Abstract: A semiconductor package includes a substrate, first bumps, a first chip, metal pillars, second bumps and a second chip. The substrate includes first and second conductive pads which are located on a top surface of the substrate. Both ends of the first bumps are connected to the first conductive pads and the first chip, respectively. Both ends of the metal pillars are connected to the second conductive pads and one end of the second bumps, respectively. A cross-sectional area of each of the metal pillars is larger than that of each of the second bumps. The second chip is connected to the other end of the second bumps and located above the first chip.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor with a passivation layer for dark current reduction. A device layer overlies a substrate. Further, a cap layer overlies the device layer. The cap and device layers and the substrate are semiconductor materials, and the device layer has a smaller bandgap than the cap layer and the substrate. For example, the cap layer and the substrate may be silicon, whereas the device layer may be or comprise germanium. A photodetector is in the device and cap layers, and the passivation layer overlies the cap layer. The passivation layer comprises a high k dielectric material and induces formation of a dipole moment along a top surface of the cap layer.

Abstract: A circuit module and a shielding structure for electromagnetic waves or radio frequency interferences are comprised of a circuit board and electronic components disposed on the circuit board, and a metal partition mounted on the electronic components; the metal partition disposed with one or a plurality of through holes, which does not contact the electronic components so as to shield electromagnetic waves or radio frequency interferences externally radiated from the electronic components, or radiated from an external source by the conductivity of the metal partition; and the through hole dissipates heat generated by the electronic components to maintain normal working status and quality of the circuit module.

Abstract: An antenna structure and a medium component for use in a planar inverted-F antenna are disclosed. The antenna structure comprises a radiation component, a ground component and a medium component. A space is between the radiation component and the ground component for generating resonance effects to transmit and to receive electromagnetic waves. The medium component is set into the space which is between the radiation component and the ground component for fastening the space, but also has insulation and waterproof functions. The efficacy for the antenna structure transmitting and receiving electromagnetic waves can be ensured.

Abstract: A portable wireless communication apparatus comprises a circuit board, an antenna and a casing. The circuit board comprises a plurality of electronic components. The antenna is electrically connected to the circuit board for implementing wireless communication. The circuit board is covered by the casing to isolate noise generated by the electronic components and the wireless communication jammed by the noises can be avoided.