Abstract: A chip package structure includes an interposer structure that contains a package-side redistribution structure, an interposer core assembly, and a die-side redistribution structure. The interposer core assembly includes at least one silicon substrate interposer, and each of the at least one silicon substrate interposer includes a respective silicon substrate, a respective set of through-silicon via (TSV) structures vertically extending through the respective silicon substrate, a respective set of interconnect-level dielectric layers embedding a respective set of metal interconnect structures, and a respective set of metal bonding structures that are electrically connected to the die-side redistribution structure. The chip package structure includes at least two semiconductor dies that are attached to the die-side redistribution structure, and an epoxy molding compound (EMC) multi-die frame that laterally encloses the at least two semiconductor dies.

Abstract: Provided is a lentivirus packaging system, which comprises: a transfer plasmid comprising a nucleotide sequence of TAR-reserved-chimeric 5? long terminal repeat (LTR); at least one packaging plasmid comprising a nucleotide sequence encoding TAR RNA binding protein, a nucleotide sequence of rev gene, a nucleotide sequence of gag gene, and a nucleotide sequence of pol gene; and an envelope plasmid. Due to the expression of gene of TAR RNA binding protein by the packaging plasmids, the produced lentivirus has higher virus titer and can improve the transduction rate and the gene delivery efficiency during cell transduction. The present invention further provides a method of improving lentivirus production in a host cell, which comprises using the lentivirus packaging system to transfect the host cell. The present invention further provides a cell transduced by the lentivirus and a method of using the cell for treating cancer.

Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.

Abstract: The present invention provides a method for producing CAR T-cells enriched with stem cell-like memory T-cells (Tscm), comprised of: (1) providing PBMCs; (2) isolating of T cells from PBMCs using magnetic beads coated with T-cell specific antibodies; (3) positively selecting T cells by culturing them in the form of T cell-magnetic bead complexes; (4) adding CAR-expressing lentivirus to the activated human T cell-magnetic bead complexes, for transduction of human T cells into CAR-T cells on the human T cell-magnetic bead complexes to obtain human CAR-T cell-magnetic bead complexes; (5) obtaining human CAR-T cells by dissociating the human CAR-T cells from the human CAR-T cell-magnetic bead complexes; and (6) further culturing CAR-T cells to obtain CAR-T cells enriched with Tscm. The present invention expands T cells in a short period of time to obtain CAR-T cells enriched with Tscm, which is suitable for CAR-T immunotherapy.

Abstract: An optical lens includes a first lens group and a second lens group. The first lens group has at least two lenses that include at least one aspheric lens, the second lens group has at least four lenses that includes at least one aspheric lens, and a total number of lenses with refractive powers in the optical lens is smaller than nine. The first and the second lens groups include a first lens, a second lens, a third lens, a fourth lens, a fifth lens and a sixth lens in order from the magnified side to the minified side. The first lens to the sixth lens have respective refractive powers of negative, negative, positive, positive, negative and positive.

Abstract: A clamp assembly includes at least one clamp which is provided to clamp a workpiece in electroless plating, etching, electroplating or cleaning process. The clamp includes a base, a clamping element and a limiting element. The base is mounted on a carrier and includes a guide hole and a first limiting hole which are communicated with each other. The clamping element includes a guide rod and a second limiting hole, the guide rod is inserted into the guide hole to allow the second limiting hole located on the guide hole to be communicated with the first limiting hole. The limiting element is inserted into the first and second limiting holes to integrate the base with the clamping element for clamping the workpiece.

Abstract: A method for identifying an object, an optical sensing apparatus and a system are provided. A controller of the system drives multiple light sources of the optical sensing apparatus to emit the multiple light beams with different beam angles, controls a light sensor to sense the lights reflected by the object, and performs the method for identifying the object. In the method, the light sensor is used to sense a first light emitted by a first light source with a first beam angle reflected by the object, and sense an intensity of the reflected first light. The light sensor is also used to sense a second light emitted by a second light source with a second beam angle reflected by the object and sense another intensity of the reflected second light. Therefore, the object can be identified by integrating information of the intensities obtained by the light sensor.

Abstract: A method for identifying an object, an optical sensing apparatus and a system are provided. A controller of the system drives multiple light sources of the optical sensing apparatus to emit the multiple light beams with different beam angles, controls a light sensor to sense the lights reflected by the object, and performs the method for identifying the object. In the method, the light sensor is used to sense a first light emitted by a first light source with a first beam angle reflected by the object, and sense an intensity of the reflected first light. The light sensor is also used to sense a second light emitted by a second light source with a second beam angle reflected by the object and sense another intensity of the reflected second light. Therefore, the object can be identified by integrating information of the intensities obtained by the light sensor.

