Abstract: A first protective layer is formed on a first die and a second die, and openings are formed within the first protective layer. The first die and the second die are encapsulated such that the encapsulant is thicker than the first die and the second die, and vias are formed within the openings. A redistribution layer can also be formed to extend over the encapsulant, and the first die may be separated from the second die.

Abstract: A semiconductor structure includes a substrate, and an active device and a passive device over the substrate. The active device is disposed in a first region of the substrate, and the passive device is disposed in a second region of the substrate. The semiconductor structure further includes a shielding structure and a passivation layer. The shielding structure includes a barrier layer and a ceiling layer. The barrier layer is on the passive device and the active device, and the ceiling layer is on the barrier layer. The passivation layer is under the barrier layer and covers a top surface of the passive device. An air cavity is defined by sidewalls of the barrier layer, a bottom surface of the ceiling layer, and the substrate.

Abstract: A multi-functional cutter includes a handle, a stationary lower jaw secured to the handle, a first blade secured to the stationary lower jaw, a pivotal upper jaw connected with the handle, a second blade secured to the pivotal upper jaw so that the first and second blades face each other, and a third blade mounted on the stationary lower jaw. The multi-functional cutter may include a frame formed on the handle for holding a spare blade. The multi-functional cutter may include a cover movably mounted on the frame for concealing the spare blade. The multi-functional cutter may include a light source mounted on the handle.