Abstract: In an embodiment, a package includes an encapsulant laterally surrounding a first integrated circuit device and a second integrated circuit device, wherein the first integrated circuit device includes a die and a heat dissipation structure over the die; a sealant disposed over the heat dissipation structure; an adhesive disposed over the second integrated circuit device; and a lid disposed over the sealant and the adhesive, wherein the lid includes a first cooling passage and a second cooling passage, the first cooling passage including an opening at a bottom of the lid and aligned to the heat dissipation structure, the second cooling passage including channels aligned to the second integrated circuit device and being distant from the bottom of the lid.

Abstract: A device includes an integrated circuit die attached to a substrate; a lid attached to the integrated circuit die; a sealant on the lid; a spacer structure attached to the substrate adjacent the integrated circuit die; and a cooling cover attached to the spacer structure, wherein the cooling cover extends over the lid, wherein the cooling cover attached to the lid by the sealant. In an embodiment, the device includes a ring structure on the substrate, wherein the ring structure is between the spacer structure and the integrated circuit die.

Abstract: A package includes a first package component including a semiconductor die, wherein the semiconductor die includes conductive pads, wherein the semiconductor die is surrounded by an encapsulant; an adaptive interconnect structure on the semiconductor die, wherein the adaptive interconnect structure includes conductive lines, wherein each conductive line physically and electrically contacts a respective conductive pad; and first bond pads, wherein each first bond pad physically and electrically contacts a respective conductive line; and a second package component including an interconnect structure, wherein the interconnect structure includes second bond pads, wherein each second bond pad is directly bonded to a respective first bond pad, wherein each second bond pad is laterally offset from a corresponding conductive pad which is electrically coupled to that second bond pad.

Abstract: A connection structure of a semiconductor device is provided in the present invention. The connection structure includes an interlayer dielectric, a top metal structure, and a passivation layer. The interlayer dielectric is disposed on a substrate. The top metal structure is disposed on the interlayer dielectric. The top metal structure includes a bottom portion and a top portion disposed on the bottom portion. The bottom portion includes a first sidewall, and the top portion includes a second sidewall. A slope of the first sidewall is larger than a slope of the second sidewall. The passivation layer is conformally disposed on the second sidewall, the first sidewall, and a top surface of the interlayer dielectric.

Abstract: An adaptive air conditioning system, a method for the system, and a carrier equipped with the system are disclosed. The carrier includes at least one adaptive air conditioning system. The carrier has a body, which includes at least one cabin defining a compartment for accommodating transported objects, such as passengers or cargos. The adaptive air conditioning system includes data collecting apparatus, temperature control apparatus, and a microcontroller. The temperature control apparatus includes a liquid circulation unit, an air circulation unit, and a control switch. With the adaptive air conditioning system, the air and internal installation in the compartment can be controlled at a predetermined temperature more promptly, efficiently, uniformly, and flexibly, thus increasing comfort level for the passengers or meeting the temperature requirements for the cargos.

Abstract: A structure formed by temperature difference includes an enveloped part, an enveloping part, and a low heat transfer layer. The enveloped part has a free section and an engagement section. The enveloping part defines at least one holding space corresponding to the engagement section. The holding space is dimensioned to be slightly less than the engagement section and can be thermally expanded to be larger than the engagement section by heating the enveloping part to reach a predetermined temperature difference over the enveloped part, so that the engagement section can be put into the holding space. When the enveloping part is cooled, the holding space can shrink, causing the enveloping part to tightly hold the engagement section. The low heat transfer layer, which has a thermal conductivity less than each of the two parts, is disposed in the holding space, between the engagement section and the enveloping part.

Abstract: Disclosed is reconfigurable decentralized freight shipping system, configured for a shipper to send at least one shipment to a predetermined target, including: at least one freight terminal configured for receiving a plurality of shipment-loaded standard sized modular container; a plurality of transport means respectively having a wireless communication means and operating in respective operating areas, each of the operating areas being at least intersected with at least another one of the operating areas, and at least one computing server configured for computing the shipping information and the location information of the wireless communication means to work out a delivery solution, transmitting delivery information corresponding to the delivery solution to the transport means, and updating the delivery solution based on the updated shipping information changed by the shipper and/or the recipient destination.

Abstract: An time variant geographical information acquisition system for mobile vehicles and the system thereof is disclosed, which provides the time variant geographic information system to at least one mobile vehicle located in the aforementioned three-dimensional space, wherein the system comprises: a plurality of image capturing apparatus, at least one monitoring host and at least one time variant geographical information acquisition system for mobile vehicles installed on the above-said mobile vehicle, in which the data capture device includes: a wireless communication unit, connected to the image capturing apparatus and/or the monitoring host; a timing unit, used to output a timing signal in cooperation with the wireless communication unit; a memory module, storing the geographic information corresponding to at least the aforementioned mobile vehicle in the three-dimensional space; and a traffic scenario output interface, collectively displaying the geographic information and the time variant object information.

Abstract: An unmanned handling unit for a reconfigurable decentralized shipping system operates whereby a shipper first selects a freight container module of one of a plurality of sizes to pack at least one item, and then ships it to a predetermined target; the shipper inputs shipping information to the shipping system; when the shipper and/or the predetermined target modifies the shipping information, delivery is modified in real time.

Abstract: An adaptive air conditioning system, a method for the system, and a carrier equipped with the system are disclosed. The carrier includes at least one adaptive air conditioning system. The carrier has a body, which includes at least one cabin defining a compartment for accommodating transported objects, such as passengers or cargos. The adaptive air conditioning system includes data collecting apparatus, temperature control apparatus, and a microcontroller. The temperature control apparatus includes a liquid circulation unit, an air circulation unit, and a control switch. With the adaptive air conditioning system, the air and internal installation in the compartment can be controlled at a predetermined temperature more promptly, efficiently, uniformly, and flexibly, thus increasing comfort level for the passengers or meeting the temperature requirements for the cargos.

Abstract: A structure formed by temperature difference includes an enveloped part, an enveloping part, and a low heat transfer layer. The enveloped part has a free section and an engagement section. The enveloping part defines at least one holding space corresponding to the engagement section. The holding space is dimensioned to be slightly less than the engagement section and can be thermally expanded to be larger than the engagement section by heating the enveloping part to reach a predetermined temperature difference over the enveloped part, so that the engagement section can be put into the holding space. When the enveloping part is cooled, the holding space can shrink, causing the enveloping part to tightly hold the engagement section. The low heat transfer layer, which has a thermal conductivity less than each of the two parts, is disposed in the holding space, between the engagement section and the enveloping part.

Abstract: An time variant geographical information acquisition system for mobile vehicles and the system thereof is disclosed, which provides the time variant geographic information system to at least one mobile vehicle located in the aforementioned three-dimensional space, wherein the system comprises: a plurality of image capturing apparatus, at least one monitoring host and at least one time variant geographical information acquisition system for mobile vehicles installed on the above-said mobile vehicle, in which the data capture device includes: a wireless communication unit, connected to the image capturing apparatus and/or the monitoring host; a timing unit, used to output a timing signal in cooperation with the wireless communication unit; a memory module, storing the geographic information corresponding to at least the aforementioned mobile vehicle in the three-dimensional space; and a traffic scenario output interface, collectively displaying the geographic information and the time variant object information.