Patents by Inventor Chen Min
Chen Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250183073Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.Type: ApplicationFiled: February 6, 2025Publication date: June 5, 2025Inventors: Chen Min LIN, Hsien Tse CHEN
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Publication number: 20250117045Abstract: A portable computer having flexible display including a housing, a motor, a transmission gear set, a linkage set, and a flexible display is provided. The housing includes a fixing portion and a moving portion movably connected to and partially overlapped on the fixing portion. The motor, the transmission gear set, and the linkage set are disposed in the housing respectively. The linkage set and the transmission gear set are coupled to each other to be a connection and drive mechanism of the fixing portion and the moving portion. A portion of the flexible display is assembled to the fixing portion, and an end portion of the flexible display passes by the moving portion and are wound and stored at a backside of the portion of the flexible display.Type: ApplicationFiled: May 9, 2024Publication date: April 10, 2025Applicant: Acer IncorporatedInventors: Wei-Chih Wang, Chi-Yuan Liu, Chen-Min Hsiu
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Patent number: 12253888Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.Type: GrantFiled: May 8, 2023Date of Patent: March 18, 2025Assignee: Acer IncorporatedInventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
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Patent number: 12249526Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.Type: GrantFiled: March 6, 2023Date of Patent: March 11, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen Min Lin, Hsien Tse Chen
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Publication number: 20250060793Abstract: A laptop computer with a quick-release keyboard including a host, a display, and a keyboard is provided. The host has a first surface and a second surface opposite to each other. The host has at least one movable hook disposed on the first surface. The display is pivoted to the host to be folded or unfolded relative to the first surface of the host. The laptop computer is supported on a platform via the second surface when the display is unfolded relative to the first surface of the host. The keyboard has a locking column to be locked by the movable hook when the keyboard is disposed on the first surface, such that the keyboard is fixed on the first surface.Type: ApplicationFiled: January 22, 2024Publication date: February 20, 2025Applicant: Acer IncorporatedInventors: Wei-Chih Wang, Chen-Min Hsiu, Chih-Wei Liao
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Patent number: 12113786Abstract: A mechanism for providing secure feature and key management in integrated circuits is described. An example integrated circuit includes a secure memory to store a secret key, and a security manager core, coupled to the secure memory, to receive a digitally signed command, verify a signature associated with the command using the secret key, and configure operation of the integrated circuit using the command.Type: GrantFiled: June 29, 2023Date of Patent: October 8, 2024Assignee: Cryptography Research, Inc.Inventors: Paul Carl Kocher, Benjamin Chen-Min Jun, Andrew John Leiserson
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Publication number: 20240111337Abstract: An electronic device including a body and a receptacle connector is provided. The body has a side wall surface, a receptacle slot located at the side wall surface, a waterproof protrusion protruding from the side wall surface, and two gutters located at the side wall surface, where the waterproof protrusion is located above the receptacle slot, and the two gutters are respectively located at two opposite sides of the receptacle slot. The receptacle connector is disposed in the receptacle slot.Type: ApplicationFiled: May 8, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Wei-Chih Wang, Chen-Min Hsiu, Chien-Yu Lee, Szu-Wei Yang, Fang-Ying Huang
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Publication number: 20230388290Abstract: A mechanism for providing secure feature and key management in integrated circuits is described. An example integrated circuit includes a secure memory to store a secret key, and a security manager core, coupled to the secure memory, to receive a digitally signed command, verify a signature associated with the command using the secret key, and configure operation of the integrated circuit using the command.Type: ApplicationFiled: June 29, 2023Publication date: November 30, 2023Inventors: Paul Carl Kocher, Benjamin Chen-Min Jun, Andrew John Leiserson
