Abstract: A heat dissipation substrate structure includes a multilayer circuit board including a core board and build-up boards, a heat conduction layer, a cavity structure, bonding pads, and vias. The heat conduction layer is disposed within the core board, or on a surface of the core board, or on a surface of one of the build-up boards. The cavity structure is in the multilayer circuit board with respect to the heat conduction layer and exposes a first surface of the heat conduction layer. The bonding pads are on the surface of the multilayer circuit board at a side of a second surface of the heat conduction layer. The portions of the vias are connected to portions of the bonding pads and the heat conduction layer. Accordingly, heat flow can be distributed via a heat dissipation path from the bonding pads through the vias to the heat conduction layer.

Abstract: A heat dissipation substrate structure includes a multilayer circuit board including a core board and build-up boards, a heat conduction layer, a cavity structure, bonding pads, and vias. The heat conduction layer is disposed within the core board, or on a surface of the core board, or on a surface of one of the build-up boards. The cavity structure is in the multilayer circuit board with respect to the heat conduction layer and exposes a first surface of the heat conduction layer. The bonding pads are on the surface of the multilayer circuit board at a side of a second surface of the heat conduction layer. The portions of the vias are connected to portions of the bonding pads and the heat conduction layer. Accordingly, heat flow can be distributed via a heat dissipation path from the bonding pads through the vias to the heat conduction layer.

Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

Abstract: A chip package circuit board module including a circuit board and at least one original chip is provided. The circuit board includes at least one first pad, at least one second pad and at least one substitute pad. The at least one second pad is located besides the at least one first pad and separated from the at least one first pad. The at least one substitute pad is adjacent to the at least one second pad and separated from the at least one first pad and the at least one second pad. The at least one original chip is connected to the at least one first pad and at least one the second pad, respectively. A total width of a portion corresponding to each of the at least one second pad and a portion corresponding to the substitute pad adjacent to the second pad of the first pad is greater than or equal to twice a width of the original chip.

Abstract: A chip package circuit board module includes a circuit board and an original chip. The circuit board includes a first pad and a second pad disposed besides the first pad and separated from the first pad. The original chip is connected to the first pad and the second pad. A width of the original chip is W1, a total width of the first pad is P1, and a total width of the second pad is P2. The total width P1 of the first pad is larger than twice of the width W1 of the original chip, and the total width P2 of the second pad is larger than twice of the width W1 of the original chip.

Abstract: A circuit board includes a core layer, at least one metal contraposition component and at least one build-up circuit structure. The metal contraposition component is disposed on the core layer. The build-up circuit structure is disposed on the core layer and covers the metal contraposition component by using a position of the metal contraposition component as a fiducial mark.

Abstract: Method and apparatus for self-checking and self-correcting memory states of a programmable resource is described. Programmable resource of an integrated circuit has a first core and a second core instantiated therein. A first internal configuration port and a second internal configuration port of the integrated circuit are respectively connected to the first core and the second core. The second core is coupled to the first core for monitoring operation of the first core with the second core, and the second core is configured to obtain control responsive to a failure of the first core or the first internal configuration port for a self-correcting mode.

Abstract: Various approaches for generating an implementation of an electronic circuit design are disclosed. In one approach, a software portion of the design is compiled into software that is executable by a hard processor disposed on a single semiconductor chip with resources of an programmable logic device (PLD). A first synthesized version of a hardware portion of the design is generated for the PLD. A synthesized memory scrubber having an empty block for an address counter is generated, as well as a triple modular redundant (TMR) address counter. The memory in the first synthesized version of the hardware portion of the design is replaced with the memory scrubber, and a complete set of netlists is generated, including a TMR hardware portion of the design and a single instance of the synthesized memory scrubber. A configuration bitstream is generated from the complete set of netlists and stored for later use.

Abstract: A configuration management system is disclosed. For example, an embodiment of the present invention provides a configuration management system comprising a configuration storage device containing configuration data, and an integrated circuit, coupled to the configuration storage device, where the integrated circuit comprising at least one configuration management controller for managing a configuration of the integrated circuit in accordance with the configuration data, where the integrated circuit is deployed in a radiation tolerant device.

Abstract: A configuration management system is disclosed. For example, an embodiment of the present invention provides a configuration management system comprising at least one configuration storage device containing configuration data, and a plurality of integrated circuits, coupled to said at least one configuration storage device, where the plurality of integrated circuits are coupled in a loop, where each of the plurality of integrated circuits comprising at least one configuration management controller for managing a configuration of another integrated circuit in the loop in accordance with the configuration data, where the plurality of integrated circuits is deployed in at least one radiation tolerant device.

Abstract: A method of configuring an integrated circuit having programmable logic including the steps of generating a configuration bitstream in accordance with a configuration setup, storing the configuration bitstream into a portion of a memory, configuring the programmable logic of the integrated circuit with a first configuration portion of the configuration bitstream of the memory, monitoring the integrated circuit for at least one configuration error generated in response to an event upset, reconfiguring at least a portion of the programmable logic of the integrated circuit with a second configuration portion of the configuration bitstream in response to the at least one configuration error generated. The integrated circuit may operate normally during the process of reconfiguring the at least a portion of the programmable logic.