Abstract: The disclosure provides an electronic device. The electronic device includes a substrate, a transistor, and a variable capacitor. The transistor is disposed on the substrate. The variable capacitor is disposed on the substrate and adjacent to the transistor. A material of the transistor and a material of the variable capacitor both a include a III-V semiconductor material. The electronic device of an embodiment of the disclosure may simplify manufacturing process, reduce costs, or reduce dimensions.

Abstract: Base plates of a substrate retainer transportation mechanism are provided with damping members to assist elastic members in damping and limiting movement of the substrate retainer transportation mechanism when the substrate transportation mechanism is subjected to unwanted external forces, e.g., seismic forces. By damping and limiting movement of the substrate retainer transportation mechanism, undesirable damage to substrates contained in a substrate retainer being carried by the substrate retainer transport mechanism can be minimized.

Abstract: A method of forming a semiconductor device includes following steps. A first organic layer is formed to cover a first conductive layer. A first opening is formed in the first organic layer to expose a first surface of the first conductive layer. A first silicon layer is formed on a sidewall of the first opening and the first surface of the first conductive layer. A first dielectric layer is formed on the sidewall of the first opening and the first surface of the first conductive layer over the first silicon layer. By using a first mask, portions of the first silicon layer and the first dielectric layer on the first surface are simultaneously removed to expose the first surface, wherein after removing the portions of the first silicon layer and the first dielectric layer, the first dielectric layer covers a top surface of the first silicon layer.

Abstract: A water-based adhesive applied to wood and bamboo includes a main agent composed of water-soluble polymer, synthetic rubber latex and natural latex and a curing agent selected from isocyanate or quaternary ammonium salt polymer. Wherein, the weight ratio of the main agent to the curing agent is between 200:1 and 1:1; the water-soluble polymer is polyvinyl alcohol and is about 2-30 weight percent of the total solids of the main agent; the synthetic rubber latex is about 2-60 weight percent of the total solids of the main agent; and the natural latex is about 5-90 weight percent of the total solids of the main agent. The present invention provides a formaldehyde-free adhesive and introduces natural and renewable raw materials to reduce dependence on petrochemical products and improve the sustainability of related industries.

Abstract: A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.

Abstract: A system and method for generating a gas curtain over an access port of a processing chamber for a semiconductor substrate. A gas flow stabilizer and a gas flow receiver, each including a horizontal flow section and a vertical flow section cooperate to generate a gas curtain that impedes gas, e.g., oxygen, from outside the processing chamber, from flowing into the chamber, for example, when the access port is opened to add/or to remove a workpiece from the processing chamber.

Abstract: Provided is an isolated nucleic acid molecule encoding a chimeric antigen receptor (CAR), in which the CAR includes a single chain antibody or single chain antibody fragment, a costimulatory domain, a primary intracellular signaling domain. The single chain antibody or single chain antibody fragment includes a murine anti-CD19 binding domain, wherein the murine anti-CD19 binding domain includes a heavy chain variable (VH) region comprising a heavy chain complementarity determining region (CDR H1), a CDR H2, and a CDR H3; and a light chain variable (VL) region comprising a light chain complementarity determining region 1 (CDR L1), a CDR L2, and a CDR L3. The costimulatory domain includes 4-1BB, and the primary intracellular signaling domain includes a native intracellular signaling domain of CD3 zeta.

Abstract: A method of forming an optical waveguide from a multi-layer material is described. The multi-layer material includes a resist material layer deposited over a waveguide material layer, and the waveguide material layer deposited over a first cladding material layer. The method includes using a lithography procedure to form a three-dimensional tapered indentation into a top surface of the resist material layer, transferring the three-dimensional tapered indentation from the resist material layer to the waveguide material layer, forming a three-dimensional tapered optical waveguide by removing a portion of the waveguide material layer adjacent to the three-dimensional tapered indentation, and depositing a second cladding material layer over the optical waveguide to form an optical coupler having an optical input facet.

Abstract: In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.

Abstract: A modified polyurethane carrier substrate is provided. The modified polyurethane carrier substrate is formed from a modified polyurethane. The modified polyurethane includes a soft segment and a hard segment. The soft segment is formed from a polyol. The hard segment is formed from diisocyanate and a chain extender. The chain extender is dianhydride. A common logarithm of a ratio of a storage modulus of the modified polyurethane carrier substrate at ?30° C. to a storage modulus of the modified polyurethane carrier substrate at 150° C. ranges from 0.40 to 1.30.

Abstract: A method includes forming a plurality of dielectric layers, which processes include forming a first plurality of dielectric layers having first thicknesses, and forming a second plurality of dielectric layers having second thicknesses smaller than the first thicknesses. The first plurality of dielectric layers and the second plurality of dielectric layers are laid out alternatingly. The method further includes forming a plurality of redistribution lines connected to form a conductive path, which processes include forming a first plurality of redistribution lines, each being in one of the first plurality of dielectric layers, and forming a second plurality of redistribution lines, each being in one of the second plurality of dielectric layers.

