Abstract: A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

Abstract: A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

Abstract: A temperature adjusting device including a main body and a pressing component is provided. The main body includes a first main body thru-hole and a second main body thru-hole. The main body has a first fluid channel and a second fluid channel therein, the first fluid channel is in spatial communication with the first main body thru-hole, and the second fluid channel is in spatial communication with the second main body thru-hole. The pressing component partially protrudes from one side of the main body, the pressing component has a fluid accommodating slot therein that is in spatial communication with the first fluid channel and the second fluid channel. A fluid having a predetermined temperature can enter into the main body from the first main body thru-hole, enter into the fluid accommodating slot through the first fluid channel, and exit the main body through the second main body thru-hole.

Abstract: A chip testing apparatus including a chip testing machine, a temperature testing device, and a lid is provided. The chip testing machine includes a substrate and a plurality of chip testing sockets. Each of the chip testing sockets is disposed on the substrate and configured to carry a chip under test. The temperature adjusting device is disposed on the chip testing machine, and the lid covers the temperature adjusting device and the chip testing sockets. The temperature adjusting device includes a main body and a plurality of pressing components. The main body includes a plurality of fluid channels, and each of the pressing components can press one side of one of the chips under test. A fluid can flow into one of the fluid channels and flow through the pressing components, so that the chips under test are in an environment having a predetermined temperature.

Abstract: A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

Abstract: A testing apparatus includes a chip carrying device and a pressing device. The chip carrying device includes a circuit board and a plurality of electrically connecting units that are disposed on the circuit board and each can receive a chip. The pressing device includes a cover and an abutting member disposed between the cover and the electrically connecting units. The cover is disposed on the circuit board to jointly define an accommodating space that accommodates the abutting member and the electrically connecting units. The cover can be connected to an air suction apparatus for expelling air in the accommodating space. When the air suction apparatus performs a suction operation to expel the air in the accommodating space, the abutting member is abutted against the electrically connecting units and the chips so as to connect each of the electrically connecting units and the corresponding chip.

Abstract: A pressing assembly and a chip testing apparatus including a plurality of the pressing assemblies are provided. The pressing assembly is fixedly disposed in a lid that is configured to cover a side of a chip tray kit, and the chip tray kit is configured to carry a plurality of chips. When the lid covers the side of the chip tray kit, a pressing member of each of the pressing assemblies presses a surface of each of the chips, and each of a plurality of elastic members connected to the pressing member is in a pressed state. When the lid covers the side of the chip tray kit, the lid and the chip tray kit define an enclosed space, and an air suction device of the chip testing apparatus can suction away air in the enclosed space, so that the enclosed space is in a negative pressure state.

Abstract: A chip tray kit and a chip testing apparatus are provided. The chip testing apparatus includes the chip tray kit. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The tray includes a plurality of tray thru-holes, the chip fixing members are detachably fixed to the tray, and the chip fixing members are correspondingly arranged in the tray thru-holes. Each of the auxiliary insertion members is detachably fixed to a side of the chip fixing member, a portion of each of the auxiliary insertion members is arranged in a fixing thru-hole of the chip fixing member, and each of the auxiliary insertion members can limit a movement range of a chip in a chip accommodating slot of the chip fixing member.

Abstract: A chip testing device and a chip testing system are provided. The chip testing system includes a chip testing device and a plurality of environment control apparatuses. A plurality of electrical connection sockets are disposed on one side of a circuit board, and a plurality of testing modules are disposed on another side of the circuit board. A first fixing member and a second fixing member fix the electrical connection sockets on one side of the circuit board, and no screwing members are required to be screwed between the electrical connection sockets and the circuit board. Each of the electrical connection sockets with a chip disposed thereon can be disposed in a high temperature environment or a low temperature environment for testing along with the chip testing device, so that each of the chips does not need to be detached repeatedly.

Abstract: A memory test method for being implemented by storing corresponding test result data and test parameter data into memory chips when a burn-in test, a high temperature test, a low temperature test, and a normal temperature test are performed on the memory chips. A memory test method for being implemented by storing the corresponding test result data and the test parameter data into the memory chips after the memory chips finish the burn-in test, the high temperature test, the low temperature test, and the normal temperature test. The memory chips can internally store the test result data and the test parameter data after finishing tests through the memory test method of the present disclosure so that relevant personnel can read data to easily trace back test history of the memory chips.

Abstract: A chip testing system includes a central control device, a chip mounting apparatus, a plurality of environment control apparatus, a classification apparatus, and a transferring apparatus. The central control device is configured to control the chip mounting apparatus to dispose a plurality of chips onto a chip testing device. Each of the environment control apparatus includes a plurality of accommodating chambers that are independent from each other. Each of the accommodating chambers is provided with a temperature adjusting device. The central control device is configured to control the transferring apparatus to place the chip testing device into one of the accommodating chambers. When the chip testing device carrying the chips is arranged in the corresponding accommodating chamber, the central control device is configured to control an operation of the corresponding temperature adjusting device, so that the chips are in an environment of a predetermined temperature.

Abstract: A chip testing system and an environment control apparatus are provided. The chip testing system includes the environment control apparatus, a central control device, and a chip testing device. The environment control apparatus includes an apparatus body and a pressing device. When the chip testing device is disposed in an accommodating chamber of the apparatus body, and the central control device controls the pressing device to press a plurality of side surfaces of a plurality of chips carried by the chip testing device, the central control device controls the chip testing device to perform a testing operation to the chips. After the chip testing device performs the testing operation to the chips, a plurality of movable members of the pressing device protrude from a contacting surface of the pressing device and push the chips to separate the chips and the contacting surface.

