Abstract: The disclosure provides a method for manufacturing an electronic package structure, including disposing on a carrier an electronic component and a conductive frame including a plurality of conductive pads and supporting parts; and covering the electronic component and the supporting parts of the conductive frame with an encapsulating layer while allowing the conductive pads to be exposed from the encapsulating layer, thereby increasing the efficiency and reducing the cost of manufacturing processes with the design of the conductive frame. The disclosure further provides the electronic package structure as described above.

Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

Abstract: An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.

Abstract: A network device communicating with a digital clock supply (DCS), a first network, and a second network, includes an input port, a parsing module, and a synthesis module. The input port receives a digital clock signal from the DCS. The parsing module parses the digital clock signal into a plurality of digital clock signals with different frequencies. The synthesis module uses the digital clock signals to synthesize a new digital clock signal. Phase of the new digital clock signal is the same as that of the digital clock signal from the DCS.

Abstract: A jitter-less phase detector in a clock recovery circuit is disclosed. A first control signal generating circuit generates a first control signal by inverting and delaying input data signals through half clock. A second control signal generating circuit generates a high level second control signal when the data signal changes. A phase comparator generates an up signal having a high-level from the falling edge of the first control signal to the falling edge of the second control signal, and generates a down signal having a high-level from the falling edge of the second control signal to the falling edge of the first control signal, so as to control a pair of current sources to selectively discharge and charge a capacitor.