Abstract: An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.

Abstract: A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

Abstract: A LED chip is bonded on a large submount serving as a heat sink. The submount is punched out from a thin metal sheet together with two other sections of lead frames for the LED and held together with insulating material. The planar structure makes the package thin. A transparent lens may be mounted over the submount. More than one LED of same or different color can be mounted on the submount.

Abstract: An edge lit illumination system is directed to providing backlighting utilizing a luminescent impregnated lightguide. The apparatus includes an LED radiation source providing a first radiation and a lightguide optically coupled to the LED radiation source including a luminescent material embedded or coated on an output surface of the lightguide designed to absorb the first radiation, and emit one or more radiations. The illumination system may further include additional optical components such as reflective layers, for directing radiation striking the back surfaces of the light guide back into the lightguide, as well as diffusion layers, UV reflectors, and polarizers.

Abstract: A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).