Abstract: An optical component is provided. The optical component includes a silicon-based body including a bottom wall, a first side wall, a second side wall, and a micro lens structure. The first side wall is located on a first side of the silicon-based body and perpendicular to the bottom wall. The second side wall is located on a second side of the silicon-based body opposite to the first side, and forms an acute angle with the bottom wall. The micro lens structure is formed on the first side wall. The optical component further includes a protection layer formed over the first side wall and the micro lens structure.

Abstract: A multimedia system is provided. The multimedia system includes a plurality of transmission devices and a receiving-end device. Multiple transmission devices respectively has a microphone. The receiving-end device is coupled to the transmission devices. When the microphone of one of the transmission devices is enabled, the receiving-end device outputs at least one control signal to at least another one of the transmission devices to disable the microphone of the at least another one of the transmission devices.

Abstract: A method according to the present disclosure includes receiving a workpiece including a gate structure, a first source/drain (S/D) feature, a second S/D feature, a first dielectric layer over the gate structure, the first S/D feature, the second S/D feature, a first S/D contact over the first S/D feature, a second S/D contact over the second S/D feature, a first etch stop layer (ESL) over the first dielectric layer, and a second dielectric layer over the first ESL, forming a S/D contact via through the second dielectric layer and the first ESL to couple to the first S/D contact, forming a gate contact opening through the second dielectric layer, the first ESL, and the first dielectric layer to expose the gate structure, and forming a common rail opening adjoining the gate contact opening to expose the second S/D contact, and forming a common rail contact in the common rail opening.

Abstract: A package includes a routing structure including a first waveguide and a photonic device; an electronic die bonded to the routing structure, wherein the electronic die is electrically connected to the photonic device; and an optical coupling structure bonded to the routing structure adjacent the electronic die, wherein the optical coupling structure includes a first lens in a first side of a substrate.

Abstract: A package structure includes a plurality of semiconductor dies, an insulating encapsulant, a redistribution layer and a plurality of connecting elements. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant in a build-up direction and electrically connected to the plurality of semiconductor dies, wherein the redistribution layer includes a plurality of conductive lines, a plurality of conductive vias and a plurality of dielectric layers alternately stacked, and a lateral dimension of the plurality of conductive vias increases along the build-up direction. The connecting elements are disposed in between the redistribution layer and the semiconductor dies, wherein the connecting elements includes a body portion joined with the semiconductor dies and a via portion joined with the redistribution layer, wherein a lateral dimension of the via portion decreases along the build-up direction.

Abstract: The present disclosure relates to an integrated chip including a three-dimensional memory array. The three-dimensional memory array includes a first local line and a second local line that are elongated vertically, a first memory cell extending between the first local line and the second local line, and a second memory cell directly under the first memory cell, extending between the first local line and the second local line, and coupled in parallel with the first memory cell. The first memory cell is coupled to a first word line and the second memory cell is coupled to a second word line. The first word line and the second word line are elongated horizontally. A first global line is disposed at a first height and is elongated horizontally. A first selector extends vertically from the first local line to the first global line.

Abstract: In some embodiments, the present disclosure relates to an image sensor integrated chip. The image sensor integrated chip includes a floating diffusion node disposed within a substrate. A plurality of photodetectors are disposed around the floating diffusion node, as viewed in a plan-view, and a plurality of transfer transistor gates are disposed between the floating diffusion node and the plurality of photodetectors, as viewed in the plan-view. One or more transistor gates are disposed on the substrate. A device isolation structure extends in a closed loop around the one or more transistor gates. The device isolation structure is laterally offset from the floating diffusion node.

Abstract: A method and a circuit system for driving a nebulizer are provided. When the nebulizer receives acoustic waves, a control circuit extracts audio signals from the acoustic waves. Afterwards, the control circuit determines if the audio signals are within a predetermined frequency range, and can determine whether or not to drive a circuit to produce an aerosol based on the audio signals. Further, a volume of the acoustic waves can also be used to determine whether or not to produce the aerosol, and also determine an output rate of the aerosol. The circuit system of the nebulizer includes an audio receiver for receiving the acoustic waves, an aerosol generator for producing the aerosol, and the control circuit used to control a driving circuit of the aerosol generator to drive a vibrational element to produce the aerosol through vibration in response to the audio signals and the volume.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A transmitter device adapted to be coupled to an image providing device and a receiver device includes first and second conversion units, a wireless module, and a processing unit. The first conversion unit and the second conversion unit are configured to be coupled to the image providing device through an HDMI transmission cable and a Type-C transmission cable, respectively, so as to respectively receive a first video and audio stream and a second video and audio stream provided by the image providing device. The wireless module is connected to the receiver device through wireless communication. The processing unit preferentially selects the first conversion unit to receive a first video and audio signal output by converting the first video and audio stream by the first conversion unit and transmits the first video and audio signal to the receiver device through the wireless module.

