Patents by Inventor Chen-Ning FU

Chen-Ning FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package and method thereof
    Patent number: 9334156
    Abstract: A chip package includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer and a packaging layer. The semiconductor chip has a sensor device and a conductive pad electrically connected to the sensing device, and the interposer is disposed on the semiconductor chip. The interposer has a trench and a through hole, which the trench exposes a portion of the sensing device, and the through hole exposes the conductive pad. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, and the redistribution layer is disposed on the interposer and in the through hole to be electrically connected to the conductive pad. The packaging layer covers the interposer and the redistribution layer, which the packaging layer has an opening exposing the trench.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: May 10, 2016
    Assignee: XINTEC INC.
    Inventors: Chien-Min Lin, Yu-Ting Huang, Chen-Ning Fu, Yen-Shih Ho
  • CHIP PACKAGE AND METHOD THEREOF
    Publication number: 20160039662
    Abstract: A chip package includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer and a packaging layer. The semiconductor chip has a sensor device and a conductive pad electrically connected to the sensing device, and the interposer is disposed on the semiconductor chip. The interposer has a trench and a through hole, which the trench exposes a portion of the sensing device, and the through hole exposes the conductive pad. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, and the redistribution layer is disposed on the interposer and in the through hole to be electrically connected to the conductive pad. The packaging layer covers the interposer and the redistribution layer, which the packaging layer has an opening exposing the trench.
    Type: Application
    Filed: June 23, 2015
    Publication date: February 11, 2016
    Inventors: Chien-Min LIN, Yu-Ting HUANG, Chen-Ning FU, Yen-Shih HO