Patents by Inventor Chen-Ming Cheng

Chen-Ming Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and package substrate thereof
    Patent number: 8058725
    Abstract: A package structure and a package substrate thereof are provided. The package structure includes a package substrate, a chip and a molding compound. The package substrate has an upper surface and a lower surface. The lower surface has a molding area and a pad area. The molding area has at least one window opening penetrating the upper surface and the lower surface. The pad area is used for disposing at least one solder ball or at least one connecting pin. The package substrate includes a solder mask. The solder mask covers the lower surface of the package substrate. The solder mask has at least one groove. The groove is disposed between the molding area and the pad area. The chip disposed on the package substrate has an active surface. The active surface contacts with the upper surface of the package substrate. The molding area is covered by the molding compound.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: November 15, 2011
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuang-Hsiung Chen, Chen-Ming Cheng, Hung-Ju Chung
  • PACKAGE STRUCTURE AND PACKAGE SUBSTRATE THEREOF
    Publication number: 20080105974
    Abstract: A package structure and a package substrate thereof are provided. The package structure includes a package substrate, a chip and a molding compound. The package substrate has an upper surface and a lower surface. The lower surface has a molding area and a pad area. The molding area has at least one window opening penetrating the upper surface and the lower surface. The pad area is used for disposing at least one solder ball or at least one connecting pin. The package substrate includes a solder mask. The solder mask covers the lower surface of the package substrate. The solder mask has at least one groove. The groove is disposed between the molding area and the pad area. The chip disposed on the package substrate has an active surface. The active surface contacts with the upper surface of the package substrate. The molding area is covered by the molding compound.
    Type: Application
    Filed: October 10, 2007
    Publication date: May 8, 2008
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Kuang-Hsiung Chen, Chen-Ming Cheng, Hung-Ju Chung