Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

Abstract: A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: This invention provides a method applied for the new dynamic arc radiotherapy treatment planning to calculate an optimal arc angle. With this invention, an operator without rich experience is able to reach the expected low dose in lungs easily and quickly. This invention can not only estimate the distribution of low radiation dose in lungs but also reduce the shortcomings like consumption of time and inaccuracy caused by manual trial and error.

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: A video coding mechanism is disclosed. The mechanism includes at least one pre-encoder configured to pre-encode a received input video signal, and output a pre-encoded video signal. The mechanism also includes an encoder configured to obtain the pre-encoded video signal from the pre-encoder, and encode the pre-encoded video signal as a bitstream for transmitting the bitstream to decoder for decoding.

Abstract: An apparatus including a memory operably coupled to a processor. The processor is configured to determine whether to use an intra smoothing filter for a rectangular prediction unit (PU), wherein a width of the rectangular PU is different from a height of the rectangular PU.

Abstract: The application discloses a tunneling field-effect transistor, including: a substrate layer; a rectangular semiconductor strip formed on an upper surface of the substrate layer, where the rectangular semiconductor strip includes a first source region, a first channel region, a drain region, a second channel region, and a second source region that are disposed in sequence along a first direction; a first gate dielectric layer covering an outer surface of a first part of the first source region and a second gate dielectric layer covering an outer surface of a third part of the second source region.

Abstract: A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the gold bump, a second intermetallic layer of copper and gold between the copper ball bond and the gold bump, a copper wire extending from the copper ball bond to the conductive pad, a stitch bond between the copper wire and the conductive pad.

Abstract: A voltage regulation circuit includes a first comparison and control unit and a second comparison and control unit. The first comparison and control unit is connected to a first switch unit, determine a first bias voltage based on a first output voltage, a first reference voltage, and a second reference voltage, and control a value of an equivalent resistance of the first switch unit using the first bias voltage. The second comparison and control unit is connected to a third switch unit and the second switch unit, determine a second bias voltage based on the first output voltage, a second output voltage, and a third reference voltage, and control values of equivalent resistances of the third switch unit and the second switch unit using the second bias voltage.

Abstract: A voltage regulation circuit includes a first comparison and control unit and a second comparison and control unit. The first comparison and control unit is connected to a first switch unit, determine a first bias voltage based on a first output voltage, a first reference voltage, and a second reference voltage, and control a value of an equivalent resistance of the first switch unit using the first bias voltage. The second comparison and control unit is connected to a third switch unit and the second switch unit, determine a second bias voltage based on the first output voltage, a second output voltage, and a third reference voltage, and control values of equivalent resistances of the third switch unit and the second switch unit using the second bias voltage.

Abstract: A voltage regulation circuit includes a first comparison and control unit and a second comparison and control unit. The first comparison and control unit is connected to a first switch unit, determine a first bias voltage based on a first output voltage, a first reference voltage, and a second reference voltage, and control a value of an equivalent resistance of the first switch unit using the first bias voltage. The second comparison and control unit is connected to a third switch unit and the second switch unit, determine a second bias voltage based on the first output voltage, a second output voltage, and a third reference voltage, and control values of equivalent resistances of the third switch unit and the second switch unit using the second bias voltage.

Abstract: A video coding mechanism is disclosed. The mechanism includes at least one pre-encoder configured to pre-encode a received input video signal, and output a pre-encoded video signal. The mechanism also includes an encoder configured to obtain the pre-encoded video signal from the pre-encoder, and encode the pre-encoded video signal as a bitstream for transmitting the bitstream to decoder for decoding.

Abstract: A phase shifter, a quantum logic gate apparatus, an optical quantum computing apparatus, and a phase shift method, where the phase shifter includes an optical resonant cavity and a quantum point, where a resonance frequency of the optical resonant cavity is ?c, the quantum point is located in the optical resonant cavity, and a transition frequency of the quantum point is ?x, the quantum point and the optical resonant cavity are coupled to form a coupled system, and a transition energy difference of the coupled system is determined by ?c, ?x, and a coupling strength between the quantum point and the optical resonant cavity (g), and ?x is set.

Abstract: A method for non-uniform mapping for quantization matrix coefficients between different sizes of quantization matrices in image/video coding includes obtaining a first quantization matrix and identifying a second quantization matrix to be formed therefrom. The second quantization matrix is a factor of two larger than the first quantization matrix. The second quantization matrix is populated with values from the first matrix through non-uniform mapping of the first quantization matrix. Non-uniform mapping to populate the second quantization matrix includes directly mapping values of all or a portion of the first quantization matrix into a most upper left portion of the second quantization matrix and mapping up-sampling values of the first quantization matrix into a remaining portion of the second quantization matrix.

Abstract: This invention provides a method applied for the new dynamic arc radiotherapy treatment planning to calculate an optimal arc angle. With this invention, an operator without rich experience is able to reach the expected low dose in lungs easily and quickly. This invention can not only estimate the distribution of low radiation dose in lungs but also reduce the shortcomings like consumption of time and inaccuracy caused by manual trial and error.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for performing intra coding predictions. An intra-coding process applied to pixels in a frame of media is determined. The intra-coding process is determined whether to corresponding to at least one of most probable modes. In response to determining the intra-coding process does not correspond to the at least one of the most probable modes, four angular prediction modes are extracted from a list of prediction modes. A set of candidates based on the four angular prediction modes are determined. A pre-defined order of the set of candidates is determined, wherein each candidate mode of the set of candidate modes is included in a ranked order and signaled with a particular fixed length coding, and wherein a length of the particular fixed length coding increases based on the pre-defined order of the set of candidate modes.

Abstract: An apparatus including a memory operably coupled to a processor. The processor is configured to determine whether to use an intra smoothing filter for a rectangular prediction unit (PU), wherein a width of the rectangular PU is different from a height of the rectangular PU.

Abstract: A method for forming a ball bond for an integrated circuit formed on a semiconductor die includes forming a ball at a first send of a conductive wire inserted in a capillary tool and lowering the capillary tool toward a pad on the semiconductor die positioned on a support surface. The method further includes moving, using a motor, the support surface relative to the capillary tool to thereby bond the ball, without using ultrasound, to the pad and then raising the capillary tool.