Patents by Inventor Chen-Xi YU

Chen-Xi YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods of applying materials to components
    Patent number: 11731224
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: August 22, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Tsang-I Tsai, Yi-Shen Lin, Min-Wei Hsu, Chen-Xi Yu
  • Systems And Methods Of Applying Materials To Components
    Publication number: 20220023984
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Application
    Filed: October 8, 2021
    Publication date: January 27, 2022
    Inventors: Tsang-I TSAI, Yi-Shen LIN, Min-Wei HSU, Chen-Xi YU
  • Systems and methods of applying materials to components
    Patent number: 11141823
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: October 12, 2021
    Assignee: Laird Technologies, Inc.
    Inventors: Tsang-I Tsai, Yi-Shen Lin, Min-Wei Hsu, Chen-Xi Yu
  • SYSTEMS AND METHODS OF APPLYING MATERIALS TO COMPONENTS
    Publication number: 20190329367
    Abstract: Disclosed are systems for applying materials to components. The system comprises a tool operable for transferring a portion of a material from a supply of the material to a component. A first portion of the tool may be configured for cutting along a side or edge of the portion of the material. A second portion of the tool may be configured for tamping, pressing, or pushing against the portion of the material to cause uncut sides or edges of the portion of the material attached to the supply of the material to be torn, severed, detached, or separated from the supply of the material.
    Type: Application
    Filed: May 10, 2018
    Publication date: October 31, 2019
    Inventors: Tsang-I TSAI, Yi-Shen LIN, Min-Wei HSU, Chen-Xi YU