Abstract: A first wafer having a two-dimensional array of first semiconductor dies including arrays of first top metal bonding pads attached to a top surface of a first carrier wafer. A second wafer having a two-dimensional array of second semiconductor dies including arrays of second top metal bonding pads and arrays of second bottom metal bonding pads bonded to the first wafer by performing a first metal-to-metal bonding process in which the arrays of first top metal bonding pads are bonded to the arrays of second bottom metal bonding pads through first intermetallic diffusion. A third wafer having a two-dimensional array of third semiconductor dies including arrays of third bottom metal bonding pads bonded to the second wafer by performing a second metal-to-metal bonding process in which the arrays of second top metal bonding pads are bonded to the arrays of third bottom metal bonding pads through second intermetallic diffusion.

Abstract: A first wafer having a first portion closer to a first surface and a thicker second portion connected with the first portion and closer to the second surface opposite to the first surface is provided. A second wafer is provided to bond with the first wafer. An edge trimming process is performed to form a trench penetrating through the second wafer and extending beyond the first portion and extending into the second portion. After bonding dies to the second wafer, a filling material is formed over the dies and the first and second wafers, wrapping around and between the dies, covering the first and second wafers, and partially filling the trench. A wafer thinning process is performed to remove the second portion and partially remove the filling material in the trench to level the surface of the thinned first wafer with the surface of the thinned filling material.

Abstract: A stacking structure including a first die and a second die bonded with the first die is provided. The first die has a first region and a second region encircled by the first region. The first die includes first metallization structures having a first seal ring structure and a first bonding structure having first dummy pads located over the first seal ring structure. The second die includes second metallization structures having a second seal ring structure and a second bonding structure having second dummy pads located over the second seal ring structure. The first die and the second die are bonded through bonding of the first and second bonding structures. The first and second seal ring structures are substantially vertically aligned, and the first dummy pads are respectively bonded with the second dummy pads.

Abstract: Embodiments include methods of forming three-dimensional packages and the packages resulting therefrom. The packages may utilize a bridge die to electrically connect one die to another die and at least one additional die adjacent to the bridge die. The height-to-width ratio of the gap between the bridge die and the at least one additional die is controlled by thinning the bridge die to be thinner than the at least one additional die. The packages may utilize landing structures to adjoin a dielectric material of an attached die to a metallic landing structure of a base die.

Abstract: A method includes: forming first semiconductor dies in a first wafer, each die of the first semiconductor dies comprising: first active devices over a front-side of a first semiconductor substrate; performing first probe tests on the first wafer; based on the first probe tests, classifying each die of the first semiconductor dies as a first good die, a first marginal die, or a first bad die; forming second semiconductor dies in a second wafer; performing second probe tests on the second wafer; based on the second probe tests, classifying each die of the second semiconductor dies as a second good die, a second marginal die, or a second bad die; and bonding the second wafer to the first wafer, each die of the first semiconductor dies aligning with a corresponding die of the second semiconductor dies.

Abstract: Embodiments utilize a bridge die that directly bonds to and bridges two or more device dies. Each of the device dies can have additional device dies stacked thereupon. In some embodiments, the bridge die can bridge device dies disposed both under and over the bridge die. In some embodiments, several bridge dies may be used to bridge a device die to other adjacent device dies.

Abstract: A method is proposed to assist a user of an electric vehicle in reserving a rechargeable battery with a charging station. A reservation assistant unit that is related to the electric vehicle computes an estimated travelling distance from a current location corresponding to the electric vehicle to a destination, and computes a remaining distance based on residual electric energy of a rechargeable battery currently used by the electric vehicle. When the estimated travelling distance is greater than the remaining distance, the reservation assistant unit provides charging station information that indicates the closest charging station that has a rechargeable battery available.

Abstract: A system for battery binding includes a service end electronic device, at least one battery device and at least one carrier device. The service end electronic device is configured to send a carrier identifier corresponding to a carrier device to a battery device for storage therein in order to bind the battery device to the carrier device.

Abstract: A navigation method includes steps of: repeatedly emitting, by a wheel speed sensor, a pulse signal to a processor of a vehicle when the vehicle starts to travel from a start point of a route of a map; in response to receipt of a preset number of the pulse signals transmitting, by the processor, the preset number of the pulse signals to a portable device; calculating, by the portable device, a current position of the vehicle on the map based on a distance associated with the preset number of the pulse signals; and transmitting, by the portable device, data of the map having the current position to the processor so as to display the same.

