Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: An optimized optical proximity correction modeling method comprises receiving a selection of a regression method, displaying regression parameters, receiving values for the displayed regression parameters, receiving a selection of an optimization method, displaying optimization parameters, receiving values for the displayed optimization parameters, and generating a optimized optical proximity correction output.

Abstract: An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

Abstract: An improved structure of LCD backlight module includes a diffuser, a reflective film and several light pipes, and the diffuser is attached at the back of an LCD panel; the reflective film is installed at the back of the diffuser with an appropriate distance apart; the light pipes are installed in parallel on an edge between the diffuser and the reflective film; an arc reflective layer is integrally formed in each light pipe; at least one light source is disposed on both ends of the light pipe, such that the light produced by the light source is guided by the reflective layer and evenly projected between the diffuser and the reflective film from the periphery, and some light pass through the diffuser directly and some light is reflected onto the diffuser by the reflective film, and the diffuser evenly spreads the light to produce a backlight for the LCD panel.

Abstract: A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Abstract: A stacked image sensor package contains an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: An efficient chip stacking structure is described that includes a leadframe having two surfaces to each of which can be attached stacks of chips. A chip stack can be formed by placing a chip active surface on a back surface of another chip. Electrical connections between chips and leads on the leadframe are facilitated by bonding pads on chip active surfaces and by via that extend from the bonding pads through the chips to the back surfaces.

Abstract: A thin stacked image sensor package containing an image sensor chip and a peripheral chip. A support pad for the peripheral chip adheres to a top surface of the peripheral chip, eliminating the need for a support member that otherwise would contribute to the thickness of the package. Thermal dissipation is enhanced by exposing surfaces including a back surface of the peripheral chip.

Abstract: An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.

Abstract: A securing device for shower head which has a bell-like body mounted with an inlet rod, a spherical rod, a covering cap, filter and water limiting plate characterized in that: a spraying panel is positioned below the interior of the body and has a circular face with a plurality of water outlet holes, the circumferential edge is provided with a plurality of slanting connection plates welded thereto, a scaling pad is mounted at the external of the spraying panel, the support rim is threaded at the center and is connected to a circular body, the bottom end of the inlet rod is externally threaded and is provided with a plurality of inlet holes, the lower section of the inlet rod is externally threaded and is mounted with an O-ring, the inlet rod and the spherical rod, the covering, the water leakage pad, filter and the water limiting plate are mounted and are then the support ring is screwed to the external threads at the lower section of the water inlet rod.