Abstract: Some devices included a substrate; and a through via, including a plurality of scallops adjacent the through via in a first region and a plurality of scallops adjacent the through via in a second region, the plurality of scallops having a first depth, the scallops having a greater depth. Some devices include an opening extending into a substrate, including a first region and a second region. Sidewalls of the opening include a stack of first concave portions extending a first distance into the first substrate, and a stack of second concave portions extending a second distance, greater than and parallel to the first distance, into the first substrate. A conductor partially fills the first concave portions and at least partially fills the respective second concave portions.

Abstract: A chip package structure includes an interposer structure that contains a package-side redistribution structure, an interposer core assembly, and a die-side redistribution structure. The interposer core assembly includes at least one silicon substrate interposer, and each of the at least one silicon substrate interposer includes a respective silicon substrate, a respective set of through-silicon via (TSV) structures vertically extending through the respective silicon substrate, a respective set of interconnect-level dielectric layers embedding a respective set of metal interconnect structures, and a respective set of metal bonding structures that are electrically connected to the die-side redistribution structure. The chip package structure includes at least two semiconductor dies that are attached to the die-side redistribution structure, and an epoxy molding compound (EMC) multi-die frame that laterally encloses the at least two semiconductor dies.

Abstract: The present invention provides a sensor circuit with noise elimination comprising: a reference circuit which receives plural first sensing signals and generates a ramp signal based on the first sensing signal; and a comparison circuit which is coupled to the reference circuit, and which receives a second sensing signal and a ramp signal and generates a count signal based on the ramp signal and the second sensing signal and records the count signal at the time when the ramp signal is equal to the second sensing signal, thereby eliminating the noise of the second sensing signal to obtain a noise-free sensing value. The count signal is recorded when the ramp signal and the second sense signal are equal, so that the noise of the second sense signal is eliminated and a noise-free sense value is obtained.

Abstract: Disclosed are a leaf vein absorption method and a functional modification material for plant. The functional modification material has a covering with a functional material and a protector with a polymeric stabilizing material. The functional material is a unitary, a multivariate, or a high-entropy compound, or a semiconducting or an optoelectronic material. The covering covers a surface of a plant organ, wherein the covering comprises a stomata expansion material to enable the functional material to be absorbed into a plant through stomata. The protector covers a surface of the covering. The functional material is capable of maintaining its functional presence on a surface of the plant until the plant organ undergoes natural apoptosis. Through an absorption technology of leaf veins on the surface of the plant, special functions can be achieved without modifying or implanting plant genes.

Abstract: A method includes forming a plurality of dielectric layers, which processes include forming a first plurality of dielectric layers having first thicknesses, and forming a second plurality of dielectric layers having second thicknesses smaller than the first thicknesses. The first plurality of dielectric layers and the second plurality of dielectric layers are laid out alternatingly. The method further includes forming a plurality of redistribution lines connected to form a conductive path, which processes include forming a first plurality of redistribution lines, each being in one of the first plurality of dielectric layers, and forming a second plurality of redistribution lines, each being in one of the second plurality of dielectric layers.

Abstract: Provided is the use of the peptide for the manufacture of a medicament for treating pain, wherein the medicament comprises an effective amount of the peptide and a pharmaceutically acceptable carrier.

Abstract: Some devices included a substrate; and a through via, including a plurality of scallops adjacent the through via in a first region and a plurality of scallops adjacent the through via in a second region, the of scallops having a first depth, the scallops having a greater depth. Some devices include an opening extending into a substrate, including a first region and a second region. Sidewalls of the opening include a stack of first concave portions extending a first distance into the first substrate, and a stack of second concave portions extending a second distance, greater than and parallel to the first distance, into the first substrate. A conductor partially fills the first concave portions and at least partially fills the respective second concave portions.

Abstract: A method for identifying an object, an optical sensing apparatus and a system are provided. A controller of the system drives multiple light sources of the optical sensing apparatus to emit the multiple light beams with different beam angles, controls a light sensor to sense the lights reflected by the object, and performs the method for identifying the object. In the method, the light sensor is used to sense a first light emitted by a first light source with a first beam angle reflected by the object, and sense an intensity of the reflected first light. The light sensor is also used to sense a second light emitted by a second light source with a second beam angle reflected by the object and sense another intensity of the reflected second light. Therefore, the object can be identified by integrating information of the intensities obtained by the light sensor.

Abstract: Provided is a lentivirus packaging system, which comprises: a transfer plasmid comprising a nucleotide sequence of TAR-reserved-chimeric 5? long terminal repeat (LTR); at least one packaging plasmid comprising a nucleotide sequence encoding TAR RNA binding protein, a nucleotide sequence of rev gene, a nucleotide sequence of gag gene, and a nucleotide sequence of pol gene; and an envelope plasmid. Due to the expression of gene of TAR RNA binding protein by the packaging plasmids, the produced lentivirus has higher virus titer and can improve the transduction rate and the gene delivery efficiency during cell transduction. The present invention further provides a method of improving lentivirus production in a host cell, which comprises using the lentivirus packaging system to transfect the host cell. The present invention further provides a cell transduced by the lentivirus and a method of using the cell for treating cancer.