Abstract: A first and second semiconductor device are bonded together using a bonding contact pad embedded within a bonding dielectric layer of the first semiconductor device and at least one bonding via embedded within a bonding dielectric layer of the second semiconductor device. The bonding contact pad extends a first dimension in a first direction perpendicular to the major surface of the first semiconductor device and a second dimension in a second direction parallel to the plane of the first semiconductor wafer, the second dimension being at least twice the first dimension. The bonding via extends a third dimension in the first direction and a fourth dimension in the second direction, the third dimension being at least twice the first dimension. The bonding contact pad and bonding via may be at least partially embedded in respective bonding dielectric layers in respective topmost dielectric layers of respective stacked interconnect layers.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.

Abstract: A display may include an array of pixels that receive control signals from a chain of gate drivers. The pixels can be formed using semiconducting oxide transistors, whereas the gate drivers can be formed using silicon transistor. Each gate driver may include a shift register subcircuit and an output buffer subcircuit. The shift register subcircuit may include a first set of transistors at least partially controlled by one or more shift register clock signals. The output buffer subcircuit may include a second set of transistors at least partially controlled by one or more output buffer clock signals. The output buffer clock signals can toggle independently from the shift register clock signals. Operated in this way, the shift register clock signals can have pulse widths optimized for stability while the output buffer clock signals can have pulse widths optimized for speed.

Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A circuit board structure includes a circuit substrate having opposing first and second sides, a redistribution structure disposed at the first side, and a dielectric structure disposed at the second side. The circuit substrate includes a first circuit layer disposed at the first side and a second circuit layer disposed at the second side. The redistribution structure is electrically coupled to the circuit substrate and includes a first leveling dielectric layer covering the first circuit layer, a first thin-film dielectric layer disposed on the first leveling dielectric layer and having a material different from the first leveling dielectric layer, and a first redistributive layer disposed on the first thin-film dielectric layer and penetrating through the first thin-film dielectric layer and the first leveling dielectric layer to be in contact with the first circuit layer. The dielectric structure includes a second leveling dielectric layer disposed below the second circuit layer.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: A memory array and an operation method of the memory array are provided. The memory array includes first and second ferroelectric memory devices formed along a gate electrode, a channel layer and a ferroelectric layer between the gate electrode and the channel layer. The ferroelectric memory devices include: a common source/drain electrode and two respective source/drain electrodes, separately in contact with a side of the channel layer opposite to the ferroelectric layer, wherein the common source/drain electrode is disposed between the respective source/drain electrodes; and first and second auxiliary gates, capacitively coupled to the channel layer, wherein the first auxiliary gate is located between the common source/drain electrode and one of the respective source/drain electrodes, and the second auxiliary gate is located between the common source/drain electrode and the other respective source/drain electrode.

Abstract: A membrane touch panel device includes a circuit board unit, a light-blocking frame plate, a plurality of light-blocking tabs, and an operation panel unit that are stacked along a front-rear direction. The circuit board unit includes a circuit board having a plurality of keypad circuits, and a plurality of LEDs being electrically connected to the circuit board. A light transmission rate of the circuit board ranges from 0% to 20%. The light-blocking frame plate is stacked on the circuit board, and defines a hollow section provided for the LEDs to protrude thereinto. The light-blocking tabs are connected to the light-blocking frame plate such that the light-blocking tabs respectively cover the LEDs. The operation panel unit is stacked on the light-blocking frame plate, and has a plurality of key segments being respectively aligned with the keypad circuits, and being adapted to permit light generated by the LEDs to pass therethrough.

Abstract: A membrane touch panel device includes a circuit board unit, a light-blocking frame plate, a plurality of light-blocking tabs, and an operation panel unit that are stacked along a front-rear direction. The circuit board unit includes a circuit board having a plurality of keypad circuits, and a plurality of LEDs being electrically connected to the circuit board. A light transmission rate of the circuit board ranges from 0% to 20%. The light-blocking frame plate is stacked on the circuit board, and defines a hollow section provided for the LEDs to protrude thereinto. The light-blocking tabs are connected to the light-blocking frame plate such that the light-blocking tabs respectively cover the LEDs. The operation panel unit is stacked on the light-blocking frame plate, and has a plurality of key segments being respectively aligned with the keypad circuits, and being adapted to permit light generated by the LEDs to pass therethrough.

Abstract: An electronic lock includes a lock assembly configured to switch between a locking state and an unlocking state, and a control unit electrically connected to the lock assembly. The control unit includes an operation panel configured to receive a user input, a light sensor configured to measure intensity of ambient light and generate a light-sense signal, a proximity sensor configured to generate a wake signal, a backlight module configured to emit light from the operation panel, and a control module electrically connected to the lock assembly, the operation panel, the light sensor, the proximity sensor, and the backlight module. The control module is configured to control operation of the lock assembly based on the user input, activate the light sensor to measure the intensity of the ambient light, activate the backlight module to emit the light, and control the backlight module to adjust brightness of the light emitted thereby.