Abstract: A package structure includes a plurality of semiconductor dies, an insulating encapsulant, a redistribution layer and a plurality of connecting elements. The insulating encapsulant is encapsulating the plurality of semiconductor dies. The redistribution layer is disposed on the insulating encapsulant in a build-up direction and electrically connected to the plurality of semiconductor dies, wherein the redistribution layer includes a plurality of conductive lines, a plurality of conductive vias and a plurality of dielectric layers alternately stacked, and a lateral dimension of the plurality of conductive vias increases along the build-up direction. The connecting elements are disposed in between the redistribution layer and the semiconductor dies, wherein the connecting elements includes a body portion joined with the semiconductor dies and a via portion joined with the redistribution layer, wherein a lateral dimension of the via portion decreases along the build-up direction.

Abstract: In some embodiments, the present disclosure relates to method for forming an image sensor integrated chip. The method includes forming a first photodetector region in a substrate and forming a second photodetector region in the substrate. A floating diffusion node is formed in the substrate between the first photodetector region and the second photodetector region. A pick-up well contact region is formed in the substrate. A first line intersects the floating diffusion node and the pick-up well contact region. One or more transistor gates are formed on the substrate. A second line that is perpendicular to the first line intersects the pick-up well contact region and the one or more transistor gates.

Abstract: An optical system is provided and includes a fixed assembly, a movable element and a driving module. The fixed assembly has a main axis. The movable element is movable relative to the fixed assembly and coupled to a first optical element. The driving module is configured to drive the movable element to move relative to the fixed assembly. The driving module includes a first driving assembly and a second driving assembly, and the first driving assembly and the second driving assembly are individually operable.

Abstract: An image sharing and conference participant identification method includes providing a first multimedia adapter device and a second multimedia adapter device, generating a link control signal after the first multimedia adapter device is triggered, transmitting the link control signal from the first multimedia adapter device to the second multimedia adapter device directly or through a server according to a link list, establishing a link between the first multimedia adapter device and the second multimedia adapter device, and transmitting first image data from the first multimedia adapter device to the second multimedia adapter device through the link for integrating the first image data and second image data by the second multimedia adapter device to generate sharing image data.

Abstract: The present invention relates to an electrochemical machining apparatus for gear outline, which is used for trimming the gear outline of the gear part of a workpiece and comprises a first moving mechanism, a second moving mechanism, a cathode electrode, and a gear alignment member. The cathode electrode is disposed at the first moving mechanism. The second moving mechanism is connected with the gear alignment member. The gear alignment member includes a plurality of alignment gears for aligning the location of a plurality of teeth of the gear part of the workpiece. Thereby, the plurality of teeth of the workpiece may correspond to the cathode electrode. Then, the cathode electrode may perform electrochemical machining on the plurality of teeth, and thus, trimming the outline of the plurality of teeth.

Abstract: The present invention relates to an electrochemical machining device, which comprises a machining electrode, a driving module, a spacer, and a conductive electrode. The machining electrode includes an electrochemical machining zone. The driving module drives the machining electrode. The spacer is adjacent to the machining electrode. The conductive electrode is adjacent to the spacer. The spacer spaces the conductive electrode and the machining electrode. When the electrochemical machining device performs electrochemical processes, the driving module drives the machining electrode and moves a machining surface of the machining electrode.

Abstract: The present invention provides an inductive electrochemical machining device, which comprises a base, an inductive machining electrode, and a negative cleaning module. The base includes a workpiece machining zone. The inductive machining electrode is disposed on the base and corresponds to said workpiece machining zone. The negative cleaning module is opposing to the inductive machining electrode. When the inductive machining electrode performs electrochemical machining, the generated induction current may be used for machining. In addition, the surface of the inductive machining electrode may be cleaned concurrently by the negative cleaning module.

Abstract: The present invention relates to a transmission apparatus, which comprises a base, a transmission module, a first protection sleeve, and a second protection sleeve. The transmission module is disposed on the base and includes a moving unit. The first protection sleeve is disposed around the outer periphery of the transmission module and on the base. One end of the second protection sleeve is covered by the first protection sleeve. The second protection sleeve is disposed around the moving unit and moves linkedly along the moving unit. Thereby, the transmission apparatus according to the present invention may protection the transmission module.

Abstract: The present invention relates to a continuous electrochemical processing apparatus, which comprises an electrode transport module, an electrode module, and a material-tape conveying mechanism. The electrode module is connected with the electrode transport module and includes an electrode. The material-tape conveying mechanism is disposed corresponding to the electrode module and used for conveying a material tape. Thereby, the electrode of the electrode module may continuously electrochemical process the material tape.

Abstract: The present invention relates to an electrochemical processing system. The electrochemical processing system comprises a belt electrode and a clean module. The clean module is corresponding to one side of the belt electrode. The electrochemical processing system may be used for cleaning the surface of the belt electrode during an electrochemical process.