Abstract: The present disclosure provides a system and method for predicting wafer fabrication defects resulting from plasma processing of wafers in a plasma processing chamber. The system and method include processing electromagnetic signals emitted from residual compounds peeled from the chamber walls during the plasma processing of the wafers to indirectly determine the likelihood that the wafers are incurring fabrication processing defects during the plasma processing.

Abstract: An apparatus and method are disclosed to implement a radio-frequency (RF) 3D imaging system. In one embodiment, the method includes searching and analyzing signals emitted from emitters external to the 3D glasses to determine a strongest RF (Radio Frequency) signal source. The method also includes reading and storing an identification code of the strongest RF signal source. The method further includes receiving synchronization signals from an emitter that emits the strongest RF signal. In addition, the method includes synchronizing and controlling the 3D glasses based on the synchronization signals.

Abstract: An apparatus and method are disclosed to implement a universal 3D (3-Dimensional) image system with automatic search for 3D communication protocol. The apparatus includes a memory to store a plurality of communication protocols. The apparatus further includes a controller operatively coupled to the memory to detect a transmitted communication protocol by comparing the transmitted communication protocol with the plurality of communication protocols stored in the memory of the glasses. In addition, the controller receives and processes the 3D image data based on the transmitted communication protocol.