Abstract: A method of manufacturing a semiconductor device includes forming a first transistor structure and a second transistor structure on a substrate, wherein source/drain structures of the first transistor structure and the second transistor structure are merged. The first and second transistor structures are separated by etching the source/drain structures.

Abstract: A four-direction adjustable optical module including a carriage and a CCD module is disclosed. The carriage includes a coupling window for coupling with the CCD module. Each of the two sides of the CCD module includes a screw hole and an elastic device. The elastic device slightly protrudes from the surface of the coupling window. While the CCD module and the coupling window are coupled, screws are employed to screw through the CCD module and into the screw holes of the coupling windows. Therefore, the elastic devices deform by the stress from the CCD module. By adjusting the tightness of the screws, the orientation of the CCD module rotating on the Z axis can be calibrated. Thus, the adjustable optical module of the invention can be calibrated at least in four directions.

Abstract: A four-direction adjustable optical module including a carriage and a CCD module is disclosed. The carriage includes a coupling window for coupling with the CCD module. Each of the two sides of the CCD module includes a screw hole and an elastic device. The elastic device slightly protrudes from the surface of the coupling window. While the CCD module and the coupling window are coupled, screws are employed to screw through the CCD module and into the screw holes of the coupling windows. Therefore, the elastic devices deform by the stress from the CCD module. By adjusting the tightness of the screws, the orientation of the CCD module rotating on the Z axis can be calibrated. Thus, the adjustable optical module of the invention can be calibrated at least in four directions.