng Liu, Chen Shen, Jianyong Ren
  • Publication number: 20240129043
    Abstract: A real-time vector analysis method for detecting an optical signal with a bandwidth greater than 1 THz includes: mapping, by a time-lens focusing system, a spectrum of a signal under test to different temporal location information; obtaining, by fully broadening an ultrashort pulse by a dispersion, a time domain spectrum of the ultrashort pulse to form a chirped swept frequency source; inputting an out of the signal under test after passing through the time-lens and the chirped swept frequency source to a coherent receiver to realize an interference process and a conversion of an optical signal to an electrical signal, and recovering an intensity information and a phase information of frequency domain of the signal under test from the electrical signal by data acquisition and processing; then recovering a full-field information of time domain of the signal under test by a Fourier inverse transform.
    Type: Application
    Filed: December 16, 2023
    Publication date: April 18, 2024
    Applicant: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Chi ZHANG, Xinliang ZHANG, Lun LI, Yuchong CAI, Yaoshuai LI, Chen LIU
  • Publication number: 20240127993
    Abstract: Provided are an auxiliary alloy casting piece, a high-remanence and high-coercive force NdFeB permanent magnet, and preparation methods thereof. The method for preparing the auxiliary alloy casting piece includes the following steps: providing an auxiliary alloy material including, by mass percentage, 40% to 45% of Pr, 1% to 2% of Co, 0.5% to 1% of Ga, 0.6% to 0.8% of B, 0.1% to 0.2% of V, 0.3% to 0.7% of Ti, and a balance of Fe; smelting the auxiliary alloy material to obtain a smelted material; and subjecting the smelted material to a quick-setting casting to obtain the auxiliary alloy casting piece; where the quick-setting casting includes a refining and a casting in sequence.
    Type: Application
    Filed: December 30, 2022
    Publication date: April 18, 2024
    Inventors: Feng XIA, Yulong FU, Chen CHEN, Hailong ZHENG, Zichao WANG, Yonghong LIU, Caina SUN, Yu WANG
  • Publication number: 20240123479
    Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.
    Type: Application
    Filed: October 28, 2021
    Publication date: April 18, 2024
    Applicant: NATIONAL UNIVERSITY OF TAINAN
    Inventors: Yao-Hsien FU, Hsueh-Pin TAI, Chia-Tsung HUNG, Cheng-Chen LIU, Chun-Chih HU, How-Wei KE
  • Publication number: 20240124163
    Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.
    Type: Application
    Filed: December 19, 2022
    Publication date: April 18, 2024
    Applicant: National Cheng Kung University
    Inventors: Yueh-Heng Li, Yu-Ting Wu, Chao-Wei Huang, Wei-Cheng Lo, Hsun-Chen Hsieh, Ping-Han Huang, Yi-Long Huang, Sheng-Wen Liu, Wei-Cheng Lien
  • Publication number: 20240128214
    Abstract: An integrated circuit structure includes an aluminum pad layer on a dielectric stack, a passivation layer covering the aluminum pad layer, and an aluminum shield layer including aluminum routing patterns disposed directly above an embedded memory area and embedded in the dielectric stack. The aluminum shield layer is electrically connected to the uppermost copper layer through a plurality of tungsten vias. The plurality of tungsten vias is embedded in the dielectric stack.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Aaron Chen, Chi Ren, Yi Hsin Liu
  • Patent number: 11959826
    Abstract: The disclosure is an engine simulation test device capable of realizing an ultrahigh compression temperature and pressure, belonging to the field of a diesel engine high-temperature and high-pressure system, solving the problems that the existing engine simulation test cannot achieve ultra-high compression temperature and pressure, and the temperature and pressure are not adjustable. It includes a compressed air inlet mechanism, a nitrogen gas inlet mechanism, a pressure stabilizing mechanism, a cyclic heating mechanism, an air inlet mechanism and a fast compressor mechanism.
    Type: Grant
    Filed: December 29, 2021
    Date of Patent: April 16, 2024
    Assignee: HARBIN ENGINEERING UNIVERSITY
    Inventors: Long Liu, Yue Wu, Dai Liu, Qian Xiong, Xinru Shi, Shihai Liu, Chen An, Qihao Mei
  • Publication number: 20240117714
    Abstract: A method of increasing crude oil production by CO2 storage in an aquifer and dumpflooding includes the following steps. Wells are drilled in an aquifer in an oil-bearing basin for large-scale CO2 storage. A low-production and low-efficiency well in an oil-bearing stratum away from the CO2 storage injection well is selected as an artesian injection well. Formation water in the aquifer with increasing pressure is controlled and guided into the oil-bearing stratum to realize oil displacement by dumpflooding in the oil-bearing stratum.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 11, 2024
    Inventors: Xianmin ZHANG, Qihong FENG, Chen LIU, Kuankuan WU, Zangyuan WU, Yiming ZHANG, Weina LIU, Jianwei GU
  • Publication number: 20240120313
    Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Publication number: 20240117208
    Abstract: Phosphor materials and devices containing such phosphor materials are disclosed. An ink composition of in accordance with the present disclosure comprises a phosphor material comprising a Mn4+ doped phosphor of formula 1, Ax[MFy]:Mn4+ (I), and at least one rare earth containing Garnet phosphor, the at least one rare earth Garnet phosphor is present in the phosphor material in an amount of at least about 80 wt % based on the weight of the phosphor material, wherein the at least one rare earth containing a Garnet phosphor has a D50 particle size from about 0.5 microns to about 15 microns, where A is Li, Na, K, Rb, Cs, or a combination thereof; M is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Y, La, Nb, Ta, Bi, Gd, or a combination thereof; x is the absolute value of the charge of the [MFy] ion; and y is 5, 6 or 7.
    Type: Application
    Filed: November 6, 2023
    Publication date: April 11, 2024
    Inventors: Aharon Yakimov, Gurvinder Singh Khinda, James E. Murphy, Felippe Pavinatto, Daniel Peter DePuccio, Kathleen Ann Maleski-Yadeski, Jie Jerry Liu, Zeying Chen
  • Publication number: 20240118135
    Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hong-Ji Huang, Yu-Chen Liu, Kuo-Wei Tseng, Chun-Wei Huang, Chi-Fong Lee