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Patent number: 11695749Abstract: A mechanism for providing secure feature and key management in integrated circuits is described. An example integrated circuit includes a secure memory to store a secret key, and a security manager core, coupled to the secure memory, to receive a digitally signed command, verify a signature associated with the command using the secret key, and configure operation of the integrated circuit using the command.Type: GrantFiled: September 4, 2020Date of Patent: July 4, 2023Assignee: Cryptography Research, Inc.Inventors: Paul Carl Kocher, Benjamin Chen-Min Jun, Andrew John Leiserson
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Publication number: 20230207357Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.Type: ApplicationFiled: March 6, 2023Publication date: June 29, 2023Inventors: Chen Min LIN, Hsien Tse CHEN
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Patent number: 11687127Abstract: An electronic device is provided, including a display module, an input module, a touchpad unit disposed on the input module, several first magnetic elements, and several second magnetic elements. The input module is connected to the display module. The first magnetic elements are disposed on the bottom plate of the touchpad unit, and the second magnetic elements are disposed on the frame of the touchpad unit. The first and second magnetic elements generate a repulsion force to keep the frame in an initial position relative to the bottom plate.Type: GrantFiled: June 7, 2022Date of Patent: June 27, 2023Assignee: ACER INCORPORATEDInventors: Wei-Chih Wang, Chen-Min Hsiu
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Publication number: 20230195184Abstract: An electronic device is provided, including a display module, an input module, a touchpad unit disposed on the input module, several first magnetic elements, and several second magnetic elements. The input module is connected to the display module. The first magnetic elements are disposed on the bottom plate of the touchpad unit, and the second magnetic elements are disposed on the frame of the touchpad unit. The first and second magnetic elements generate a repulsion force to keep the frame in an initial position relative to the bottom plate.Type: ApplicationFiled: June 7, 2022Publication date: June 22, 2023Inventors: Wei-Chih WANG, Chen-Min HSIU
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Patent number: 11600504Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.Type: GrantFiled: June 29, 2020Date of Patent: March 7, 2023Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen Min Lin, Hsien Tse Chen
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Patent number: 11329433Abstract: The present disclosure provides a plug connector adapted to insert into a receptacle connector, the receptacle connector includes a cage having an opening. The plug connector includes a metal shell and a conductive elastic member. The metal shell is provided with a recessed groove. The conductive elastic member includes a conductive elastic body, the conductive elastic body has a holding portion held in the recessed groove and a first electromagnetic shielding portion extending out of the recessed groove from the holding portion, when the plug connector is inserted forwardly into the receptacle connector, the first electromagnetic shielding portion enters into the opening of the cage of the receptacle connector and mechanically and electrically contacts the cage and the metal shell. However, some embodiments may not include a holding portion or recessed groove.Type: GrantFiled: August 5, 2020Date of Patent: May 10, 2022Assignee: Molex, LLCInventors: Hui-Hsuan Yang, Yen-Lin Chen, Chen-Min Lin
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Patent number: 11258263Abstract: An apparatus of solid oxide fuel cells (SOFC) is provided. The SOFCs generate power and are grid-tied. The apparatus comprises a power-generating side; and a grid-connecting side using an elementary household power management. The apparatus solves problems like low voltage, high current, voltage oscillation, voltage dips, long generator-starting time, etc. The apparatus is not only used as a stable power supply (base load), but also helps adjust the regional peak electricity demands. The features include the following: 1. A grid is tied, where output power does not pass through a direct-current boost converter and, thus, has no loss from it. 2. Injures, including voltage oscillation and sudden unloading after dumping, are reduced for avoiding further damages to cell sheets. 3. With the coordination of elementary power management and the integration of grid, the limitation of long-awaiting generator-starting time is crossed out and convenience of immediate power use is achieved.Type: GrantFiled: March 3, 2021Date of Patent: February 22, 2022Assignee: Institute of Nuclear Energy Research, Atomic Energy Council, Executive Yuan, R.O.C.Inventors: Fang-Tzu Chuang, Chen-Min Chan, Ruey-Yi Lee
