Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Abstract: A temperature sensor device for a power distribution panel includes a Power over Ethernet (PoE) interface, a DC-to-DC step down converter, at least one infrared temperature sensor array, a microcontroller and a communication interface. The PoE interface is used to obtain a required power supply from the Ethernet network. The DC-to-DC step down converter steps down the power supply from a first voltage to a second voltage. The infrared temperature sensor array receives infrared rays radiated from a monitored area of the power distribution panel and generates a corresponding sensation signal. The microcontroller receives the sensation signal and generates an alert signal when the sensed temperature of the monitored area exceeds a preset threshold. The threshold can be dynamically adjusted according to time of day or day of months. The communication interface enables the communication between an external electronic device and the temperature sensor device for the power distribution panel.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

Abstract: An infrared temperature sensor comprises a thermopile sensing chip. The thermopile sensing chip includes a chip substrate, a thermopile sensing unit, a heater and a temperature sensing element. The thermopile sensing unit is disposed on the chip substrate, receives infrared thermal radiation from a target and outputs a corresponding infrared sensation signal. The heater is disposed on the chip substrate and used to heat the chip substrate to a working temperature. The temperature sensing element is disposed on the chip substrate, senses the working temperature of the chip substrate and outputs a corresponding working temperature signal. In operation, the infrared temperature sensor can maintain the thermopile sensing unit at the preset working temperature. Thereby, a single-point temperature calibration is sufficient to obtain more accurate measurement results in a broad environmental temperature range.

Abstract: A dryer includes a cylinder, a heater, a motor, a temperature sensor and a controller. The heater heats air and delivers the heated air into the cylinder. The motor is used to drive the cylinder to rotate. The temperature sensor includes a thermopile array sensor and a signal processor. The thermopile array sensor is used to sense an infrared light radiated from clothing and output a sensing signal. The signal processor is used to process the sensing signal to obtain at least one of a temperature distribution uniformity and an average temperature of the clothing, and output a control signal according to the at least one of the temperature distribution uniformity and the average temperature of the clothing. The controller determines to stop the drying schedule according to the control signal. The above-mentioned dryer can stop the drying schedule automatically, so as to save energy.

Abstract: A dryer includes a cylinder, a heater, a motor, a temperature sensor and a controller. The heater heats air and delivers the heated air into the cylinder. The motor is used to drive the cylinder to rotate. The temperature sensor includes a thermopile array sensor and a signal processor. The thermopile array sensor is used to sense an infrared light radiated from clothing and output a sensing signal. The signal processor is used to process the sensing signal to obtain at least one of a temperature distribution uniformity and an average temperature of the clothing, and output a control signal according to the at least one of the temperature distribution uniformity and the average temperature of the clothing. The controller determines to stop the drying schedule according to the control signal. The above-mentioned dryer can stop the drying schedule automatically, so as to save energy.

Abstract: A chip-scale infrared emitter package comprises an emitter chip and an enclosure. The emitter chip includes: a base having a central cavity; a membrane having a peripheral end, the peripheral end being isolated from a periphery of the central cavity by a loop-shaped gap; an electric resistor formed on the membrane; at least one slim supporting beam extending from the peripheral end of the membrane through the loop-shaped gap to the base; and a reflective material coated on the membrane. The enclosure has a can housing and a transparent window plate. The window plate cooperates with the can housing to define an enclosed vacuum chamber. The emitter chip is mounted in the enclosed vacuum chamber. The enclosed vacuum chamber has a pressure less than 0.01 torr.

Abstract: A packaging conductive structure for a semiconductor substrate and a method for forming the structure are provided. The dielectric layer of the packaging conductive structure partially overlays the metallic layer of the semiconductor substrate and has a receiving space. The lifting layer and conductive layer are formed in the receiving space, wherein the conductive layer extends for connection to a bump. The lifting layer is partially connected to the dielectric layer. As a result, the conductive layer can be stably deposited on the edge of the dielectric layer for enhancing the reliability of the packaging conductive structure.