Patents by Inventor Chen-Shen Lin

Chen-Shen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190329367
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Application
    Filed: May 10, 2018
    Publication date: October 31, 2019
    Inventors: Tsang-I TSAI, Yi-Shen LIN, Min-Wei HSU, Chen-Xi YU
  • Patent number: 10409336
    Abstract: An electronic device including a first body having a first recess, a second body having a second recess corresponding to the first recess, and at least one dual-shaft hinge module connected to the first and the second bodies and disposed at inner sides of the first and the second bodies. The first and the second bodies rotate relatively via the dual-shaft binge module to be opened or closed. The dual-shaft hinge module has a dual protrusion structure movably accommodated in the first and the second recesses, and the dual protrusion structure moves into or out of the first and the second recesses when the first and the second bodies rotate relatively via the dual-shaft hinge module.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: September 10, 2019
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Che-Hsien Lin, Che-Hsien Chu, Wei-Ning Chai, Chen-Hsien Cheng, Li-Fang Chen, Chun-An Shen, Yi-Hsuan Wu
  • Patent number: 10124405
    Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 13, 2018
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cai-Hua Wang, Yue-Jian Li, Chen-Shen Lin, Wen-Hsiung Chang, Chun-Jung Chang
  • Patent number: 10040120
    Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: August 7, 2018
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cai-Hua Wang, Yue-Jian Li, Chen-Shen Lin, Wen-Hsiung Chang, Chun-Jung Chang
  • Publication number: 20180141114
    Abstract: A metallic article can include a cast metallic body and at least one metallic element. The cast metallic body defines at least one first space. The least one metallic element is received in the cast metallic body and seamless with the cast metallic body. The at least one metallic element is exposed from the at least one first space. A heat conductivity of the cast metallic body is lower than that of the at least one metallic element. The present disclosure further provides a method for manufacturing metallic article.
    Type: Application
    Filed: January 11, 2018
    Publication date: May 24, 2018
    Inventors: JUN-JUN YANG, CAI-HUA WANG, YUE-JIAN LI, CHEN-SHEN LIN, WEN-HSIUNG CHANG, CHUN-JUNG CHANG
  • Patent number: 9901979
    Abstract: A metallic article can include a cast metallic body and at least one metallic element. The cast metallic body defines at least one first space. The least one metallic element is received in the cast metallic body and seamless with the cast metallic body. The at least one metallic element is exposed from the at least one first space. A heat conductivity of the cast metallic body is lower than that of the at least one metallic element. The present disclosure further provides a method for manufacturing metallic article.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: February 27, 2018
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jun-Jun Yang, Cai-Hua Wang, Yue-Jian Li, Chen-Shen Lin, Wen-Hsiung Chang, Chun-Jung Chang
  • Publication number: 20160309903
    Abstract: A folding stool includes a pair of table surface sections, a pair of leg sections, and a pivot member. The pair of table surface sections is connected to each other by the pivot member, and the pair of leg sections supports the pair of table surface sections. Each leg section includes a bottom and a top, and the top resists against the table surface section. The folding stool is made of aluminum and magnesium alloy, further includes a plurality of first connecting members and a plurality of second connecting members. Each table surface section includes a first connecting hole and a second connecting hole, and each leg section includes a third connecting hole and a fourth connecting hole. The first connecting member is connected between first connecting hole and the third connecting hole, and the second connecting member is connected between second connecting hole and the fourth connecting hole.
    Type: Application
    Filed: May 19, 2015
    Publication date: October 27, 2016
    Inventors: BO HUANG, JUN-XIAO LIU, HONG-ZHAO QI, CAI-HUA WANG, YUE-JIAN LI, CHEN-SHEN LIN, WEN-HSIUNG CHANG, CHUN-JUNG CHANG
  • Publication number: 20160263650
    Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.
    Type: Application
    Filed: May 23, 2016
    Publication date: September 15, 2016
    Inventors: CAI-HUA WANG, YUE-JIAN LI, CHEN-SHEN LIN, WEN-HSIUNG CHANG, CHUN-JUNG CHANG
  • Publication number: 20160207104
    Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.