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Publication number: 20220045515Abstract: An apparatus of solid oxide fuel cells (SOFC) is provided. The SOFCs generate power and are grid-tied. The apparatus comprises a power-generating side; and a grid-connecting side using an elementary household power management. The apparatus solves problems like low voltage, high current, voltage oscillation, voltage dips, long generator-starting time, etc. The apparatus is not only used as a stable power supply (base load), but also helps adjust the regional peak electricity demands. The features include the following: 1. A grid is tied, where output power does not pass through a direct-current boost converter and, thus, has no loss from it. 2. Injures, including voltage oscillation and sudden unloading after dumping, are reduced for avoiding further damages to cell sheets. 3. With the coordination of elementary power management and the integration of grid, the limitation of long-awaiting generator-starting time is crossed out and convenience of immediate power use is achieved.Type: ApplicationFiled: March 3, 2021Publication date: February 10, 2022Inventors: Fang-Tzu Chuang, Chen-Min Chan, Ruey-Yi Lee
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Publication number: 20210407832Abstract: A device may detect a semiconductor wafer to be transferred from a source wafer carrier to a target wafer carrier, and may cause a light source to illuminate the semiconductor wafer. The device may cause a camera to capture images of the semiconductor wafer after the light source illuminates the semiconductor wafer, and may perform image recognition of the images of the semiconductor wafer to determine whether an edge of the semiconductor wafer is damaged. The device may cause the semiconductor wafer to be provided to the source wafer carrier when the edge of the semiconductor wafer is determined to be damaged, and may cause the semiconductor wafer to be provided to the target wafer carrier when the edge of the semiconductor wafer is determined to be undamaged.Type: ApplicationFiled: June 29, 2020Publication date: December 30, 2021Inventors: Chen Min LIN, Hsien Tse CHEN
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Publication number: 20210058387Abstract: A mechanism for providing secure feature and key management in integrated circuits is described. An example integrated circuit includes a secure memory to store a secret key, and a security manager core, coupled to the secure memory, to receive a digitally signed command, verify a signature associated with the command using the secret key, and configure operation of the integrated circuit using the command.Type: ApplicationFiled: September 4, 2020Publication date: February 25, 2021Inventors: Paul Carl Kocher, Benjamin Chen-Min Jun, Andrew John Leiserson
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Publication number: 20210050692Abstract: The present disclosure provides a plug connector adapted to insert into a receptacle connector, the receptacle connector includes a cage having an opening. The plug connector includes a metal shell and a conductive elastic member. The metal shell is provided with a recessed groove. The conductive elastic member includes a conductive elastic body, the conductive elastic body has a holding portion held in the recessed groove and a first electromagnetic shielding portion extending out of the recessed groove from the holding portion, when the plug connector is inserted forwardly into the receptacle connector, the first electromagnetic shielding portion enters into the opening of the cage of the receptacle connector and mechanically and electrically contacts the cage and the metal shell. However, some embodiments may not include a holding portion or recessed groove.Type: ApplicationFiled: August 5, 2020Publication date: February 18, 2021Applicant: Molex, LLCInventors: Hui-Hsuan YANG, Yen-Lin CHEN, Chen-Min LIN
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Patent number: 10913069Abstract: An apparatus for amplifying a nucleic acid sequence in a polymerase chain reaction (PCR) is provided. The apparatus comprises a microprocessor configured to communicatively couple with a user input device and receive instructions from the user input device and implement the received instructions; an electromagnetic radiation (EMR) generator configured to generated EMR at frequencies ranging from 300 THz to 400 THz and communicatively coupled with the microprocessor; a reaction vessel, communicatively coupled with the microprocessor, to house the nucleic acid sequence, necessary reagents to the PCR, and particles comprising a transition metal material, and to receive the EMR generated by the EMR generator; and a temperature sensor communicatively coupled with the reaction vessel and the microprocessor.Type: GrantFiled: January 10, 2019Date of Patent: February 9, 2021Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Dar-Bin Shieh, Chih-Chia Huang, Chen-Min Chang, Tsung-Ju Li, Po-Yang Chang, Ming-Chi Hsieh