Abstract: An electronic lock includes a deadbolt, a driver mechanism, a transmission mechanism and a control mechanism. The transmission mechanism includes a transmission gear that is driven by the driver mechanism to rotate, a resilient unit that is mounted to and co-rotatable with the transmission gear, and a rotary member that is operable to rotate relative to the transmission gear between a locking position and an unlocking position, and that is connected to the deadbolt. The control mechanism is connected to the rotary member, and ceases operation of the driver mechanism when detecting that the rotary member has been rotated to one of the locking and unlocking positions.

Abstract: An electronic lock device includes a lock mechanism, an actuation mechanism that actuates the lock mechanism, and a control unit including a processor and a current detection module. During an operation in which the actuation mechanism is activated to start switching the lock mechanism from an original state to an intended state, the current detection module continuously detects an amount of electric current flowing through the actuation mechanism. When the amount of electric current is greater than a predetermined threshold, the processor controls the actuation mechanism to switch the lock mechanism back to the original state, and deactivates the actuation mechanism.

Abstract: An electronic lock includes an input apparatus. The input apparatus includes a keypad module and a processor module. The keypad module includes plural button devices arranged in plural rows and in plural columns. The processor module includes a signal-processing unit configured to, when operating in a work mode, repeatedly perform an emission process of inputting a detection signal to each column of button devices, and repeatedly perform a scan process to detect, for each row of button devices, the detection signal outputted from any row of button devices. The detection signal includes a pulse wave composed of plural pulses. The signal-processing unit is further configured to generate and output an input signal corresponding to one of the button devices when detecting the detection signal.

Abstract: An electronic lock includes an electric locking unit, a touch panel, and a control module. The control module stores a plurality of touch condition sets which are related to human contact. The control module executes an input scan operation on each touch switch of the touch panel, charges a self capacitor with a scan signal, and charges a mutual capacitor with a driving signal. The control module determines whether an electric change conforms with any one of the touch conditions. Through a structural design of the touch panel and a scan function design of the control module, the electronic lock can more accurately determine whether the touch panel is operated by human touch and can also normally operate in a humid environment.

Abstract: An electronic lock includes an electric locking unit, a touch panel, and a control module. The control module stores a plurality of touch condition sets which are related to human contact. The control module executes an input scan operation on each touch switch of the touch panel, charges a self capacitor with a scan signal, and charges a mutual capacitor with a driving signal. The control module determines whether an electric change conforms with any one of the touch conditions. Through a structural design of the touch panel and a scan function design of the control module, the electronic lock can more accurately determine whether the touch panel is operated by human touch and can also normally operate in a humid environment.

Abstract: An electronic lock includes an input apparatus. The input apparatus includes a keypad module and a processor module. The keypad module includes plural button devices arranged in plural rows and in plural columns. The processor module includes a signal-processing unit configured to, when operating in a work mode, repeatedly perform an emission process of inputting a detection signal to each column of button devices, and repeatedly perform a scan process to detect, for each row of button devices, the detection signal outputted from any row of button devices. The detection signal includes a pulse wave composed of plural pulses. The signal-processing unit is further configured to generate and output an input signal corresponding to one of the button devices when detecting the detection signal.

Abstract: A method of mounting an electronic door lock on a door includes: a manual operation to rotate a protrusion of a rotational actuator to initially press a switch; and an operating procedure implemented by the electronic lock for determining a correct mounting direction of the electronic door lock. The operating procedure includes controlling, in response to a signal sent by the switch that is initially pressed, a driving unit to rotate the protrusion in a direction from the initially pressed switch to the other initially un-pressed switch and to drive a latch to move from an unlatched position toward a latched position, followed by stopping and subsequently controlling the driving unit to rotate the protrusion in a reverse direction and to drive the latch to move toward the unlatched position.

Abstract: A method of mounting an electronic door lock on a door includes: a manual operation to rotate a protrusion of a rotational actuator to initially press a switch; and an operating procedure implemented by the electronic lock for determining a correct mounting direction of the electronic door lock. The operating procedure includes controlling, in response to a signal sent by the switch that is initially pressed, a driving unit to rotate the protrusion in a direction from the initially pressed switch to the other initially un-pressed switch and to drive a latch to move from an unlatched position toward a latched position, followed by stopping and subsequently controlling the driving unit to rotate the protrusion in a reverse direction and to drive the latch to move toward the unlatched position.

Abstract: An electric door lock including: a lock housing; an operating member having a holding part and a shaft part, the shaft part able to be placed in the lock housing, the shaft part connected to the holding part, the holding part defined as a long axis; a cog wheel able to be placed in the lock housing, the cog wheel having at least one bump; a coupling plate installed on the shaft part of the operating member, the coupling plate having at least one bulge and one protruding part, with the protruding part and the long axis of the holding part designed to move in alignment with each other; a motor placed in the lock housing; three sensor switches set separately in the lock housing; operating the motor causing the bump of the cog wheel to rotate and push the bulge of the coupling plate, so that the protruding part of the coupling plate of the electric door lock installed in the required position on a left-hand door or right-hand door, selectively touches the two sensor switches adjacent to each other, so as to reach