Patents by Inventor Chen Tang

Chen Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12326370
    Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: June 10, 2025
    Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.
    Inventors: Chein-Hsun Wang, Ming Le, Tung-Yang Lee, Yu-Chih Liang, Wen-Chie Huang, Chen-Tang Huang, Jenping Ku
  • Patent number: 12210965
    Abstract: In some examples, a dynamic system, including a vehicle, may be represented using a graph-based representation. One or more nodes in the graph-based representation may correspond to one or more agents in the dynamic system, and one or more edges between the nodes in the graph-based representation may correspond to one or more interactions between the agents in the dynamic system. The interactions may be defined based on human domain knowledge of the dynamic system. The dynamic system may be modeled using a respective machine learning model that includes a reward decoder that operates on the graph-based representation and evaluates one or more reward functions for the dynamic system. The one or more reward functions may be defined based on the human domain knowledge of the dynamic system. Autonomous operation of the vehicle may be controlled based on the modeling of the dynamic system.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: January 28, 2025
    Assignee: Honda Motor Co., Ltd.
    Inventors: Sujitha Catherine Martin, Chen Tang
  • Publication number: 20250023209
    Abstract: A battery includes a housing, a plurality of cells disposed inside the housing, and a set of strap structures. Each cell comprises a plurality of positive electrode plates and a plurality of negative electrode plates, and each respective electrode plate has a respective tip. The set of strap structures includes one or more of a first strap structure, which includes a positive strap line, a negative strap line, and at least two bridging lines disposed between and connected with the positive strap line and the negative strap line. The negative strap line is connected with respective tips of a plurality of negative electrode plates in a cell. The positive strap line is connected with respective tips of a plurality of positive electrode plates in a different cell. The first strap structure, the set of strap structure, and a method of making the battery are also provided.
    Type: Application
    Filed: July 12, 2024
    Publication date: January 16, 2025
    Applicant: Trojan Battery Company, LLC
    Inventors: Chen Tang, Qian Du, Haitao Zhou, Xingyu Zhang
  • Patent number: 12191229
    Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: January 7, 2025
    Assignee: Infineon Technologies AG
    Inventors: Ryan Tordillo Comadre, Victor Dela Cruz Del Rosario, Bernie Tabanao Rosales, Subaramaniym Senivasan, Heng Chen Tang
  • Publication number: 20250002895
    Abstract: The device uses pulsed electric fields to prevent the growth of biofilm and the attachment of bacteria to targeted surfaces. The device sets up an electric field around or surrounding the surface itself. These pulsed electric fields disrupt biofilm formation and bacterial attachment to surfaces. The device is meant to prevent the formation of biofilm or attachment of bacteria to a surface as opposed to disinfecting the surface. The device is able and ideally suited to be used for a plurality of purposes including but not limited to being used with beer lines to taps, ice makers, chillers or other HVAC systems, and containers for storing medical equipment such as dentures or other medical devices that may be stored in water.
    Type: Application
    Filed: September 16, 2024
    Publication date: January 2, 2025
    Inventors: Emily Chen Tang, Bryan Michael Gerber, Chadwick Phillip Pearson, Harsimran Panesar
  • Publication number: 20240403629
    Abstract: Some embodiments of the present disclosure are directed to systems, computer-readable media, and computer-implemented methods for neural network calibration. Some embodiments are directed to determining a universal perturbation value and temperature scaling parameter based on a training data set, and processing a testing data set using a neural network by applying the universal perturbation value to the testing data set, and applying the temperature scaling parameter to a plurality of logits determined by the neural network based on the testing data set. Other embodiments may be disclosed or claimed.
    Type: Application
    Filed: June 2, 2023
    Publication date: December 5, 2024
    Inventors: Pin-Yu Chen, I-Hsin Chung, Bo Wu, Chuang Gan, Tsung-Yi Ho, Yung-Chen Tang
  • Publication number: 20240336277
    Abstract: A method and system for controlling a device includes training a low-level policy to form a trained low-level policy and a low-level value function to form a trained goal conditioned value function, wherein training is performed using a static data set using goal conditioned episodes, training a high-level goal planner having high level goals having high-level sub-goals corresponding to a plurality of future time steps using the low-level value function to maximize a cumulative reward over the sub-goals for the plurality of future time steps so that the sub-goals are reachable by the low-level policy, obtaining an observation of a device, and generating an executable action using the low-level policy and the high-level goal planner and operating the device with the executable action.