Abstract: Provided is a spinning solution, comprising a cannabidiol powder and an alginate solution. Besides, the present invention further provides an alginate fiber comprising cannabidiol, and the preparation method and the use thereof. The cannabidiol powder in the spinning solution can be evenly dispersed in the alginate solution, so that the spinning solution of the present invention can be applied to wet spinning to form the alginate fiber comprising cannabidiol. The alginate fiber comprising cannabidiol has anti-oxidative, anti-bacterial, antiinflammatory, and anti-allergic abilities.

Abstract: A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

Abstract: A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

Abstract: A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

Abstract: A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

Abstract: A method for identifying an object, an optical sensing apparatus and a system are provided. A controller of the system drives multiple light sources of the optical sensing apparatus to emit the multiple light beams with different beam angles, controls a light sensor to sense the lights reflected by the object, and performs the method for identifying the object. In the method, the light sensor is used to sense a first light emitted by a first light source with a first beam angle reflected by the object, and sense an intensity of the reflected first light. The light sensor is also used to sense a second light emitted by a second light source with a second beam angle reflected by the object and sense another intensity of the reflected second light. Therefore, the object can be identified by integrating information of the intensities obtained by the light sensor.

Abstract: Provided is a lentivirus packaging system, which comprises: a transfer plasmid comprising a nucleotide sequence of TAR-reserved-chimeric 5? long terminal repeat (LTR); at least one packaging plasmid comprising a nucleotide sequence encoding TAR RNA binding protein, a nucleotide sequence of rev gene, a nucleotide sequence of gag gene, and a nucleotide sequence of pol gene; and an envelope plasmid. Due to the expression of gene of TAR RNA binding protein by the packaging plasmids, the produced lentivirus has higher virus titer and can improve the transduction rate and the gene delivery efficiency during cell transduction. The present invention further provides a method of improving lentivirus production in a host cell, which comprises using the lentivirus packaging system to transfect the host cell. The present invention further provides a cell transduced by the lentivirus and a method of using the cell for treating cancer.

Abstract: A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

Abstract: A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units that are disposed on the circuit board and each can receive a chip. The pressing device includes a cover and an abutting member disposed between the cover and the electrically connecting units. The cover is disposed on the circuit board to jointly define an accommodating space that accommodates the abutting member and the electrically connecting units. The cover can be connected to an air suction apparatus for expelling air in the accommodating space. When the air suction apparatus performs a suction operation to expel the air in the accommodating space, the abutting member is abutted against the electrically connecting units and the chips so as to connect each of the electrically connecting units and the corresponding chip.

Abstract: A pressing assembly and a chip testing apparatus including a plurality of the pressing assemblies are provided. The pressing assembly is fixedly disposed in a lid that is configured to cover a side of a chip tray kit, and the chip tray kit is configured to carry a plurality of chips. When the lid covers the side of the chip tray kit, a pressing member of each of the pressing assemblies presses a surface of each of the chips, and each of a plurality of elastic members connected to the pressing member is in a pressed state. When the lid covers the side of the chip tray kit, the lid and the chip tray kit define an enclosed space, and an air suction device of the chip testing apparatus can suction away air in the enclosed space, so that the enclosed space is in a negative pressure state.

Abstract: A chip tray kit and a chip testing apparatus are provided. The chip testing apparatus includes the chip tray kit. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The tray includes a plurality of tray thru-holes, the chip fixing members are detachably fixed to the tray, and the chip fixing members are correspondingly arranged in the tray thru-holes. Each of the auxiliary insertion members is detachably fixed to a side of the chip fixing member, a portion of each of the auxiliary insertion members is arranged in a fixing thru-hole of the chip fixing member, and each of the auxiliary insertion members can limit a movement range of a chip in a chip accommodating slot of the chip fixing member.

Abstract: A chip testing device and a chip testing system are provided. The chip testing system includes a chip testing device and a plurality of environment control apparatuses. A plurality of electrical connection sockets are disposed on one side of a circuit board, and a plurality of testing modules are disposed on another side of the circuit board. A first fixing member and a second fixing member fix the electrical connection sockets on one side of the circuit board, and no screwing members are required to be screwed between the electrical connection sockets and the circuit board. Each of the electrical connection sockets with a chip disposed thereon can be disposed in a high temperature environment or a low temperature environment for testing along with the chip testing device, so that each of the chips does not need to be detached repeatedly.