Patents by Inventor Chen-Ron Lin
Chen-Ron Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070098207Abstract: A structure of ribbon type planar speaker is provided, which includes a composite diaphragm with a flexible edge fixed on a fixed end; a first magnet and a second magnet, respectively disposed above and below the composite diaphragm, and respectively fixed on an upper frame and a lower frame, wherein both frames have openings; and a second lower frame, disposed below the lower frame, wherein an air damping absorption layer is disposed between the lower frame and the second lower frame. The air damping absorption layer enhances air damping and thus limits irregular vibration between the diaphragm and the pushed air. Therefore, when the diaphragm of the ribbon type planar speaker is in vibration, the effective vibration range performs uniform synchronous vibration, thus making the frequency response range broader and smoother.Type: ApplicationFiled: September 6, 2006Publication date: May 3, 2007Applicant: BESTON TECHNOLOGY CORPORATIONInventor: Chen-Ron Lin
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Patent number: 7069641Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.Type: GrantFiled: April 25, 2003Date of Patent: July 4, 2006Assignee: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Publication number: 20030217457Abstract: The present invention discloses a method for preparing a conductive polymeric composite material having carbon black utilized to a structure for composite materials of a positive temperature coefficient thermistor. The method first provides a metal laminated material comprising a top metal layer and a bottom metal layer, an insulating layer between the top and the bottom metal layer, and a conducting through hole disposed between the top metal layer and the bottom metal layer. A composite electroplating process is then performed to form an composite electroplating layer on the surface of the top metal layer, wherein the composite electroplating layer is a continuous porous structure with a secondary aggregation of carbon black and electroplated metal.Type: ApplicationFiled: April 25, 2003Publication date: November 27, 2003Applicant: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Patent number: 6602438Abstract: A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.Type: GrantFiled: December 7, 2001Date of Patent: August 5, 2003Assignee: Protectronics Technology CorporationInventor: Chen-Ron Lin
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Patent number: 6590491Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.Type: GrantFiled: January 24, 2002Date of Patent: July 8, 2003Assignee: Protectronics Technology CorporationInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Publication number: 20030107466Abstract: A structure for polymeric thermistor device and method of making the same are disclosed. The polymeric thermistor makes use of a polymeric composite filled with conductive filler and show resistance variations at different temperatures. A polymeric substrate filled with conductive filler is cross-linked so that the whole polymeric composite structure filled with conductive filler is able to memorize shape. Then, the cross-linked polymeric composite undergoes a simple-sheared process and turns into a polymeric composite with a strain more than 1%. Therefore, the micro-structure and electrical properties of the conductive filler are changed.Type: ApplicationFiled: December 7, 2001Publication date: June 12, 2003Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventor: Chen-Ron Lin
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Publication number: 20020130757Abstract: The present invention discloses a surface mountable polymeric circuit protection device. The surface mountable polymeric circuit protection device is formed by configuring a conductive polymeric element having PTC features in combination with a top electrode, a bottom electrode and an insulative layer therebetween without conductive mechanisms between the top and the bottom electrodes.Type: ApplicationFiled: October 31, 2001Publication date: September 19, 2002Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Chien-Shan Huang, Ren-Haur Hwang, Chen-Ron Lin
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Publication number: 20020125983Abstract: The present invention discloses a structure for composite materials of a positive temperature coefficient thermistor and a method of making the same. A carbon black is electroplated onto a surface of the metal electrodes of a metal laminated material to form a continuous porous structure having carbon black. Then a thermal laminating process is used to laminate the metal laminated material and a conductive crystallized polymeric composite material plaque filled with carbon black, to form a fine point between surfaces of the metal electrodes of metal laminated material and the conductive crystallized polymeric composite material plaque filled with carbon black. In the meantime, it can also lower down interfacial resistance by allowing carbon black particles of conductive crystallized polymeric composite material filled with carbon black to fully contact with the surface electroplated layer of the metal electrodes.Type: ApplicationFiled: January 24, 2002Publication date: September 12, 2002Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Ren-Haur Hwang, Der-Yang Liu, Chen-Ron Lin
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Publication number: 20020058208Abstract: The present invention discloses a polymeric circuit protection device and a method of making the same, wherein a highly conductive composite material and a conductive composite material of positive temperature coefficient thermal sensitive resistance are alternately stacked to form a plaque-shaped composite material, then two metal foils are laminated on top surface and bottom surface of the plaque-shaped composite material as electrodes to thereby form a sandwich-like laminated material. Moreover, a cross-linking process is made to cross-link the resin inside the composite material layer. Electrode trenches are etched, and an insulating layer is formed by using green paint in the electrode trenches to isolate different electrodes on the same surface of the device.Type: ApplicationFiled: October 1, 2001Publication date: May 16, 2002Applicant: PROTECTRONICS TECHNOLOGY CORPORATIONInventors: Chen-Ron Lin, Rei-Yian Chen, Ren-Haur Hwang, Chih-Yi Chang
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Patent number: 6320129Abstract: This invention provides a method for making an electrode film for a composite polymer material. A composite plating method is used to form a conductive plate film with microrough surface of 0.01 to 100 microns which will be adhered to a composite polymer material, enhances the adhering performance and reduces the interface electrical resistance.Type: GrantFiled: September 21, 1999Date of Patent: November 20, 2001Assignee: Industrial Technology Research InstituteInventors: Shu-Chin Chou, Kun-Huang Chang, Chen-Ron Lin
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Patent number: 6277510Abstract: The present invention provides a porous electrode used for a conductive material-filled polymer composite. At least one surface of the porous electrode is an open porous structure, which includes a plurality of macropores and micropores randomly distributed and interconnected with each other. The conductive material-filled polymer composite includes a polymer substrate and conductive particles filled therein. When the surface of the open porous structure of the porous electrode is bonded with the conductive material-filled polymer composite, the conductive particles in the conductive material-filled polymer composite can be trapped in the macropores of the porous structure, and the polymer substrate in the conductive material-filled polymer composite can be immersed into the micropores of the porous structure. This enables a better direct contact between the conductive particles and the porous electrode.Type: GrantFiled: January 10, 2000Date of Patent: August 21, 2001Assignee: Industrial Technology Research InstituteInventors: Kun-Huang Chang, Wei-Wen Yeh, Shu-Chin Chou, Chen-Ron Lin