Abstract: A package structure including a photonic, an electronic die, an encapsulant and a waveguide is provided. The photonic die includes an optical coupler. The electronic die is electrically coupled to the photonic die. The encapsulant laterally encapsulates the photonic die and the electronic die. The waveguide is disposed over the encapsulant and includes an upper surface facing away from the encapsulant. The waveguide includes a first end portion and a second end portion, the first end portion is optically coupled to the optical coupler, and the second end portion has a groove on the upper surface.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: A semiconductor package includes a first die stack structure and a second die stack structure, an insulating encapsulation, a redistribution structure, at least one prism structure and at least one reflector. The first die stack structure and the second die stack structure are laterally spaced apart from each other along a first direction, and each of the first die stack structure and the second die stack structure comprises an electronic die; and a photonic die electronically communicating with the electronic die. The insulating encapsulation laterally encapsulates the first die stack structure and the second die stack structure. The redistribution structure is disposed on the first die stack structure, the second die stack structure and the insulating encapsulation, and electrically connected to the first die stack structure and the second die stack structure. The at least one prism structure is disposed within the redistribution structure and optically coupled to the photonic die.

Abstract: A light-concentrating panel is disclosed. The light-concentrating panel comprises a planar light collecting element and a linear light collecting element. The planar light collecting element receives and collects the planar light, and then emits out as linear light. The linear light collecting element receives the linear light. The linear light from the planar collecting element enters the linear light collecting element by passing a planar-linear imaginary plane, which is located between the planar light collecting element and the linear light collecting element. The linear light from the planar collecting element are collected and turned into the spot light by the linear light collecting element.

Abstract: The invention provides an auxiliary fastening device for assisting in fastening a transducer such as a speaker on a base structure. Moreover, the auxiliary fastening device according to the invention is capable of isolating the vibration induced from the transducer to the base structure during operation.

Abstract: A light-concentrating panel is disclosed. The light-concentrating panel comprises a planar light collecting element and a linear light collecting element. The planar light collecting element receives and collects the planar light, and then emits out as linear light. The linear light collecting element receives the linear light. The linear light from the planar collecting element enters the linear light collecting element by passing a planar-linear imaginary plane, which is located between the planar light collecting element and the linear light collecting element. The linear light from the planar collecting element are collected and turned into the spot light by the linear light collecting element.

Abstract: The invention provides an auxiliary fastening device for assisting in fastening a transducer such as a speaker on a base structure. Moreover, the auxiliary fastening device according to the invention is capable of isolating the vibration induced from the transducer to the base structure during operation.