Abstract: A pressing assembly and a chip testing apparatus including a plurality of the pressing assemblies are provided. The pressing assembly is fixedly disposed in a lid that is configured to cover a side of a chip tray kit, and the chip tray kit is configured to carry a plurality of chips. When the lid covers the side of the chip tray kit, a pressing member of each of the pressing assemblies presses a surface of each of the chips, and each of a plurality of elastic members connected to the pressing member is in a pressed state. When the lid covers the side of the chip tray kit, the lid and the chip tray kit define an enclosed space, and an air suction device of the chip testing apparatus can suction away air in the enclosed space, so that the enclosed space is in a negative pressure state.

Abstract: A chip tray kit and a chip testing apparatus are provided. The chip testing apparatus includes the chip tray kit. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The tray includes a plurality of tray thru-holes, the chip fixing members are detachably fixed to the tray, and the chip fixing members are correspondingly arranged in the tray thru-holes. Each of the auxiliary insertion members is detachably fixed to a side of the chip fixing member, a portion of each of the auxiliary insertion members is arranged in a fixing thru-hole of the chip fixing member, and each of the auxiliary insertion members can limit a movement range of a chip in a chip accommodating slot of the chip fixing member.

Abstract: A chip testing system including a tray kit, an insertion member mounting apparatus, a testing apparatus, an insertion member detaching apparatus, and a conveying apparatus are provided. The chip tray kit includes a tray, a plurality of chip fixing members, and a plurality of auxiliary insertion members. The chip fixing members are fixed to the tray and are configured to carry a plurality of chips. The insertion member mounting apparatus can fix the auxiliary insertion members to a side of the chip fixing members, and the auxiliary insertion members can limit a movement range of the chips in the chip fixing members. The insertion member detaching apparatus can detach the auxiliary insertion members. When the chips are tested, a pressing assembly connected to a temperature adjusting device and reaching a predetermined temperature correspondingly presses a surface of each of the chips.

Abstract: A chip testing circuit and a testing method thereof are provided. The chip testing circuit includes a parameter measurement circuit, a plurality of power supply circuits, a plurality of switch circuits, and a control circuit. The plurality of power supply circuits respectively provide power supply to a plurality of chips carried by a plurality of sockets. Each switch circuit is electrically connected between one socket and one power supply circuit. The control circuit is connected in parallel to a plurality of signal pins of the plurality of chips carried by the plurality of sockets, so that when the control circuit outputs test data, all the chips can simultaneously receive the test data. When executing a parametric test mode, the control circuit controls one of the switch circuits to be turned on and controls the parameter measurement circuit to perform an electrical performance test on the chips.

Abstract: A system-level testing apparatus and a system-level testing system are provided. The system-level testing apparatus includes an apparatus body, a chip carrying device, and a control device. A holding structure in the apparatus body is configured to hold a system circuit board. The chip carrying device includes a carrying circuit board, and a plurality of electrical connection sockets and a plurality of connection structures are disposed on the carrying circuit board. The electrical connection structures are electrically connected to the connection structures. When the electrical connection sockets carry a plurality of chips under test, the carrying circuit board is disposed on the system circuit board, and the connection structures are connected to a plurality of system connection structures of the system circuit board, the control device can transmit a test signal to perform a system-level test operation to the system circuit board and the chips under test.

Abstract: A chip testing method for being implemented by a chip testing system includes: a chip mounting step implemented by using a chip mounting apparatus to respectively dispose a plurality of chips onto electrical connection sockets of a chip testing device; a moving-in step implemented by transferring the chip testing device carrying the chips into one of accommodating chambers of an environment control apparatus; a temperature adjusting step implemented by controlling a temperature adjusting device of the one of the accommodating chambers so that the chips are in an environment having a predetermined temperature; and a testing step implemented by providing electricity to the chip testing device, so that each testing module of the chip testing device performs a predetermined testing process on the chips on the corresponding electrical connection sockets connected thereto.

Abstract: A chip testing system and an environment control apparatus are provided. The chip testing system includes the environment control apparatus, a central control device, and a chip testing device. The environment control apparatus includes an apparatus body and a pressing device. When the chip testing device is disposed in an accommodating chamber of the apparatus body, and the central control device controls the pressing device to press a plurality of side surfaces of a plurality of chips carried by the chip testing device, the central control device controls the chip testing device to perform a testing operation to the chips. After the chip testing device performs the testing operation to the chips, a plurality of movable members of the pressing device protrude from a contacting surface of the pressing device and push the chips to separate the chips and the contacting surface.

Abstract: An environment control apparatus includes an apparatus body, a processing device, a plurality of heating devices, and a plurality of cooling devices. The apparatus body includes a plurality of accommodating chambers each having one of the heating devices or one of the cooling devices. Each of the heating devices has a high temperature contacting structure, and each of the cooling devices has a low temperature contacting structure. When a chip testing device carrying chips is arranged in one of the accommodating chambers, the chip testing device is supplied with electricity, and the heating device or the cooling device of the one of the accommodating chambers is in operation, the chip testing device is configured to test the chips disposed thereon.