Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a fixed portion, a movable portion, an electromagnetic driving assembly and an elastic member. The fixed portion has a base and a frame that is disposed on the base. The movable portion is movable relative to the fixed portion, and includes a carrier for carrying an optical member with an incident optical axis. The carrier includes a body and a sidewall that extends along the edge of the body, wherein the carrier further includes a first stopping portion and a second stopping portion protruding towards the fixed portion. The electromagnetic driving assembly drives the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion via the elastic member.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: An optical system is provided. The optical system is used for disposing on an electronic device. The optical system includes a movable portion, a fixed portion, a first driving assembly, and a support module. The movable portion is used for connecting to an optical module. The fixed portion is affixed on the electronic device, and the movable portion is movable relative to the fixed portion. The first driving assembly is used for driving the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion through the support module.

Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.

Abstract: An optical path folding element includes a main body, a light absorption film layer and a matte structure. The main body has optical surface including an incident surface, a reflective surface and an emitting surface. A light enters into the optical folding element through the incident surface. The reflective surface reflects the light so as to change a traveling direction thereof. The light exits the optical folding element through the emitting surface. The light absorbing film layer is configured to reduce reflectance and provided adjacent to at least part of the optical surface, and the light absorbing film layer is in physical contact with the main body. The matte structure is disposed adjacent to at least part of the optical surface. The matte structure provides an undulating profile on a surface of the optical path folding element, and the matte structure is formed in one-piece with the main body.

Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

Abstract: A method for identifying video signal source is provided. The method includes the following steps. A first identification code is assigned to a first transmitter device by a receiver control unit of a receiver device. A first video data is transmitted by the first transmitter device. The first video data and a first identification image corresponding to the first identification code are combined as a first combined video data by the receiver control unit. The first combined video data is outputted to a display device by the receiver control unit.

Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: An embodiment is a package including a package substrate and a package component bonded to the package substrate, the package component including an interposer, an optical die bonded to the interposer, the optical die including an optical coupler, an integrated circuit die bonded to the interposer adjacent the optical die, a lens adapter adhered to the optical die with a first optical glue, a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die, and an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such that an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.

Abstract: A semiconductor device structure and a manufacturing method thereof are provided. The semiconductor device structure includes a semiconductor substrate, semiconductor channel sheets disposed over the semiconductor substrate, and source and drain regions located beside the semiconductor channel sheets. A gate structure is disposed between the source and drain regions and disposed over the semiconductor channel sheets. The gate structure laterally surrounds the semiconductor channel sheets. The gate structure includes a top gate electrode structure disposed above the semiconductor channel sheets, and lower gate electrode structures disposed between the semiconductor channel sheets. Sidewall spacers are disposed between the gate structure and source and drain regions, and the sidewall spacers located next to the top gate electrode structure have slant sidewalls.

Abstract: The present invention relates to an electrochemical machining apparatus for gear outline, which is used for trimming the gear outline of the gear part of a workpiece and comprises a first moving mechanism, a second moving mechanism, a cathode electrode, and a gear alignment member. The cathode electrode is disposed at the first moving mechanism. The second moving mechanism is connected with the gear alignment member. The gear alignment member includes a plurality of alignment gears for aligning the location of a plurality of teeth of the gear part of the workpiece. Thereby, the plurality of teeth of the workpiece may correspond to the cathode electrode. Then, the cathode electrode may perform electrochemical machining on the plurality of teeth, and thus, trimming the outline of the plurality of teeth.

Abstract: The present invention relates to an electrochemical machining device, which comprises a machining electrode, a driving module, a spacer, and a conductive electrode. The machining electrode includes an electrochemical machining zone. The driving module drives the machining electrode. The spacer is adjacent to the machining electrode. The conductive electrode is adjacent to the spacer. The spacer spaces the conductive electrode and the machining electrode. When the electrochemical machining device performs electrochemical processes, the driving module drives the machining electrode and moves a machining surface of the machining electrode.

Abstract: The present invention relates to a transmission apparatus, which comprises a base, a transmission module, a first protection sleeve, and a second protection sleeve. The transmission module is disposed on the base and includes a moving unit. The first protection sleeve is disposed around the outer periphery of the transmission module and on the base. One end of the second protection sleeve is covered by the first protection sleeve. The second protection sleeve is disposed around the moving unit and moves linkedly along the moving unit. Thereby, the transmission apparatus according to the present invention may protection the transmission module.

Abstract: The present invention provides an inductive electrochemical machining device, which comprises a base, an inductive machining electrode, and a negative cleaning module. The base includes a workpiece machining zone. The inductive machining electrode is disposed on the base and corresponds to said workpiece machining zone. The negative cleaning module is opposing to the inductive machining electrode. When the inductive machining electrode performs electrochemical machining, the generated induction current may be used for machining. In addition, the surface of the inductive machining electrode may be cleaned concurrently by the negative cleaning module.

Abstract: The present invention relates to an electrochemical processing system. The electrochemical processing system comprises a belt electrode and a clean module. The clean module is corresponding to one side of the belt electrode. The electrochemical processing system may be used for cleaning the surface of the belt electrode during an electrochemical process.

Abstract: The present invention relates to a continuous electrochemical processing apparatus, which comprises an electrode transport module, an electrode module, and a material-tape conveying mechanism. The electrode module is connected with the electrode transport module and includes an electrode. The material-tape conveying mechanism is disposed corresponding to the electrode module and used for conveying a material tape. Thereby, the electrode of the electrode module may continuously electrochemical process the material tape.

Abstract: A driving circuit includes: a switching element having a first terminal to receive an input voltage, and a second terminal; an inductor coupled to the second terminal of the switching element; a switch and a current sensing element coupled in series to the second terminal of the switching element; and a control module compensating a voltage sensed by the current sensing element based on at least one of the input voltage and an output voltage across the switching element and the inductor to generate a compensated signal, and switching the switch from an ON state to an OFF state when the compensated signal exceeds a reference threshold for a delay time.

Abstract: A driving circuit includes: a switching element having a first terminal to receive an input voltage, and a second terminal; an inductor coupled to the second terminal of the switching element; a switch and a current sensing element coupled in series to the second terminal of the switching element; and a control module compensating a voltage sensed by the current sensing element based on at least one of the input voltage and an output voltage across the switching element and the inductor to generate a compensated signal, and switching the switch from an ON state to an OFF state when the compensated signal exceeds a reference threshold for a delay time.