    Type: Application
    Filed: March 29, 2016
    Publication date: July 21, 2016
    Inventors: CAI-HUA WANG, YUE-JIAN LI, CHEN-SHEN LIN, WEN-HSIUNG CHANG, CHUN-JUNG CHANG
  • Patent number: 9370823
    Abstract: A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting. The inner structural member comprises a peripheral sidewall, a plurality of engaging portions, and a plurality of matching portions. The plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly. Each latching portion comprises at least two parallel latching ribs, and forms a receiving groove between two adjacent latching ribs. The plurality of engaging portions is respectively embedded in the plurality of receiving grooves, and the plurality of matching portions is respectively embedded in the plurality of latching grooves. The present disclosure further provides a manufacturing method for the metallic housing.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: June 21, 2016
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cai-Hua Wang, Yue-Jian Li, Chen-Shen Lin, Wen-Hsiung Chang, Chun-Jung Chang
  • Patent number: 9358606
    Abstract: A metallic housing of an electronic device includes a metallic outer case and an inner structural member embedded in the inner side of the outer case by die-casting. The outer case includes a bottom plate and a peripheral sidewall. The bottom plate is equipped with a number of latching hooks. The latching hooks are spaced from each other. The peripheral sidewall defines a receiving groove at an inner side along the peripheral sidewall. The inner structural member is made of metal alloy, and includes a base plate and a frame sidewall surrounding a periphery of the base plate, a protruding flange protruding from the frame sidewall, and a plurality of combining grooves on the base plate. The protruding flange is received in the receiving grooves, and the number of latching hooks is respectively received in the number of combining grooves.
    Type: Grant
    Filed: July 26, 2013
    Date of Patent: June 7, 2016
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cai-Hua Wang, Yue-Jian Li, Chen-Shen Lin, Wen-Hsiung Chang, Chun-Jung Chang
  • Publication number: 20150306661
    Abstract: A metallic article can include a cast metallic body and at least one metallic element. The cast metallic body defines at least one first space. The least one metallic element is received in the cast metallic body and seamless with the cast metallic body. The at least one metallic element is exposed from the at least one first space. A heat conductivity of the cast metallic body is lower than that of the at least one metallic element. The present disclosure further provides a method for manufacturing metallic article.
    Type: Application
    Filed: April 21, 2015
    Publication date: October 29, 2015
    Inventors: JUN-JUN YANG, CAI-HUA WANG, YUE-JIAN LI, CHEN-SHEN LIN, WEN-HSIUNG CHANG, CHUN-JUNG CHANG
  • Publication number: 20150021064
    Abstract: A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting. The inner structural member comprises a peripheral sidewall, a plurality of engaging portions, and a plurality of matching portions. The plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly. Each latching portion comprises at least two parallel latching ribs, and forms a receiving groove between two adjacent latching ribs. The plurality of engaging portions is respectively embedded in the plurality of receiving grooves, and the plurality of matching portions is respectively embedded in the plurality of latching grooves. The present disclosure further provides a manufacturing method for the metallic housing.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 22, 2015
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: CAI-HUA WANG, YUE-JIAN LI, CHEN-SHEN LIN, WEN-HSIUNG CHANG, CHUN-JUNG CHANG
  • Publication number: 20150021065
    Abstract: A metallic housing of an electronic device includes a metallic outer case and an inner structural member embedded in the inner side of the outer case by die-casting. The outer case includes a bottom plate and a peripheral sidewall. The bottom plate is equipped with a number of latching hooks. The latching hooks are spaced from each other. The peripheral sidewall defines a receiving groove at an inner side along the peripheral sidewall. The inner structural member is made of metal alloy, and includes a base plate and a frame sidewall surrounding a periphery of the base plate, a protruding flange protruding from the frame sidewall, and a plurality of combining grooves on the base plate. The protruding flange is received in the receiving grooves, and the number of latching hooks is respectively received in the number of combining grooves.
