Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.

Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.

Abstract: A metallic article can include a cast metallic body and at least one metallic element. The cast metallic body defines at least one first space. The least one metallic element is received in the cast metallic body and seamless with the cast metallic body. The at least one metallic element is exposed from the at least one first space. A heat conductivity of the cast metallic body is lower than that of the at least one metallic element. The present disclosure further provides a method for manufacturing metallic article.

Abstract: A metallic article can include a cast metallic body and at least one metallic element. The cast metallic body defines at least one first space. The least one metallic element is received in the cast metallic body and seamless with the cast metallic body. The at least one metallic element is exposed from the at least one first space. A heat conductivity of the cast metallic body is lower than that of the at least one metallic element. The present disclosure further provides a method for manufacturing metallic article.

Abstract: A folding stool includes a pair of table surface sections, a pair of leg sections, and a pivot member. The pair of table surface sections is connected to each other by the pivot member, and the pair of leg sections supports the pair of table surface sections. Each leg section includes a bottom and a top, and the top resists against the table surface section. The folding stool is made of aluminum and magnesium alloy, further includes a plurality of first connecting members and a plurality of second connecting members. Each table surface section includes a first connecting hole and a second connecting hole, and each leg section includes a third connecting hole and a fourth connecting hole. The first connecting member is connected between first connecting hole and the third connecting hole, and the second connecting member is connected between second connecting hole and the fourth connecting hole.

Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.

Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.

Abstract: A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting. The inner structural member comprises a peripheral sidewall, a plurality of engaging portions, and a plurality of matching portions. The plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly. Each latching portion comprises at least two parallel latching ribs, and forms a receiving groove between two adjacent latching ribs. The plurality of engaging portions is respectively embedded in the plurality of receiving grooves, and the plurality of matching portions is respectively embedded in the plurality of latching grooves. The present disclosure further provides a manufacturing method for the metallic housing.

Abstract: A metallic housing of an electronic device includes a metallic outer case and an inner structural member embedded in the inner side of the outer case by die-casting. The outer case includes a bottom plate and a peripheral sidewall. The bottom plate is equipped with a number of latching hooks. The latching hooks are spaced from each other. The peripheral sidewall defines a receiving groove at an inner side along the peripheral sidewall. The inner structural member is made of metal alloy, and includes a base plate and a frame sidewall surrounding a periphery of the base plate, a protruding flange protruding from the frame sidewall, and a plurality of combining grooves on the base plate. The protruding flange is received in the receiving grooves, and the number of latching hooks is respectively received in the number of combining grooves.

Abstract: A metallic article can include a cast metallic body and at least one metallic element. The cast metallic body defines at least one first space. The least one metallic element is received in the cast metallic body and seamless with the cast metallic body. The at least one metallic element is exposed from the at least one first space. A heat conductivity of the cast metallic body is lower than that of the at least one metallic element. The present disclosure further provides a method for manufacturing metallic article.

Abstract: A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting. The inner structural member comprises a peripheral sidewall, a plurality of engaging portions, and a plurality of matching portions. The plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly. Each latching portion comprises at least two parallel latching ribs, and forms a receiving groove between two adjacent latching ribs. The plurality of engaging portions is respectively embedded in the plurality of receiving grooves, and the plurality of matching portions is respectively embedded in the plurality of latching grooves. The present disclosure further provides a manufacturing method for the metallic housing.

Abstract: A metallic housing of an electronic device includes a metallic outer case and an inner structural member embedded in the inner side of the outer case by die-casting. The outer case includes a bottom plate and a peripheral sidewall. The bottom plate is equipped with a number of latching hooks. The latching hooks are spaced from each other. The peripheral sidewall defines a receiving groove at an inner side along the peripheral sidewall. The inner structural member is made of metal alloy, and includes a base plate and a frame sidewall surrounding a periphery of the base plate, a protruding flange protruding from the frame sidewall, and a plurality of combining grooves on the base plate. The protruding flange is received in the receiving grooves, and the number of latching hooks is respectively received in the number of combining grooves.

Abstract: A mold (200) for manufacturing a heat dissipation apparatus (10) includes a movable mold (20) and a fixed mold (30) covering the movable mold. The heat dissipation apparatus includes a plurality of fins (12). One of the movable mold and the fixed mold includes an insert group (50). The insert group includes a plurality of separated inserts (51) stacked together. A plurality of compartments (513) are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.

Abstract: A heat dissipation apparatus (10) includes a computer enclosure (110) made of thermally conductive material, a fin assembly (140) secured to the computer enclosure, and a heat pipe (130) having an evaporating section (131) thermally connecting with a heat generating electronic component and a condensing section (132) thermally connecting with the fin assembly. The fin assembly has a bottom surface contacting with a chassis of the enclosure to thereby transfer heat from the fin assembly to the chassis for dissipation. The enclosure forms a pair of clamping members (111) clamping the fin assembly therebetween.

Abstract: A heat dissipation assembly (100) is provided. The heat dissipation assembly (100) comprises a chassis (20) of an electronic product, a heat sink (10) having a bottom portion thereof being insert-molded with the chassis (20) so that the heat sink (10) and the chassis (20) are integrally connected together as a single piece, a base (30) secured to the chassis (20) and having a top surface (32) thermally connecting with a heat generating electronic unit of the electronic product and a bottom surface (34) thermally connecting with the chassis (20), a fan (40) used for cooling the heat sink (10), and a heat pipe (50) having an evaporator section (52) connected with the base (30) and a condenser section (54) connected with the heat sink (10).

Abstract: A mold (200) for manufacturing a heat dissipation apparatus (10) includes a movable mold (20) and a fixed mold (30) covering the movable mold. The heat dissipation apparatus includes a plurality of fins (12). One of the movable mold and the fixed mold includes an insert group (50). The insert group includes a plurality of separated inserts (51) stacked together. A plurality of compartments (513) are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.

Abstract: A heat dissipation assembly (100) is provided. The heat dissipation assembly (100) comprises a chassis (20) of an electronic product, a heat sink (10) having a bottom portion thereof being insert-molded with the chassis (20) so that the heat sink (10) and the chassis (20) are integrally connected together as a single piece, a base (30) secured to the chassis (20) and having a top surface (32) thermally connecting with a heat generating electronic unit of the electronic product and a bottom surface (34) thermally connecting with the chassis (20), a fan (40) used for cooling the heat sink (10), and a heat pipe (50) having an evaporator section (52) connected with the base (30) and a condenser section (54) connected with the heat sink (10).

Abstract: A heat dissipation apparatus (10) includes a computer enclosure (110) made of thermally conductive material, a fin assembly (140) secured to the computer enclosure, and a heat pipe (130) having an evaporating section (131) thermally connecting with a heat generating electronic component and a condensing section (132) thermally connecting with the fin assembly. The fin assembly has a bottom surface contacting with a chassis of the enclosure to thereby transfer heat from the fin assembly to the chassis for dissipation. The enclosure forms a pair of clamping members (111) clamping the fin assembly therebetween.

Abstract: A heat dissipation apparatus includes a metal enclosure for an electronic device, at least one heat pipe secured to the enclosure, a fin assembly secured to the enclosure, a centrifugal blower secured to the enclosure for promoting heat dissipation for the fin assembly. The heat pipe has an evaporating section thermally connecting with a heat generating electronic component within the enclosure, and first and second condensing sections respectively connecting with the enclosure and the fin assembly. The enclosure absorbs and dissipates heat generated by the heat generating electronic component. The heat dissipation surface area is increased and as a result the heat dissipation efficiency of the heat dissipation apparatus is improved.