Abstract: A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.

Abstract: A lead frame structure comprises a side rail, a first paddle, a second paddle, a plurality of leads, and an downset anchor bar. The first paddle is connected to the side rail via at least one first tie bar, and the second paddle is connected to the side rail via at least one-second tie bar. The first paddle and the second paddle separated from each other are used to define an area to support a chip. These leads set on the side rail expends toward to the chip supporting area. One end of the downset anchor bar is connected to the side rail, and the other end of the downset anchor bar has a protrusion portion which is between the first paddle and the second paddle and is downset from the side rail.

Abstract: A method for discharging an electronic device on a substrate is provided. A metal pin mounted on a wire bonder is used to touch with a specific finger disposed on the substrate which is in electrical connection with the electronic device. As a result, the electric charge previously stored in the electronic device will be conducted to the wire bonder through the specific finger and metal pin thereby discharging the stored charge. Another method for discharging an electronic device on a substrate is also provided. A metal wire protruding out from the capillary of a wire bonder is heated to form a metal ball at the capillary. The capillary is moved to bring the metal ball into contact with the specific finger. As a result, the electric charge previously stored in the electronic device will thus can be discharged to the wire bonder. The present invention further provides a semiconductor package.

Abstract: A heat block for holding an electronic device is disclosed. The heat block comprises a base and at least one discharge device. The discharge device is disposed on the base. The discharge device is electrically conductive and is grounded. When the electronic device is placed on the base, the discharge device is in contact with an electrical contact of the electronic device.

Abstract: An inspection device for the position of trademark on integrated circuit board is disclosed. The inspection device comprises an inspection plate made from a transparent acrylic material having a plurality of inspection engraving lines thereon and a plurality of position holes; and a base seat having mounted with a plurality of position pegs which correspond to the position holes on the inspection plate; thereby a pin platform for inspection is positioned between the base seat and the inspection plate and the inspection line is corresponding to the trademark on the surface of the integrated circuit (IC) to proceed with the inspection.

Abstract: An inspection device for wiring of integrated circuit includes a base seat and an inspection cover, wherein the top end of the base seat is provided with cavity of appropriate depth and having supporting rib, and the two lateral sides of the cavity are provided with protruded edge a little higher than the cavity; the inspection cover having two side blocks is provided with an extended frame stripe such that the two side blocks and the two frame stripes are formed into a frame body, and corresponding stripes are formed between the two side blocks such that the corresponding stripes divides the frame body into a plurality of observation region, and each observation region is adapted for an inspection plate made from a transparent material, and the two side withholding seat of the inspection plate are located at the end face of the two side blocks, and the inspection plate moves along the end face of the two side blocks, whereby the base plate of the IC is positioned at the withholding protruded edge of the base