    Type: Application
    Filed: July 26, 2013
    Publication date: January 22, 2015
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.
    Inventors: CAI-HUA WANG, YUE-JIAN LI, CHEN-SHEN LIN, WEN-HSIUNG CHANG, CHUN-JUNG CHANG
  • Patent number: 7740050
    Abstract: A mold (200) for manufacturing a heat dissipation apparatus (10) includes a movable mold (20) and a fixed mold (30) covering the movable mold. The heat dissipation apparatus includes a plurality of fins (12). One of the movable mold and the fixed mold includes an insert group (50). The insert group includes a plurality of separated inserts (51) stacked together. A plurality of compartments (513) are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.
    Type: Grant
    Filed: June 14, 2007
    Date of Patent: June 22, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Chen-Shen Lin, Zhi-Ming Liu
  • Patent number: 7537049
    Abstract: A heat dissipation apparatus (10) includes a computer enclosure (110) made of thermally conductive material, a fin assembly (140) secured to the computer enclosure, and a heat pipe (130) having an evaporating section (131) thermally connecting with a heat generating electronic component and a condensing section (132) thermally connecting with the fin assembly. The fin assembly has a bottom surface contacting with a chassis of the enclosure to thereby transfer heat from the fin assembly to the chassis for dissipation. The enclosure forms a pair of clamping members (111) clamping the fin assembly therebetween.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: May 26, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Chen-Shen Lin
  • Patent number: 7460370
    Abstract: A heat dissipation assembly (100) is provided. The heat dissipation assembly (100) comprises a chassis (20) of an electronic product, a heat sink (10) having a bottom portion thereof being insert-molded with the chassis (20) so that the heat sink (10) and the chassis (20) are integrally connected together as a single piece, a base (30) secured to the chassis (20) and having a top surface (32) thermally connecting with a heat generating electronic unit of the electronic product and a bottom surface (34) thermally connecting with the chassis (20), a fan (40) used for cooling the heat sink (10), and a heat pipe (50) having an evaporator section (52) connected with the base (30) and a condenser section (54) connected with the heat sink (10).
    Type: Grant
    Filed: October 12, 2006
    Date of Patent: December 2, 2008
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Chen-Shen Lin
  • Publication number: 20080156452
    Abstract: A mold (200) for manufacturing a heat dissipation apparatus (10) includes a movable mold (20) and a fixed mold (30) covering the movable mold. The heat dissipation apparatus includes a plurality of fins (12). One of the movable mold and the fixed mold includes an insert group (50). The insert group includes a plurality of separated inserts (51) stacked together. A plurality of compartments (513) are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.
    Type: Application
    Filed: June 14, 2007
    Publication date: July 3, 2008
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: NIEN-TIEN CHENG, CHEN-SHEN LIN, ZHI-MING LIU
  • Publication number: 20070279866
    Abstract: A heat dissipation assembly (100) is provided. The heat dissipation assembly (100) comprises a chassis (20) of an electronic product, a heat sink (10) having a bottom portion thereof being insert-molded with the chassis (20) so that the heat sink (10) and the chassis (20) are integrally connected together as a single piece, a base (30) secured to the chassis (20) and having a top surface (32) thermally connecting with a heat generating electronic unit of the electronic product and a bottom surface (34) thermally connecting with the chassis (20), a fan (40) used for cooling the heat sink (10), and a heat pipe (50) having an evaporator section (52) connected with the base (30) and a condenser section (54) connected with the heat sink (10).
    Type: Application
    Filed: October 12, 2006
    Publication date: December 6, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Chen-Shen Lin
  • Patent number: D871392
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: December 31, 2019
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Zuo-Wen Wang, Tong-Shen Hsiung, Ming-Chih Huang, Meng-Chu Huang, Sin-Fei Lai, Fu-Yu Tsai, Szu-Tang Chiu, Chih-Kuang Lin, Chen-Chun Shiang, Wai Tong Chan