Abstract: A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode.

Abstract: First and second light emitting diode (LED) arrays, which each includes a corresponding number of LED dies, are disposed on a substrate proximately and substantially parallel to one another. Each pair of substantially paralleled LED dies of the first and second arrays is covered by substantially transparent optical encapsulant. The optical encapsulant is one of covered by a reflective layer for a UV to visible spectral region and shaped for total internal light reflection. The substrate is diced along an axis extending in parallel and between the first and second LED arrays.

Abstract: A side emitting LED is provided, and it includes a substrate, at least one LED chip, a light transmitting package and a light reflector. The substrate includes a base, and the LED chip is mounted on the base. The light transmitting package is a half-closed form and is mounted on the substrate to hold the LED chip. The light reflector is disposed on the package and corresponds to the LED chip to alter the light direction radiated from the LED chip. Therefore, the light radiated from the LED chip is reflected by the corresponding light reflector and passes through the light transmitting package to be emitted laterally.

Abstract: A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.

Abstract: A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode.

Abstract: A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

Abstract: A lighting apparatus comprising at least one light emitting diode is disposed on an interconnect board to emit ultraviolet or blue radiation. A polymeric layer including a luminophor is disposed about the lighting apparatus to convert at least a portion of the radiation emitted from the LED into visible light. The polymeric layer is shrinkable to conform to a shape enclosing the light emitting diode.

Abstract: Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the sub-mount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.

Abstract: Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the sub-mount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.

Abstract: Surface mount light emitting diode (LED) packages each contain a light emitting diode (LED) die (24). A plurality of arrays of openings are drilled into an electrically insulating sub-mount wafer (10). A metal is applied to the drilled openings to produce a plurality of via arrays (12). The LED dice (24) are flip-chip bonded onto a frontside (16) of the sub-mount wafer (10). The p-type and n-type contacts of each flip-chip bonded LED (24) electrically communicate with a solderable backside (18) of the sub-mount wafer (10) through a via array (12). A thermal conduction path (10, 12) is provided for thermally conducting heat from the flip-chip bonded LED dice (24) to the solderable backside (18) of the sub-mount wafer (10). Subsequent to the flip-chip bonding, the sub-mount wafer (10) is separated to produce the surface mount LED packages.

Abstract: A display module comprises a plurality of light emitting elements, a metal plate, a circuit board and a display panel. The light emitting elements and the circuit board are arranged on the metal plate, and the light emitting elements are wire bonded to the circuit board. A lens is formed atop the light emitting element. The metal plate is arranged with the light emitting elements and the circuit board is positioned on lateral side or around the display panel. The metal plate provides excellent heat-dissipation effect and the light emitting elements can emit more uniform light.

Abstract: A manufacturing method for white light source utilizes an ultraviolet light source and suitable phosphors. One of the phosphors is directly excited by the ultraviolet light source and generates a radiation with longer wavelength. Other phosphors are excited by the radiation with longer wavelength and generate radiation with much longer wavelength. The lights generated by those phosphors are mixed to form a white light.

Abstract: A manufacturing method for white light source utilizes an ultraviolet light source and suitable phosphors. One of the phosphors is directly excited by the ultraviolet light source and generates a radiation with longer wavelength. Other phosphors are excited by the radiation with longer wavelength and generate radiation with much longer wavelength. The lights generated by those phosphors are mixed to form a white light.

Abstract: A traffic light comprises a lampshade having a base, a copper plate placed on an inner side of the base and a plurality of LEDs. The copper plate is aligned with 5-45° angle with respect to the base of the lampshade. The LEDs are arranged on the copper plate. The traffic light uses less number of LEDs and has enhanced security.

Abstract: A display module comprises a plurality of light emitting elements, a metal plate, a circuit board and a display panel. The light emitting elements and the circuit board are arranged on the metal plate, and the light emitting elements are wire bonded to the circuit board. A lens is formed atop the light emitting element. The metal plate is arranged with the light emitting elements and the circuit board is positioned on lateral side or around the display panel. The metal plate provides excellent heat-dissipation effect and the light emitting elements can emit more uniform light.

Abstract: A light emitting diode assembly with low thermal resistance comprises an LED, a circuit board and a heat-dissipating substrate. The LED has a die mounted on a heat-dissipating plate and pads connected to a printed circuit board. The LED is mounted on a circuit board and a heat-dissipating substrate, whereby the thermal resistance of the LED assembly can be advantageously reduced to enhance the performance of the LED assembly.