Patents by Inventor Chen Wen Ching

Chen Wen Ching has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040240004
    Abstract: An image sensor module includes a printed circuit board (PCB) having a window defined therein and extending through the PCB. The inner periphery of the window is coated with a shelter. The PCB includes multiple leads formed thereon around the window and each lead divided into an inner lead and an outer lead. An image sensing chip is electrically connected to the PCB and includes multiple solder pad formed thereon. Each solder pad aligns with and electrically connected to a corresponding one of the inner leads. A lens set is mounted on the PCB and includes a holder surrounded the window and corresponding to a sensing area of the image sensing chip, wherein the peripheries between the holder, the PCB and the image sensing chip are underfilled with stabilizer to form an airtight condition between the holder, the PCB and the image sensing chip.
    Type: Application
    Filed: May 30, 2003
    Publication date: December 2, 2004
    Inventor: Chen Wen Ching