Patents by Inventor Chen-Tsung Chang

Chen-Tsung Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package and method of manufacturing the same
    Patent number: 11887967
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: January 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220028836
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei WU, Chien-Yuan TSENG, Meng-Jen WANG, Chen-Tsung CHANG, Chih-Fang WANG, Cheng-Han LI, Chien-Hao CHEN, An-Chi TSAO, Per-Ju CHAO
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11139274
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: October 5, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200251449
    Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.
    Type: Application
    Filed: January 31, 2020
    Publication date: August 6, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shang-Ruei Wu, Chien-Yuan Tseng, Meng-Jen Wang, Chen-Tsung Chang, Chih-Fang Wang, Cheng-Han Li, Chien-Hao Chen, An-Chi Tsao, Per-Ju Chao
  • Semiconductor package structure and encapsulating module for molding the same
    Patent number: 8198740
    Abstract: A semiconductor package structure and encapsulating module for molding the same and an encapsulating mold for molding the same are provided. The encapsulating mold is used for packaging a substrate having a chip so as to mold the substrate having the chip as a package structure. The encapsulating mold has a pressing surface, a smooth surface and a cavity. The smooth surface having a curvature radius is connected with the pressing surface and disposed at a mouth of the cavity. When the encapsulating mold and an encapsulating lower mold are jointed to hold the substrate, the pressing surface contacts and presses the substrate.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: June 12, 2012
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Chang Shen, Chen-Tsung Chang, Chih-Yuan Lin
  • SEMICONDUCTOR PACKAGE STRUCTURE AND ENCAPSULATING MODULE FOR MOLDING THE SAME
    Publication number: 20100258957
    Abstract: A semiconductor package structure and encapsulating module for molding the same and an encapsulating mold for molding the same are provided. The encapsulating mold is used for packaging a substrate having a chip so as to mold the substrate having the chip as a package structure. The encapsulating mold has a pressing surface, a smooth surface and a cavity. The smooth surface having a curvature radius is connected with the pressing surface and disposed at a mouth of the cavity. When the encapsulating mold and an encapsulating lower mold are jointed to hold the substrate, the pressing surface contacts and presses the substrate.
    Type: Application
    Filed: October 14, 2009
    Publication date: October 14, 2010
    Inventors: Cheng-Chang Shen, Chen-Tsung Chang, Chih-Yuan Lin