    Type: Application
    Filed: February 12, 2024
    Publication date: October 10, 2024
    Applicants: DENSO International America, Inc., THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Minglei HUANG, Wei Zhan, Masayoshi Tomizuka, Chen Tang, Jinning Li
  • Patent number: 12104686
    Abstract: A harmonic deceleration module, a dynamic power device, an automatic mobile vehicle, a transfer apparatus, a dynamic power supply system, and an electric bicycle are provided. The harmonic deceleration module includes a connecting member, a flexible bearing, a first frame, a first circular spline, a second frame, and a second circular spline. When the connecting member is driven, the connecting member rotates around a central axis. The connecting member has a cam part, and the cam part and the flexible bearing jointly form a wave generator. The wave generator is configured to be driven by the connecting member to drive a flexspline to continually and flexibly deform, and the flexspline drives the second circular spline and the second frame connected to the second circular spline to rotate. The second frame has a hollow channel penetrating through the second frame along the central axis.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: October 1, 2024
    Assignee: MAIN DRIVE CORPORATION
    Inventors: Kun-Ju Hsieh, Chang-Lin Lee, Tung-Yu Li, Ching-Huei Wu, Hsiu-Chen Tang
  • Patent number: 12091654
    Abstract: The device uses pulsed electric fields to prevent the growth of biofilm and the attachment of bacteria to targeted surfaces. The device sets up an electric field around or surrounding the surface itself. These pulsed electric fields disrupt biofilm formation and bacterial attachment to surfaces. The device is meant to prevent the formation of biofilm or attachment of bacteria to a surface as opposed to disinfecting the surface.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: September 17, 2024
    Inventors: Emily Chen Tang, Bryan Michael Gerber, Chadwick Phillip Pearson, Harsimran Panesar
  • Patent number: 12085451
    Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: September 10, 2024
    Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.
    Inventors: Wen-Chie Huang, Yu-Chih Liang, Chein-Hsun Wang, Ming Le, Chen-Tang Huang, Chein-Hsing Yu, Tung-Yang Lee, Jenping Ku
  • Publication number: 20240230414
    Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
    Type: Application
    Filed: October 20, 2022
    Publication date: July 11, 2024
    Inventors: Chein-Hsun WANG, Ming LE, Tung-Yang LEE, Yu-Chih LIANG, Wen-Chie HUANG, Chen-Tang HUANG, Jenping KU
  • Patent number: 12007351
    Abstract: An electrode-modified heavy metal ion microfluidic detection chip, comprising a microfluidic module (1) and a three-electrode sensor (2), wherein the microfluidic module (1) is integrally molded by 3D printing, and the interior thereof has a microchannel (10) and a sensor slot (11); and the three-electrode sensor (2) comprises three electrodes (21, 22, 23) printed on a card-shaped bottom plate (20), among which the working electrode (21) is a porous nano-NiMn2O4 modified bare carbon electrode, and the three-electrode sensor (2) is inserted into the sensor slot (11) that matches same to form the microfluidic detection chip.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: June 11, 2024
    Assignees: JIANGSU YANGTZE TESTING AND CERTIFICATION CO., LTD., JINLING CUSTOMS TECHNNOLOGY CENTER
    Inventors: Ying Hong, Jiansong Chen, Juan Huang, Yangyun Wu, Lingling Tian, Wei Wang, Wei An, Jingling Wang, Yuanyuan Zhu, Chen Tang
  • Publication number: 20240133745
    Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.
