Patents by Inventor Chen Wai Samuel CHOW

Chen Wai Samuel CHOW has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240421074
    Abstract: An apparatus includes a resistor structure within a back end of line (BEOL) via level. The resistor structure includes a lower resistor film, a first insulating layer over the lower resistor film, an upper resistor film over the first insulating layer, and a second insulating layer over the upper resistor film. First and second upper metal lines are above the second insulating layer, a first end of the upper resistor film is coupled to the first upper metal line by a first upper via or contact, and a second end of the upper resistor film is coupled to the second upper metal line by a second upper via or contact. The apparatus may be a resistor or a thermistor of a semiconductor device.
    Type: Application
    Filed: June 16, 2023
    Publication date: December 19, 2024
    Inventors: Qiying WONG, Handoko LINEWIH, Phyllis Shi Ya LIM, Chen Wai Samuel CHOW, Yudi SETIAWAN