Abstract: A navigation method is implemented by a group of portable devices which are associated with a map-and-information system and each of which is communicatively coupled to an instrument cluster device of a respective vehicle. The group of the portable devices includes a leader device and at least one follower device. The map-and-information system computes, for the follower device, a dynamic navigation path from the follower device to the leader device. The instrument cluster device of the vehicle that corresponds to the follower device perceivably outputs the dynamic navigation path.

Abstract: A system for managing power supply devices includes a server including a database and a server end processing module. The server end processing module is configured to receive an alteration request from a user end electronic device and an alteration-confirmation signal from a service end electronic device, and send a confirmation response to the service end electronic device based on the received alteration request and alteration-confirmation signal in order for the service end electronic device to enable a target power supply device to update data stored therein.

Abstract: A power management method for a vehicle is provided, and includes: upon a power switch of the vehicle being switched from a conductive state to a non-conductive state, controlling an electrical system of the vehicle to temporarily supply a wireless communication module of the vehicle with electric power and activating a timer; determining whether an elapsed time has reached a predetermined duration according to the timer; when the determination is affirmative, controlling the electrical system to stop supplying electric power; and when the determination is negative, controlling the timer to stop timing upon the power switch being switched from the non-conductive state to the activated state.

Abstract: A system for managing power supply devices includes an electronic device and plural power supply devices including a first power supply device and a second power supply device. The electronic device is configured to enable the first power supply device to delete a part of battery information stored therein, and enable the second power supply device to store therein a portion of the battery information that was originally stored in the power supply device.

Abstract: A system for battery binding includes a service end electronic device, at least one battery device and at least one carrier device. The service end electronic device is configured to send a carrier identifier corresponding to a carrier device to a battery device for storage therein in order to bind the battery device to the carrier device.

Abstract: A notification method is implemented by a notification system for battery pick-up, and includes: A) detecting a concerned battery identifier of a battery to be charged; B) determining one of plural sets of reference battery data corresponding to one of reference battery identifiers that matches the concerned battery identifier, and charging the battery; and C) transmitting, when it is determined that the battery has been fully charged, a pick-up notification to a target of notification transmission that is indicated by a user end target receiver code of said one of the plural sets of reference battery data determined in step B).

Abstract: A method for battery rental is proposed to include steps of: acquiring a contract identifier that indicates a type of a rental contract for a battery device to be used in a vehicle, and transmitting the contract identifier to the battery device for storage therein; transmitting a vehicle identifier corresponding to the vehicle to the battery device for storage therein; and transmitting the contract identifier and the vehicle identifier to a cloud server for storage therein.

Abstract: A system for managing power supply devices includes a server including a database and a server end processing module. The server end processing module is configured to receive an alteration request from a user end electronic device and an alteration-confirmation signal from a service end electronic device, and send a confirmation response to the service end electronic device based on the received alteration request and alteration-confirmation signal in order for the service end electronic device to enable a target power supply device to update data stored therein.

Abstract: A method for tracking a lost battery is to be implemented by an electric carrier system, and includes the following steps: recording a loss report that includes a concerned battery identifier which corresponds to a concerned battery; detecting a detected battery identifier of a detected battery, and obtaining location information that relates to where the detected battery is located; determining whether the detected battery identifier matches the concerned battery identifier; and recording the location information when it is determined that the detected battery identifier matches the concerned battery identifier.

Abstract: A navigation method is implemented by a group of portable devices which are associated with a map-and-information system and each of which is communicatively coupled to an instrument cluster device of a respective vehicle. The group of the portable devices includes a leader device and at least one follower device. The map-and-information system computes, for the follower device, a dynamic navigation path from the follower device to the leader device. The instrument cluster device of the vehicle that corresponds to the follower device perceivably outputs the dynamic navigation path.

Abstract: A system for managing power supply devices includes an electronic device and plural power supply devices including a first power supply device and a second power supply device. The electronic device is configured to enable the first power supply device to delete a part of battery information stored therein, and enable the second power supply device to store therein a portion of the battery information that was originally stored in the power supply device.