    Type: Application
    Filed: October 19, 2022
    Publication date: April 25, 2024
    Inventors: Chein-Hsun WANG, Ming LE, Tung-Yang LEE, Yu-Chih LIANG, Wen-Chie HUANG, Chen-Tang HUANG, Jenping KU
  • Publication number: 20240037445
    Abstract: Systems and methods for pessimistic offline reinforcement learning are described herein. In one example, a method for performing offline reinforcement learning determines when sampled states are out of distribution, assigns high probability weights to the sampled states that are out of distribution, generates a fitted Q-function by solving an optimization problem with a minimization term and a maximization term, estimates a Q-value using the fitted Q-function by estimating the overall expected reward assuming the agent is in the present state and performs a present action, and updates the policy according to an existing reinforcement learning algorithm. The minimization term penalizes an overall expected reward when a present state is out of distribution. The maximization term cancels the minimization term when the present state is an in-distribution state.
    Type: Application
    Filed: October 19, 2022
    Publication date: February 1, 2024
    Applicants: Denso International America, Inc., The Regents of the University of California, DENSO CORPORATION
    Inventors: Minglei Huang, Jinning Li, Chen Tang, Masayoshi Tomizuka, Wei Zhan
  • Patent number: 11808633
    Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: November 7, 2023
    Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.
    Inventors: Chein-Hsun Wang, Da-Jun Lin, Chun-Chiang Chen, Chih-Yung Tsai, Yu-Chih Liang, Ming Le, Chen-Tang Huang, Tung-Yang Lee, Jenping Ku
  • Publication number: 20230349768
    Abstract: A temperature sensor device for a power distribution panel includes a Power over Ethernet (PoE) interface, a DC-to-DC step down converter, at least one infrared temperature sensor array, a microcontroller and a communication interface. The PoE interface is used to obtain a required power supply from the Ethernet network. The DC-to-DC step down converter steps down the power supply from a first voltage to a second voltage. The infrared temperature sensor array receives infrared rays radiated from a monitored area of the power distribution panel and generates a corresponding sensation signal. The microcontroller receives the sensation signal and generates an alert signal when the sensed temperature of the monitored area exceeds a preset threshold. The threshold can be dynamically adjusted according to time of day or day of months. The communication interface enables the communication between an external electronic device and the temperature sensor device for the power distribution panel.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 2, 2023
    Inventors: Chun-Chiang Chen, Chein-Hsun Wang, Chen-Tang Huang, Jenping Ku
  • Publication number: 20230125452
    Abstract: A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 27, 2023
    Inventors: Ryan Tordillo Comadre, Victor Dela Cruz Del Rosario, Bernie Tabanao Rosales, Subaramaniym Senivasan, Heng Chen Tang
  • Publication number: 20230047601
    Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.
    Type: Application
    Filed: August 16, 2021
    Publication date: February 16, 2023
    Inventors: Chein-Hsun WANG, Da-Jun LIN, Chun-Chiang CHEN, Chih-Yung TSAI, Yu-Chih LIANG, Ming LE, Chen-Tang HUANG, Tung-Yang LEE, Jenping KU
  • Publication number: 20220349852
    Abstract: An electrode-modified heavy metal ion microfluidic detection chip, comprising a microfluidic module (1) and a three-electrode sensor (2), wherein the microfluidic module (1) is integrally molded by 3D printing, and the interior thereof has a microchannel (10) and a sensor slot (11); and the three-electrode sensor (2) comprises three electrodes (21, 22, 23) printed on a card-shaped bottom plate (20), among which the working electrode (21) is a porous nano-NiMn2O4 modified bare carbon electrode, and the three-electrode sensor (2) is inserted into the sensor slot (11) that matches same to form the microfluidic detection chip.
    Type: Application
    Filed: March 27, 2020
    Publication date: November 3, 2022
    Inventors: YING HONG, Jiansong CHEN, Juan HUANG, Yangyun WU, Lingling TIAN, Wei WANG, Wei AN, Jingling WANG, Yuanyuan ZHU, Chen TANG
  • Patent number: D1046630
    Type: Grant
    Filed: January 10, 2023
    Date of Patent: October 15, 2024
    Assignee: Jiaxing Le Mai Le Mai Trading Co., Ltd
    Inventor: Chen Tang