Patents by Inventor CHEN-TZU LIN

CHEN-TZU LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136291
    Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.
    Type: Application
    Filed: January 12, 2023
    Publication date: April 25, 2024
    Inventors: Hsiang-Ku SHEN, Chen-Chiu HUANG, Chia-Nan LIN, Man-Yun WU, Wen-Tzu CHEN, Sean YANG, Dian-Hao CHEN, Chi-Hao CHANG, Ching-Wei LIN, Wen-Ling CHANG
  • Publication number: 20240114614
    Abstract: Disclosed is a thermal conduction-electrical conduction isolated circuit board with a ceramic substrate and a power transistor embedded, mainly comprising: a dielectric material layer, a heat-dissipating ceramic block, a securing portion, a stepped metal electrode layer, a power transistor, and a dielectric material packaging, wherein a via hole is formed in the dielectric material layer, the heat-dissipating ceramic block is correspondingly embedded in the via hole, the heat-dissipating ceramic block has a thermal conductivity higher than that of the dielectric material layer and a thickness less than that of the dielectric material layer, the stepped metal electrode layer conducts electricity and heat for the power transistor, the dielectric material packaging is configured to partially expose the source connecting pin, drain connecting pin, and gate connecting pin of the encapsulated stepped metal electrode layer.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: HO-CHIEH YU, CHEN-CHENG-LUNG LIAO, CHUN-YU LIN, JASON AN CHENG HUANG, CHIH-CHUAN LIANG, KUN-TZU CHEN, NAI-HIS HU, LIANG-YO CHEN
  • Patent number: 9302313
    Abstract: The structure of a tube expander has a ring and a bearing in the body thereof. An axle goes through the body. A driving head is connected to the axle on the body. The bottom of the axle has a guiding pin and a tapered head. The driving head has an external thread so that it can be rotated into the internal thread of the ring or rotated in the opposite direction out of the internal thread. A compressible elastic element is disposed inside the body and mounted on the axle. The top end of the compressible elastic element urges against the bottom of the ring. The bottom of the compressible elastic element pushes the guiding pin downward so that the external thread becomes idle after being completely rotated out of the internal thread.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: April 5, 2016
    Inventor: Chen-Tzu Lin
  • Publication number: 20150321237
    Abstract: The structure of a tube expander has a ring and a bearing in the body thereof. An axle goes through the body. A driving head is connected to the axle on the body. The bottom of the axle has a guiding pin and a tapered head. The driving head has an external thread so that it can be rotated into the internal thread of the ring or rotated in the opposite direction out of the internal thread. A compressible elastic element is disposed inside the body and mounted on the axle. The top end of the compressible elastic element urges against the bottom of the ring. The bottom of the compressible elastic element pushes the guiding pin downward so that the external thread becomes idle after being completely rotated out of the internal thread.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 12, 2015
    Inventor: CHEN-TZU LIN