Patents by Inventor Chen-Wei HUNG
Chen-Wei HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240170381Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.Type: ApplicationFiled: February 1, 2024Publication date: May 23, 2024Inventors: Chun-Hsien HUANG, Peng-Fu HSU, Yu-Syuan CAI, Min-Hsiu HUNG, Chen-Yuan KAO, Ken-Yu CHANG, Chun-I TSAI, Chia-Han LAI, Chih-Wei CHANG, Ming-Hsing TSAI
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Publication number: 20240133421Abstract: An electronic device includes a monitor stand, a hinge mechanism, and an operation element. The hinge mechanism includes a back plate, a speed reduction assembly, and a friction assembly. The back plate is fixed to the monitor stand. The speed reduction assembly includes an input plate and a speed reduction member. The speed reduction member is arranged on the input plate. The friction assembly is arranged between the back plate and the input plate. The operation element is connected to the speed reduction member. A rotation center of the operation element coincides with an axis of the back plate and the speed reduction member are coaxially arranged.Type: ApplicationFiled: January 17, 2023Publication date: April 25, 2024Inventors: Chih-Wei KUO, Yu-Chun HUNG, Che-Yen CHOU, Chen-Wei TSAI, Hsiang-Wen HUANG
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Patent number: 11936418Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.Type: GrantFiled: April 27, 2021Date of Patent: March 19, 2024Assignee: KAIKUTEK INC.Inventors: Mike Chun-Hung Wang, Chun-Hsuan Kuo, Mohammad Athar Khalil, Wen-Sheng Cheng, Chen-Lun Lin, Chin-Wei Kuo, Ming Wei Kung, Khoi Duc Le
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Patent number: 11934027Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
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Patent number: 11929314Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.Type: GrantFiled: March 12, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Hsien Huang, Peng-Fu Hsu, Yu-Syuan Cai, Min-Hsiu Hung, Chen-Yuan Kao, Ken-Yu Chang, Chun-I Tsai, Chia-Han Lai, Chih-Wei Chang, Ming-Hsing Tsai
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Patent number: 11917923Abstract: A magnetoresistive random access memory (MRAM) structure, including a substrate and multiple MRAM cells on the substrate, wherein the MRAM cells are arranged in a memory region adjacent to a logic region. An ultra low-k (ULK) layer covers the MRAM cells, wherein the surface portion of ultra low-k layer is doped with fluorine, and dents are formed on the surface of ultra low-k layer at the boundaries between the memory region and the logic region.Type: GrantFiled: April 28, 2021Date of Patent: February 27, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Ching-Hua Hsu, Si-Han Tsai, Shun-Yu Huang, Chen-Yi Weng, Ju-Chun Fan, Che-Wei Chang, Yi-Yu Lin, Po-Kai Hsu, Jing-Yin Jhang, Ya-Jyuan Hung
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Patent number: 11482015Abstract: A method for recognizing a parking space for a vehicle and a parking assistance system are disclosed. An obstacle is identified from successive image frames captured when the vehicle is moving and a first boundary for the obstacle is generated by a Convolutional Neural Network (CNN) algorithm based on a position of the obstacle shown in each of the successive image frames. Distances between the moving vehicle and the obstacle are detected by ultrasonic sensors. A second boundary for the obstacle is generated by a distance modification module based on the distances between the vehicle and the obstacle. A periphery of the obstacle is defined by a periphery definition module. In view of the periphery of the obstacle, a parking space is thus recognized by a parking space recognition module. The parking process can be changed to a self-drive mode, and remotely controlled by a mobile device.Type: GrantFiled: August 9, 2019Date of Patent: October 25, 2022Assignee: oToBrite Electronics Inc.Inventors: Pi-Hau Shih, Wei Jing Wong, Chen-Wei Hung
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Patent number: 11201100Abstract: A solid-state storage device includes a housing, a wiring board and a semiconductor package unit. The housing is formed with a heat-dissipating recess thereon. The wiring board is fixed in the housing. One side of the semiconductor package unit is mounted on the wiring board, and the other side of the semiconductor package unit is embedded in the heat-dissipating recess. A top surface and lateral surfaces surrounding the top surface of the semiconductor package unit are all thermally connected to the housing in the heat-dissipating recess.Type: GrantFiled: May 22, 2018Date of Patent: December 14, 2021Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yu-Ting Shih, Chen-Wei Hung, Jia-Liang Chen
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Publication number: 20210042540Abstract: A method for recognizing a parking space for a vehicle and a parking assistance system are disclosed. An obstacle is identified from successive image frames captured when the vehicle is moving and a first boundary for the obstacle is generated by a Convolutional Neural Network (CNN) algorithm based on a position of the obstacle shown in each of the successive image frames. Distances between the moving vehicle and the obstacle are detected by ultrasonic sensors. A second boundary for the obstacle is generated by a distance modification module based on the distances between the vehicle and the obstacle. A periphery of the obstacle is defined by a periphery definition module. In view of the periphery of the obstacle, a parking space is thus recognized by a parking space recognition module. The parking process can be changed to a self-drive mode, and remotely controlled by a mobile device.Type: ApplicationFiled: August 9, 2019Publication date: February 11, 2021Inventors: Pi-Hau SHIH, Wei Jing WONG, Chen-Wei HUNG
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Publication number: 20190266416Abstract: A vehicle image system and a method for positioning vehicles using vehicle image are disclosed. The method comprises: capturing images from a surrounding environment of the vehicle to generate successive image data frames by at least one image capturer; receiving the successive image data frames from the at least one image capturer by a processing module having a power receiver location data describing a location of the power receiver relative to that of the vehicle; and generating an image data depicting the scene under the vehicle bottom and the portion of the scene of the surrounding environment blocked by the vehicle with the successive image data frames in real time after the vehicle moves by the processing module.Type: ApplicationFiled: May 14, 2019Publication date: August 29, 2019Inventors: Chen-Wei HUNG, Chung-Fang CHIEN
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Publication number: 20190229036Abstract: A solid-state storage device includes a housing, a wiring board and a semiconductor package unit. The housing is formed with a heat-dissipating recess thereon. The wiring board is fixed in the housing. One side of the semiconductor package unit is mounted on the wiring board, and the other side of the semiconductor package unit is embedded in the heat-dissipating recess. A top surface and lateral surfaces surrounding the top surface of the semiconductor package unit are all thermally connected to the housing in the heat-dissipating recess.Type: ApplicationFiled: May 22, 2018Publication date: July 25, 2019Inventors: Yu-Ting SHIH, Chen-Wei HUNG, Jia-Liang CHEN