Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: Semiconductor package includes a pair of dies, a redistribution structure, and a conductive plate. Dies of the pair of dies are disposed side by side. Each die includes a contact pad. Redistribution structure is disposed on the pair of dies, and electrically connects the pair of dies. Redistribution structure includes an innermost dielectric layer, an outermost dielectric layer, and a redistribution conductive layer. Innermost dielectric layer is closer to the pair of dies. Redistribution conductive layer extends between the innermost dielectric layer and the outermost dielectric layer. Outermost dielectric layer is furthest from the pair of dies. Conductive plate is electrically connected to the contact pads of the pair of dies. Conductive plate extends over the outermost dielectric layer of the redistribution structure and over the pair of dies. Vertical projection of the conductive plate falls on spans of the dies of the pair of dies.

Abstract: Driving method and circuit of an organic light emitting diode, applied to an array of a plurality of organic light emitting diode. The array has several rows and columns of organic light emitting diodes. The row and column corresponding to the organic light emitting selected to illuminate are selected. A first voltage is applied to the selected column, and a second voltage is applied to the selected row. The difference between the first and second voltages is larger than the conducting voltage of the organic light emitting diode, so that the light emitting diode can illuminate. A third voltage and a fourth voltages are applied to other rows and columns which are not connected to the selected organic light emitting diode to provide a reverse bias to all the remaining light emitting diodes.

Abstract: Driving method and circuit of an organic light emitting diode, applied to an array of a plurality of organic light emitting diode. The array has several rows and columns of organic light emitting diodes. The row and column corresponding to the organic light emitting selected to illuminate are selected. A first voltage is applied to the selected column, and a second voltage is applied to the selected row. The difference between the first and second voltages is larger than the conducting voltage of the organic light emitting diode, so that the light emitting diode can illuminate. A third voltage and a fourth voltages are applied to other rows and columns which are not connected to the selected organic light emitting diode to provide a reverse bias to all the remaining light emitting diodes.